2Q05^R90R________ 五、發明說明（1 ) 【發明所屬之技術領域】 本發明係關於一種散熱器及其製造方法，特別係關於 一種應用於電子元件散熱之免焊接式散熱器及其製造方法 【先前技術】 隨著電子資訊產業快速發展’中央處理器等電孑元件 處理能力日益加強，產生之熱量不斷增加，其所配用之散 熱器也在不斷改良。人們均知，在同等基座面積下，散熱 片數量越多且散熱片越大時則散熱效果越好，即散熱器表 面積越大則散熱效果越好。理論上散熱片厚度越薄越好， 這樣可以*提高單位基座面積上散熱片之數量，增力ϋ散熱器 表面積；但較薄散熱片不易以一體成型方式製造，因此散 熱片與基座間之組合方式對於提高散熱器之散熱性能極為 重要。 中國大陸專利公告第2 5 34 773Υ號揭露—種焊接式散熱 器’該散熱器包括一基座及設置於基座上之散熱片維，基 座與散熱片組間通過焊接接合。這種散熱器由於散熱片與 ^座分別製造故散熱片可做得較薄，較大地 熱器散 热面積，但惶士 日 队，、 散熱片，影"面熱阻較大，不利於熱量從基座傳遞給 接合不利=二，熱效果，且散熱片與基座間通過焊接方法 一、人夏生產· ，包括二基，專利公告第3 5 3 5 1 6號揭露一種嵌插式散熱器 平行其側緣If —組散熱片。該基座一側板面上設有複數 忝槽’各插槽分別設置有一散熱片，相鄰插2Q05 ^ R90R ________ V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a heat sink and a manufacturing method thereof, and more particularly, to a solderless heat sink and a manufacturing method for heat dissipation of electronic components [previously] Technology] With the rapid development of the electronic information industry, the processing capabilities of electronic components such as central processing units have been increasingly strengthened, the heat generated has been increasing, and the radiators used in them have also been continuously improved. It is known that under the same base area, the larger the number of heat sinks and the larger the heat sink, the better the heat dissipation effect, that is, the larger the surface area of the heat sink, the better the heat dissipation effect. Theoretically, the thinner the thickness of the heat sink is, the better. This can increase the number of heat sinks per unit base area and increase the surface area of the heat sink. However, thinner heat sinks are not easy to be manufactured in an integrated molding method. The combination method is extremely important to improve the heat dissipation performance of the radiator. Mainland China Patent Bulletin No. 2 5 34 773Υ discloses a welding heat sink. The heat sink includes a base and a heat sink dimension provided on the base. The base and the heat sink group are joined by welding. Because this heat sink is manufactured separately from the heat sink and the heat sink, the heat sink can be made thinner and the heat sink has a larger heat sink area. However, the heat sink, heat sink, and surface heat resistance are large, which is not conducive to heat. Passing from the base to the joint is not good = two, the thermal effect, and the welding method between the heat sink and the base is produced by Renxia, including the two bases, Patent Bulletin No. 3 5 3 5 1 6 discloses a plug-in radiator Parallel to its side edges If — group of heat sinks. A plurality of grooves are provided on one side of the base plate. Each slot is provided with a heat sink, and adjacent slots are provided.
