200521907 . · 玖、發明說明： 【發明所屬之技術領域】 本發明係有關於一種顯示面板之邊框及其構成方法，尤指一種用 於微型顯示面板或液晶顯示面板之邊框組成，及具有定位及控制間隙 之堤防的邊框結構及構成方法。 【先前技術】 按，微型顯示器（MICRO-DISPLAY)或液晶顯示面板(LCDPanei) 泛用於如液晶投影機、投影電視機、電腦顯示器、電器設備顯示面板 等投影或顯示之電氣設備中’該顯示之原理要是藉由基本的液晶顯示 功能來提供圖像之顯示，因此，該微型顯示器及液晶顯示面板之製造 過桎及品質將直接影響液晶顯示之品質。 習知之微型顯示器或液晶顯示面板在製作過程中是以整片晶圓或 顯示面陣列玻璃基材-次製作出多錄型顯示器或顯示面板元件，故 在其中的每㈣微型顯示器或液晶顯示面板元件於液晶注入前之面板 貼合製作過程中，需先將各微型顯示器或液晶顯示面板之邊框予以規 劃構成，以便於面板貼合及逐一作液晶注入而再予以切割形成單一之 微型顯示元件及液晶顯示面板產品。 、然而，如第十圖所示，係習知之微型顯示元件或液晶顯示面板於 邊框之構成方式’餘由自動點軸以預先賴之路錢行環氧樹脂 或UV樹脂之點膠動作’而藉由環氧樹脂或w樹脂供透明玻璃蓋板貼 合’再經硬化處理過程使環氧樹脂或UV樹脂硬化而形成邊框A，再於 邊框A所圍成之空隙區域B内注入液晶。 如第十-圖所示’此種習知之邊框A的結構及構成方式所產生之 缺點如下： (1)邊框A於點膠之過程t不易被精確定位控制，而易紐至上述用來 ，入液晶之空隙區域B内部或切割線上，造成製程上產品不良率偏 南之問題。 ()在；上貼。板（：向下貼合過程中，由於邊框a所使用之環氧樹脂或 200521907 、 · UV樹脂材料尚未硬化，上貼合板C及下貼合板E分別置於邊框A 頂部及晶圓D下方，由上貼合板C將一透明玻璃板Cl向下貼合於 邊框A時，上貼合板c及下貼合板E並無法施以較大之壓力進行貼 合，該透明玻璃板C1與晶圓D或面板陣列玻璃基材(圖未顯示)間之 間隙G1無法被有效及精確控制，致使該透明玻璃板C1之貼合品質 很難掌控。 (3) 或有因此萌生改良者，在構成邊框a的環氧樹脂或UV樹脂内混拌 間隙粒(SPACER)，試圖藉由間隙子來改善間隙控制不易之問題，但 該邊框A所構成之樹脂材料的黏度不易拿捏控制，會造成間隙粒之 效果大打折扣’例如：在環氧樹脂或UV樹脂於高黏度之狀態下， 該間隙粒分散不均且不易分散，而在低黏度之狀態下又使間隙粒皆鲁 上昇懸浮於邊框A頂部或皆沈澱於邊框A之底部，而無法使間隙粒 發揮控制貼合間隙之作用，且此種混拌方式，必需額外添購混拌設 備，而使製造成本增加。 (4) 以樹脂所構成之邊框a，在液晶注入空隙區域b内部時，將與液晶 材料產生直接產生接觸反應，因此，必需嚴格限制邊框A之構成樹 脂材料或液晶材料之選用，造成製造上材料選用之困擾及麻煩。 【發明内容】 緣此，本發明之主要目的，即是在於提供一種顯示面板之邊框及 其構成方法，藉由一硬質固趙材料層鑛於晶圓或液晶面板陣列玻璃基鲁 材上，並經蝕刻形成之一堅固且平行之内堤防與外堤防，可精確控制 該邊框形成之位置。 、本發明之再-目的，即是在於提供—種面板之邊框防及其構 成方法，軸驗及外堤糊形成—注人溝渠，可供注人填充樹脂以 供-玻璃板舰合處理料向下貼合於邊框卿，而使玻璃板可施以 較大之壓力進行貼合，以精確控制玻璃板與晶圓間之間隙及確保玻璃 板之貼合品質。 本發明之又-目的，即是在於提供—義示面板之邊框及其構成 200521907 方法，該内堤防及外堤防於玻璃板與注入溝渠内之填充樹脂貼合時， 除可精確控制玻璃板與晶圓間之間隙外，不必於樹脂内混拌以間隙 粒，可大幅節省產品之製造成本及精減產品製程。 本發明之再又一目的’即是在於提供一種顯示面板之邊框及其構 成方法，該邊框中之内堤防及外堤防隔絕該注入溝渠内的填充樹脂與 液晶注入區域，使填充樹脂不會與液晶材料接觸反應，使填充樹脂及 液晶材料之選用不受限制。 為達上述之各目的’本發明顯示面板之邊框及其構成方法，係在 於上述顯示器的晶圓片或液晶面板陣列玻璃基材表面鍍上一層硬質固 體材料層，再於該硬質固體材料層上塗佈光阻劑，藉由光罩預先安排 液晶顯示面板邊框形成位置及使邊框規劃形成至少一對平行之内、外 堤防，藉由曝光顯影及姓刻處理，使邊框之内、外堤防形成，該内、 外堤防之間並形成有一注入溝渠，該注入溝渠再注入填充樹脂，該填 充樹脂供一玻璃板經由貼合處理程序貼合於邊框之頂面，再藉由硬化 處理使填充樹脂硬化，以讓填充樹脂可藉由内、外平行堤防之保護而 不會與顯示區塊内之液晶接觸混合，並使顯示面板中之晶圓及頂面的 玻璃板間之間隙控制更加穩定精確。 【實施方式】 首先，請參閱第一圖、第二圖、第三圖、第四圖、第五圖及第六 圖所示，第一圖係為本發明第一實施例之顯示面板之邊框構成方法流 程圖，該方法包含步驟10〜50，其中： (10)晶圓表面鍍上一硬質固體材料層。即如第二圖所示，在液晶顯示面 板基礎之晶圓1上鑛上一層硬質固體材料層11，該硬質固體材料層11 之材料為Is、銅、鎢等金屬合金材料或多晶梦材料構成。 (20)硬質固體材料層表面塗佈阻光劑。即如第三圖所示，在步驟1〇中 之硬質固體材料層11上再塗佈一層光阻劑12。 (30)於光罩中曝光顯影。即如第四圖(a)所示將步驟2〇完成之晶圓1、 硬質固體材料層11及光阻劑12組合以一光罩13配合光源照射加以曝 200521907 光’即將欲去除之硬質固體材料層11的某一部份先行規劃於光罩13 中曝光之部份，俟該曝光部份所對應之位置的光阻劑之局部丨21將 失去保護硬質固體材料層11之作用，再經顯影處理洗去該光阻劑12 中之局部121部份(如第四圖(b)所示)，使該局部121所對應的硬質固體 材料層11部份露出。 (40)钱刻除去多餘之硬質固體材料層。即如第五圖所示，以蝕刻方式將 步驟30中所述之硬質固體材料層n露出部份加以蝕刻除去。 (50)邊框成形。即如第六圖所示，將該步驟4〇及第五圖所示剩餘覆蓋 於硬質固體材料層11之光阻劑12除去，其方法可比照步驟3〇之曝光 顯影方式處理，於該剩餘之光阻劑12除去後，該剩餘之硬質固體材料 層η即形成本發明之邊框100之結構。 上述步驟50最終形成之邊框1〇〇包括至少一對之内堤防HQ及外 堤防120，該内堤防110及外堤防120之間為相互平行之構造，且圍繞 結合在上述晶圓1之外圍週邊，在本發明之實施例中是以一對内堤防 110及外堤防120為例，而其他如以多個内堤防11〇及外堤防12〇數量 構成之邊框100結構當屬本發明之主張範_。内堤防及外堤防12〇 間則形成有一注入溝渠130。 上述第-@〜第六@巾所示本發明所示之邊框構成方法中所敘述 之邊框100為了簡便說明，即以圖示列舉單一顯示面板的邊框1〇〇構 成過程，惟該晶圓1表面可一次規劃多個顯示面板元件的相同製程一 同進行，其步驟相同於上述的步驟10〜步驟50之過程。 請再配合第七圖(a)所示，顯示本發明中之邊框1〇〇結構在單一顯 示面板200(如第七圊(b)所示)元件中之構造，其中，該邊框1〇〇之内堤 防110及外堤防120平行圍繞結合於單一顯示面板2〇〇之晶圓丨表面， 且該圍成之空間形成一空隙區域X，且該空隙區域χ於晶圓i週緣一 侧形成一開口 XI，而内堤防110與外堤防120間之注入溝渠13〇在晶 圓1週緣一侧分別形成有兩注入口 131及132，而該注入口 |31及13^ 則分別連結至一注膠裝置300之注膠管路31〇及32〇，以由該注膠裝置 200521907 300經注膠管路310及320將填充樹脂F注入填充該注入溝渠130中。 請參閱第七圖(b)，顯示本發明之邊框1〇〇於單一顯示面板2〇〇元 件中之應用結構，其中，該注入溝渠130於注入填充樹脂f後，透過 貼合處理程序’以一上貼合板210置於邊框1〇〇頂面及一下貼合板220 置於晶圓1底面，該上貼合板210及下貼合板220分別為向下及向上 垂直活動加壓之機構，該上貼合板210與下貼合板220連結及受控制 於一貼合機構(圖未顯示），其中，該上貼合板210向下將一玻璃板230 平貼貼合於該邊框100頂面，而使該填充樹脂F得以黏合該玻璃板 230，並且，藉由該硬質固體材料之内堤防no及外堤防12〇支撐，可 以使上貼合板210向下及下貼合板220向下施以較大之壓力，以讓玻 璃板230精確及牢固貼合於邊框1〇〇頂部，得以確保玻璃板230之貼 合品質。 在進行完畢上述之貼合處理程序後，該填充樹脂F並經硬化處理 過程，如以紫外燈照射硬化或烘乾後，並藉由第七圖⑻所示之開口 X1 將液晶Η注入該空隙區域X中，並再將該開口 XI封閉（圖未顯示），以 形成該單一顯示面板200元件。 在上述第七圊(b)所示之本發明之邊框100於顯示面板200的結構 中，是可以藉由内堤防110及外堤防120的形成及硬質固體材料結構， 而提供該玻璃板230在經上貼合板210及下貼合板220加壓貼合處理 後，精確控制該玻璃板230與晶圓1間之間隙G2高度，且該高度可取 決於第一圖中所示的步驟10之硬質固體材料層11的高度，可提供該顯 示面板200之元件規格及組合品質之精確控制功效，且該内堤防11〇 及外堤防120可被準確定位形成，不會擴散侵入液晶Η填充之空隙區 域X或晶圓1之切割線上，填充於注入溝渠130中之填充樹脂F内不 摻雜間隙粒也不需混拌，可以大幅節省顯示面板200之製造成本及設 備成本，並且，該填充樹脂F充分受内堤防110及外堤防120之隔絕， 而不會與液晶Η產生接觸反應或向外擴散至晶圓1切割線上，可大幅 提昇顯示面板200之產品良率，並且讓該填充樹脂F及液晶Η材料於 200521907 選用上不必受到限制。 而上述本發明之邊框100於單一顯示面板2〇〇構成方式可以應用 於穿透式或反射式之微型顯示元件或LCD液晶顯示面板之元件及製程 中，可以讓該微型顯示元件及LCD液晶顯示面板同樣達成上述之功效 及產業利用價值。 請再配合第八圖所示，為本發明之邊框1〇〇構成方法之第二實施 例，其中，與第一圖所示不同之處，乃該硬質固體材料n鍍於一液晶 面板陣列玻璃基材2上，而其餘步驟20〜步驟50之流程皆相同，同樣 可以在液晶面板陣列玻璃基材2上形成本發明之邊框1〇〇之結構，即 具有至少一對之内堤防11〇及外堤防120，以及在内堤防no與外堤防 120間形成一注入溝渠130之結構，同樣可以達成上述之精確控制間 隙、節省製造成本及提昇產品良率之功效及產業利用價值。 請再參閱第九圖所示，其中，顯示本發明之邊框1〇〇的第三實施 例，其中，係依據類同於第一圖所示之第一實施之邊框1〇〇中的内堤 防110及外堤防120的形成方式，在該空隙區域X之開口 χι内緣處至 少形成有一阻流牆140，除了可增加上貼合板210之貼合壓力及精確控 制間隙外，更可讓液晶Η再經由開口 XI進入空隙區域X時具有減緩 液晶Η流速及讓液晶Η分流注入空隙區域X之功能，可避免液晶Η注 入過快導致雜質渗入之缺點。 以上第一圖〜第九圖所示本發明之顯示面板之邊框及其構成方 法’其中所揭不之各相關說明及圖式’僅為本發明為進《 —步閑明其技 術内容及技術手段，所列舉較佳實施例之一隅，並不足以拘限本發明 之範_ ’並且，舉凡針對本發明技術内容、手段之修飾及等效變更， 當不脫離本發明之範疇，其範圍標的將由以下之申請專利範圍來界定 之。 【圖式簡單說明】 第一圖係本發明之第一實施例的顯示面板之邊框構成方法流程 200521907 第二圖為一剖視圖，顯示第一圖中之硬質材料層鍍於晶圓之步驟； 第三圖為一剖視圖，顯示第一圖中之硬質材料層上塗佈光阻劑之 步驟； 第四圊(a)為一剖視圖，顯示第一圖中之光罩曝光顯影步驟之一； 第四圖(b)為一剖視圖，顯示第一圖中之光罩曝光顯影步驟之二； 第五囷為一剖視囷，顯示第一圖中之内堤防、外堤防蝕刻成形之 步驟；’ 第六圖為一剖視圖，顯示第一圖中之内堤防、外堤防最終成形之 步驟； 第七圊(a)為一俯視囷，顯示本發明之第一實施例的顯示面板之邊 框結構； 第七圖(b)係一剖視圖，顯示本發明之邊框於單一顯示面板元件中 之應用結構； 第八圖為本發明之第二實施例圖； 第九圖為本發明之第三實施例圖； 第十圖係一俯視圖，為習知之液晶顯示面板之邊框以點膠構成方 式； 第十一圓係一剖視圖，為習知之液晶顯示面板之邊框結構。 【元件符號簡單說明】 <本發明部份> 11硬質固體材料層 121局部 2 液晶面板陣列玻璃基材 110内堤防 130注入溝渠 132注入口 200顯示面板 220下貼合板 1 晶圓 12光阻劑 13光罩 100邊框 120外堤防 131注入口 140阻流牆 210上貼合板 200521907 300注膠裝置 320回流管路 Η 液晶 X 空間區域 230玻璃板 310注膠管路 F 填充樹脂 G2間隙 XI開口 10晶圓表面鍍上一硬質固體材料層 20硬質固體材料層表面塗佈阻光劑 30於光罩中曝光顯影 40蝕刻除去多餘之硬質固體材料層 50邊框成形 習知部份> Α邊框 C上貼合板 D晶圓 G1間隙 B 空隙區域 C1透明玻璃板 E下貼合板200521907. · Description of the invention: [Technical field to which the invention belongs] The present invention relates to a frame of a display panel and a method for forming the same, particularly a frame composition for a micro display panel or a liquid crystal display panel, and has positioning and Frame structure and constitution method of dike for controlling gap. [Prior technology] Press, micro display (MICRO-DISPLAY) or liquid crystal display panel (LCDPanei) is widely used in electrical equipment such as LCD projectors, projection televisions, computer monitors, electrical equipment display panels, etc. The principle is to provide