900S9R90R 五、發明說明（2) 槽間均形成 一板體往其 熱片使之固 較薄從而增 接合，散熱 給散熱片而 都較大時， 製造難度與 為使散 介面熱阻小 上述常用¥ 種散熱ρ積 器已成為急 【内容】 本發明 免焊接式散 本發明 側設有複數 彎折而出之 本發明 座，該基座 散熱片包括 沿平行基座 合槽内並與 槽間部，每隔一槽間部設有一 v型槽，以供 中央衝壓而變形外開，以擠抵槽間部兩側之散 定於插槽内。這種散熱器之散熱片也可以做得 大散熱面積，但其散熱片是以擠抵方式與基座 片與基座間接觸面積較小不易將熱量從基座傳 影響散熱效果，另一方面，當鰭片密度、高度 衝壓V型槽之板體易與散熱片產生干涉，增加 成本。 熱器散熱效果增強，使散熱器散熱表面積大、 ，且散熱器製造上應追求製造方便、成本低， 熱器均有其缺點無法彌補。為此，如何提供一 大、介面熱阻小、製造方便、成本低廉之散熱 待解決之問題。 之目的在於提供一種製程簡單、散熱效果好之 熱器及其製造方法。 之散熱器包括一基座及複數散熱片。該基座一 接合槽，散熱片包括一散熱部及從散熱部底端 接合部，接合部與接合槽干涉配合。 之’散熱器之製造方法包括以下步驟：提供一基 一側設有複數接合槽；提供複數散熱片，每一 一散熱部及由散熱部底端彎折而出之接合部； 方向衝壓散熱片之接合部，使接合部容置於接 接合槽干涉配合。900S9R90R 5. Description of the invention (2) A plate body is formed between the grooves to make the heat sink thinner so as to increase the bonding. When the heat is radiated to the heat sink, the manufacturing difficulty and the thermal resistance of the interface are small. ¥ A variety of heat sinks have become urgent. [Content] The present invention is a welding-free type. The side of the present invention is provided with a plurality of folded out seats of the present invention. The base heat sink includes a parallel base and a groove. A v-shaped groove is provided at every interval between the grooves, so that it can be deformed outside by being punched by the center, so as to be squeezed into the slots on both sides of the grooves. The heat sink of this heat sink can also be made to have a large heat dissipation area, but the heat sink has a small contact area with the base sheet and the base in a squeeze manner, and it is not easy to transfer heat from the base to affect the heat dissipation effect. When the fin density and the height of the punched V-shaped plate body easily interfere with the heat sink, the cost is increased. The heat radiation effect of the heater is enhanced, so that the heat sink has a large heat dissipation surface area, and the manufacture of the radiator should be pursued for ease of manufacture and low cost. The heater has its shortcomings that cannot be compensated for. For this reason, how to provide a large, small interface thermal resistance, convenient manufacturing, and low cost heat dissipation to be solved. The purpose is to provide a heater with simple manufacturing process and good heat dissipation effect, and a manufacturing method thereof. The heat sink includes a base and a plurality of heat sinks. The base has a joint groove, and the heat sink includes a heat sink portion and a joint portion from the bottom end of the heat sink portion. The joint portion and the joint groove interfere with each other. The manufacturing method of the heat sink includes the following steps: providing a plurality of joint grooves on one side of a base; providing a plurality of heat sinks, each of the heat sinks and the joints bent from the bottom end of the heat sink; and punching the heat sink in the direction The joint portion allows the joint portion to be received in the joint groove to interfere with the fit.
200S28208_ 五、發明說明（3) 與現有技術相比，本發明之散熱器之散熱片依次經平 行於基座方向之衝壓固定於基座上，故散熱片與模具間不 會發生干涉，從而減小製造難度；另一方面，本發明之散 熱器之散熱片與基座干涉配合，避免焊接中介面熱阻較大 之問題，具有較好散熱效果。 【實施方式】 請參考第一圖至第三圖所示本發明之散熱器之第一實 施例，該散熱器包括複數散熱片1 0及一基座2 0，散熱片1 0 - 與基座2 0都是由導熱性能良好之金屬材料衝壓製成。每一 散熱片1 0包括一散熱部11及一由散熱部Π底端彎折而出之 接合部1 2 '。本實施例中，接合部1 2之橫斷面略呈梯形，包 括三個配合表面，即與散熱部11成一角度之上表面13、前 端面15及一底面14，其中前端面15既可為平面又可製成曲 面；基座2 0 —側設有複數相互平行之接合槽2 2，該等接合 槽2 2之開口方向與基座2 0平行，且其橫斷面呈梯形與散熱 片1 0之接合部1 2之橫斷面形狀相似，也包括上表面2 3、前 端面2 4及底面2 1三個配合表面，經衝壓後這三個配合表面 分別與散熱片1 0之三個配合表面干涉配合，通過金屬塑性 變形將散熱片10固定於基座20上。其中，底面14、21可以 製成略有傾斜乂表面，起導向作用有利於散熱片1 0之接合 部12與基座20之接合槽22接合。 