image display through the basic liquid crystal display function. Therefore, the manufacturing process and quality of the micro display and liquid crystal display panel will directly affect the quality of the liquid crystal display. The conventional micro display or liquid crystal display panel in the manufacturing process is based on the entire wafer or display surface array glass substrate-multiple recording display or display panel components are produced at one time, so each micro display or liquid crystal display panel in it In the process of panel bonding before the liquid crystal injection, the frame of each microdisplay or liquid crystal display panel must be planned and constructed in order to facilitate panel bonding and liquid crystal injection one by one before cutting to form a single microdisplay element and LCD panel products. However, as shown in the tenth figure, the structure of the conventional micro display element or liquid crystal display panel on the frame is 'the dispensing operation of epoxy resin or UV resin by an automatic point axis in advance.' The transparent glass cover plate is bonded by epoxy resin or w resin, and then the epoxy resin or UV resin is hardened to form a frame A through a hardening process, and then liquid crystal is injected into a gap region B surrounded by the frame A. As shown in the tenth figure, the shortcomings caused by the structure and composition of this conventional frame A are as follows: (1) The process of frame A during dispensing is not easy to be accurately positioned and controlled, and it is easy to use it to the above. Into the gap area B of the liquid crystal or on the cutting line, causing a problem that the product defect rate is south in the manufacturing process. () On; posted. Board (: In the process of downward bonding, because the epoxy resin or 200521907 used in the frame a has not been hardened, the upper bonding plate C and the lower bonding plate E are placed on the top of the frame A and under the wafer D, respectively. When a transparent glass plate C1 is bonded downward to the frame A from the upper bonding plate C, the upper bonding plate c and the lower bonding plate E cannot be bonded with a large pressure. The transparent glass plate C1 and the wafer D Or the gap G1 between the glass substrate of the panel array (not shown in the figure) cannot be effectively and accurately controlled, which makes it difficult to control the bonding quality of the transparent glass plate C1. Epoxy resin or UV resin mixed with interstitial particles (SPACER), trying to improve the gap control problem by the gap, but the viscosity of the resin material formed by the frame A is not easy to control, will cause the effect of interstitial particles Great discounts "For example: in the state of high viscosity of epoxy resin or UV resin, the interstitial particles are unevenly dispersed and difficult to disperse, and in the state of low viscosity, the interstitial particles are all raised and suspended on the top of the frame A or both Settled in frame A It is impossible to make the gap particles play a role in controlling the fit gap, and this mixing method requires additional purchase of mixing equipment, which increases the manufacturing cost. (4) The frame a made of resin is injected into the liquid crystal. When the inside of the void region b, a direct contact reaction will occur with the liquid crystal material. Therefore, it is necessary to strictly limit the selection of the resin material or the liquid crystal material constituting the frame A, which will cause trouble and trouble in the selection of materials for manufacturing. The main object of the present invention is to provide a frame of a display panel and a method for forming the same. A hard solid material layer is deposited on a wafer or a glass substrate of a liquid crystal panel array, and is etched to form a strong and The inner dike and outer dike that are parallel can precisely control the position where the frame is formed. Another object of the present invention is to provide—a kind of panel frame and its construction method, axiom test and outer bank paste formation—inject people The ditch can be filled with resin for the glass plate and the processing material to be attached to the frame, so that the glass plate can be attached with a larger pressure. Precisely control the gap between the glass plate and the wafer and ensure the bonding quality of the glass plate. Another object of the present invention is to provide a method for displaying the frame of the panel and its composition 200521907. The inner and outer dikes are made of glass. When the plate and the filling resin in the injection channel are bonded, in addition to accurately controlling the gap between the glass plate and the wafer, it is not necessary to mix the gap particles in the resin, which can greatly save the manufacturing cost of the product and reduce the product manufacturing process. Yet another object of the invention is to provide a frame of a display panel and a method for forming the same. The inner bank and the outer bank in the frame isolate the filling resin and the liquid crystal injection region in the injection trench, so that the filling resin does not interfere with the liquid crystal. The material contact reaction makes the choice of filling resin and liquid crystal material unlimited. In order to achieve the above-mentioned purposes, the frame of the display panel of the present invention and the method for forming the frame are located on the surface of the wafer or liquid crystal panel array glass substrate of the display. A layer of a hard solid material is plated, and then a photoresist is coated on the hard solid material layer, and a liquid crystal display is arranged in advance by a photomask. The position of the panel frame and the frame are planned to form at least a pair of parallel inner and outer dikes. The inner and outer dikes are formed by exposure and development and engraving. An injection channel is formed between the inner and outer dikes. The filling