本發明之散熱器之散熱片1 0之接合部1 2之橫斷面形狀 並不僅限於梯形，還可以為矩形、三角形等其他形狀，與 此相應，基座2 0之接合槽2 2應製成與接合部1 2具有相似橫200S28208_ V. Description of the invention (3) Compared with the prior art, the heat sink of the heat sink of the present invention is sequentially fixed to the base by punching parallel to the direction of the base, so there will be no interference between the heat sink and the mold, thereby reducing Small manufacturing difficulty; on the other hand, the heat sink of the heat sink of the present invention cooperates with the base to avoid the problem of large thermal resistance of the interface during welding, and has better heat dissipation effect. [Embodiment] Please refer to the first embodiment of the heat sink of the present invention shown in the first to third figures. The heat sink includes a plurality of heat sinks 10 and a base 20, and the heat sink 10-and the base. 2 0 are made of metal materials with good thermal conductivity. Each of the heat sinks 10 includes a heat sink 11 and a joint 12 ′ bent from the bottom end of the heat sink Π. In this embodiment, the cross section of the joint portion 12 is slightly trapezoidal, and includes three mating surfaces, namely, an upper surface 13, a front surface 15, and a bottom surface 14 at an angle to the heat dissipation portion 11. The front surface 15 can be either The plane can be made into a curved surface; the side of the base 20 is provided with a plurality of joint grooves 22 parallel to each other. The opening directions of the joint grooves 22 are parallel to the base 20, and the cross section of the base is trapezoidal and a heat sink. The cross section of the joint portion 10 of 10 is similar in shape, and also includes the upper surface 2 3, the front surface 2 4 and the bottom surface 2 1 three mating surfaces. After stamping, these three mating surfaces are respectively different from the heat sink 10 ter. The mating surfaces interfere with each other to fix the heat sink 10 on the base 20 through plastic deformation of the metal. Among them, the bottom surfaces 14 and 21 can be made into slightly inclined sloping surfaces, which serve as a guide and facilitate the joining of the joint portion 12 of the heat sink 10 with the joint groove 22 of the base 20. The cross-sectional shape of the joint portion 12 of the heat sink 10 of the heat sink of the present invention is not limited to a trapezoidal shape, and may be other shapes such as a rectangle and a triangle. Correspondingly, the joint groove 22 of the base 20 should be made. It is similar to the joint 12
第7頁 200528208 五、發明說明（4) 斷面之結構。如第四圖及第五圖所示為本發明之散熱器之 散熱片1 0之接合部1 2另外兩種結構。 本發明之散熱器之製造方法為：提供一基座2 0，該基 座2 0 —側設有複數接合槽2 2，該接合槽2 2包括數個配合表 面，其開口方向與基座2 0略呈平行；提供複數散熱片1 0， 每一散熱片1 0具有一散熱部1 1及由散熱部1 1底端彎折而出 之接合部1 2 ;將一散熱片1 0設置於基座2 0上，沿平行基座 2 0方向衝壓散熱片1 0之接合部1 2，使接合部1 2容置於接合 ， 槽2 2内，並與接合槽2 2干涉配合，從而將該散熱片1 0與基 座2 0接合成一體。按上述步驟，將複數散熱片1 〇依次裝設^ 於基座2 (Γν上，從而形成本發明之散熱器。 如，所述，本發明之散熱器之散熱片ΙΟ與基座2 0分開 製造，因而散熱片1 0可製得較薄，從而大幅增加散熱面積 ;散熱片10依次經平行於基座方向之衝壓固定於基座20上 ，故散熱片1 0與模具間不會發生干涉，從而減小製造難度 ，且散熱片1 0之接合部1 2與基座2 0之接合槽2 2間有數個配 合面干涉配合，散熱片10與基座20間接觸面積大，不僅可 有效降低介面熱阻且有利於將熱量從基座2 0傳遞給散熱片 10 ° 因此，本’發明之散熱器及其製造方法可以克服目前常 用散熱器之缺點，可提供一種散熱面積大、介面熱阻小、 製造方便、成本低廉之散熱器。 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施例Page 7 200528208 V. Description of the invention (4) Sectional structure. As shown in the fourth and fifth figures, there are two other structures of the joint portion 12 of the heat sink 10 of the heat sink of the present invention. The manufacturing method of the radiator of the present invention is: providing a base 20, which is provided with a plurality of engaging grooves 22 on the side, and the engaging grooves 22 include a plurality of mating surfaces, the opening direction of which is the same as that of the base 2. 