trench is further filled with a filling resin, and the filling resin is used for a glass plate to be bonded to the top surface of the frame through a bonding processing program, and then the filling resin is hardened by a hardening treatment so that the filling resin can be paralleled by the inner and outer dikes It is protected from being mixed with the liquid crystal in the display block, and makes the gap control between the wafer in the display panel and the top glass plate more stable and accurate. [Embodiment] First, please refer to the first, second, third, fourth, fifth, and sixth figures. The first figure is a frame of a display panel according to a first embodiment of the present invention. A flowchart of a composition method, the method includes steps 10 to 50, wherein: (10) a surface of the wafer is plated with a layer of a hard solid material. That is, as shown in the second figure, a hard solid material layer 11 is deposited on the wafer 1 of the liquid crystal display panel foundation. The material of the hard solid material layer 11 is a metal alloy material such as Is, copper, tungsten, or a polycrystalline dream material. Make up. (20) The surface of the hard solid material layer is coated with a light blocking agent. That is, as shown in the third figure, a photoresist 12 is further coated on the hard solid material layer 11 in step 10. (30) Exposure and development in a photomask. That is, as shown in the fourth figure (a), the wafer 1, the hard solid material layer 11 and the photoresist 12 completed in step 20 are combined with a photomask 13 and a light source to expose 200521907 light 'hard solids to be removed. A part of the material layer 11 is first planned in the exposed part of the mask 13, and a part of the photoresist at the position corresponding to the exposed part 21 will lose the role of protecting the hard solid material layer 11, and then The developing process removes part 121 of the photoresist 12 (as shown in FIG. 4 (b)), and exposes the part of the hard solid material layer 11 corresponding to the part 121. (40) The money is cut to remove the extra layer of hard solid material. That is, as shown in the fifth figure, the exposed portion of the hard solid material layer n described in step 30 is removed by etching. (50) The frame is formed. That is, as shown in the sixth figure, the photoresist 12 covered in the hard solid material layer 11 remaining in the step 40 and the fifth figure is removed. The method can be compared with the exposure and development method of the step 30. After the photoresist 12 is removed, the remaining solid solid material layer η forms the structure of the frame 100 of the present invention. The frame 100 finally formed in the above step 50 includes at least one pair of the inner dyke HQ and the outer dyke 120. The inner dyke 110 and the outer dyke 120 are parallel to each other, and surround the periphery of the wafer 1 bonded to the periphery. In the embodiment of the present invention, a pair of inner dikes 110 and outer dikes 120 are taken as an example, and other structures such as a frame 100 composed of a plurality of inner dikes 11 and outer dikes 12 are regarded as the claims of the present invention. _. An injection trench 130 is formed between the inner dike and the outer dike. The frame 100 described in the method for forming the frame shown in the present invention shown in the above-@ ~ # 6 @ 巾 is for simplicity of description, that is, the process of forming the frame 100 of a single display panel is illustrated in the figure, but the wafer 1 The surface can plan the same manufacturing process of multiple display panel components at once, and the steps are the same as the above steps 10 to 50. Please cooperate with FIG. 7 (a) to show the structure of the frame 100 structure in the present invention in a single display panel 200 (as shown in FIG. 7 (b)), where the frame 100 is The inner dike 110 and the outer dike 120 surround the surface of the wafer bonded to the single display panel 2000 in parallel, and the enclosed space forms a void region X, and the void region χ forms a side on the peripheral edge of the wafer i. Opening XI, and the injection trench 13 between the inner dike 110 and the outer dike 120 are formed with two injection ports 131 and 132 on the side of the peripheral edge of the wafer 1, respectively, and the injection ports | 31 and 13 ^ are connected to a glue injection respectively. The injection lines 31 and 32 of the device 300 are used to fill the injection trench 130 by filling the resin F with the injection device 200521907 300 through the injection lines 310 and 320. Please refer to the seventh figure (b), which shows an application structure of the frame 100 of the present invention in a single display panel 2000 element, wherein the injection trench 130 is filled with a filling resin f and passed through a bonding process program to An upper lamination plate 210 is placed on the top surface of the frame 100 and a lower lamination plate 220 is placed on the bottom surface of the wafer 1. The upper lamination plate 210 and the lower lamination plate 220 are vertical and downward pressurizing mechanisms, respectively. The laminating board 210 is connected to the lower laminating board 220 and is controlled by a laminating mechanism (not shown in the figure), wherein the upper laminating board 210 flatly attaches a glass plate 230 to the top surface of the frame 100 so that The filling resin F can be bonded to the glass plate 230, and the inner and outer dikes no. 12 and 12 of the hard solid material can support the upper lamination plate 210 downward and the lower lamination plate 220 downward. The pressure is applied to make the glass plate 230 accurately and firmly adhere to the top of the frame 100, thereby ensuring the bonding quality of the glass plate 230. After the above-mentioned bonding process is completed, the filled resin F is subjected to a hardening process, such as after being hardened or dried by ultraviolet light irradiation, and the liquid crystal Η is injected into the gap