0 is slightly parallel; a plurality of heat sinks 10 are provided, and each heat sink 10 has a heat sink 11 and a joint portion 12 bent from the bottom end of the heat sink 11; a heat sink 10 is disposed on On the base 20, press the joint portion 12 of the heat sink 10 in a direction parallel to the base 20, so that the joint portion 12 is accommodated in the joint, the groove 22, and interferes with the joint groove 22 to thereby The heat sink 10 is integrated with the base 20. According to the above steps, the plurality of heat sinks 10 are sequentially installed on the base 2 (Γν, thereby forming the heat sink of the present invention. As described, the heat sink 10 of the heat sink of the present invention is separated from the base 20 Manufacturing, so the heat sink 10 can be made thin, thereby greatly increasing the heat dissipation area; the heat sink 10 is sequentially fixed to the base 20 by punching parallel to the direction of the base, so there will be no interference between the heat sink 10 and the mold Therefore, the manufacturing difficulty is reduced, and there are several mating surfaces for interference fit between the joint portion 12 of the heat sink 10 and the joint groove 22 of the base 20, and the contact area between the heat sink 10 and the base 20 is large, which is not only effective Reduce the interface thermal resistance and facilitate the transfer of heat from the base 20 to the heat sink 10 °. Therefore, the heat sink of the invention and its manufacturing method can overcome the shortcomings of commonly used heat sinks, and can provide a large heat dissipation area and interface heat. The heat sink with small resistance, convenient manufacture and low cost. In summary, the present invention has indeed met the requirements of the invention patent, so a patent application was filed according to law. However, the above are only the preferred embodiments of the present invention.
第8頁 五、發明說明（5) ，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技 藝之人士援依本發明之精神所作之等效修飾或變化，皆應 涵蓋於以下申請專利範圍内。5. Description of the invention (5), since this cannot be used to limit the scope of patent application in this case. Any equivalent modifications or changes made by those familiar with the technology of the case with the aid of the spirit of the present invention shall be covered by the scope of the following patent applications.
第9頁 7005782X18_ 圖式簡單說明 【圖式簡單說明】 第一圖係本發明之散熱片與基座衝壓接合示意圖。 第二圖係本發明之散熱片與基座衝壓接合後示意圖。 第三圖係本發明之散熱器第一實施例之前視圖。 第四圖係本發明之散熱器之散熱片第二實施例之側視 圖。 第五圖係本發明之散熱器之散熱片第三實施例之側視 圖。 【元件符號說明】 散熱片 10 散熱部 11 接合> 12 上表面 13 \ 23 底面 14 > 21 前端面 ， 15 〜24 基座 20 接合槽 227005782X18_ Brief description of the drawings [Simplified description of the drawings] The first diagram is a schematic diagram of the stamping and joining of the heat sink and the base of the present invention. The second figure is a schematic diagram after the heat sink and the base of the present invention are stamped and joined. The third figure is a front view of the first embodiment of the heat sink of the present invention. The fourth figure is a side view of the second embodiment of the heat sink of the heat sink of the present invention. The fifth figure is a side view of the third embodiment of the heat sink of the heat sink of the present invention. [Explanation of component symbols] Heat sink 10 Heat sink 11 Bonding> 12 Top surface 13 \ 23 Bottom surface 14 > 21 Front end surface, 15 to 24 Base 20 Bonding groove 22
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