through the opening X1 shown in the seventh figure ⑻. In the region X, the opening XI is closed (not shown) to form the single display panel 200 element. In the structure of the frame 100 of the present invention shown in the seventh display (b) above on the display panel 200, the glass plate 230 can be provided by forming the inner dike 110 and the outer dike 120 and the structure of the hard solid material. After the upper bonding plate 210 and the lower bonding plate 220 are pressed and bonded, the height of the gap G2 between the glass plate 230 and the wafer 1 is accurately controlled, and the height may depend on the rigidity of step 10 shown in the first figure. The height of the solid material layer 11 can provide accurate control of the component specifications and combined quality of the display panel 200, and the inner bank 11 and the outer bank 120 can be accurately positioned and formed, and will not diffuse into the gap area filled by the liquid crystal. X or the cutting line of wafer 1, the filling resin F filled in the injection trench 130 is not doped with interstitial particles and does not need to be mixed, which can greatly save the manufacturing cost and equipment cost of the display panel 200, and the filling resin F Fully isolated from the inner dike 110 and the outer dike 120, without contact with the liquid crystal ions or spreading out to the wafer 1 cutting line, which can greatly improve the product yield of the display panel 200 and allow the filling Aliphatic and F liquid crystal material on 200521907 Η selection necessarily limited. The frame 100 of the present invention in a single display panel 200 can be applied to the transmissive or reflective micro display elements or the components and processes of LCD liquid crystal display panels, and the micro display elements and LCD liquid crystal display can be used. The panel also achieves the above-mentioned efficacy and industrial utilization value. Please cooperate with the eighth figure, which is the second embodiment of the frame 100 forming method of the present invention. The difference from the first figure is that the hard solid material n is plated on a liquid crystal panel array glass. The substrate 2 has the same steps as the other steps 20 to 50, and the frame 100 structure of the present invention can also be formed on the liquid crystal panel array glass substrate 2 with at least one pair of inner banks 11 and The outer dyke 120 and the structure for forming an injection trench 130 between the inner dyke no and the outer dyke 120 can also achieve the above-mentioned precise control of the gap, save manufacturing costs, improve product yield, and industrial utilization value. Please refer to the ninth figure again, in which a third embodiment of the frame 100 of the present invention is shown, wherein the inner embankment in the frame 100 is similar to the first embodiment shown in the first figure. 110 and the outer dike 120 are formed in such a way that at least an impeding wall 140 is formed at the inner edge of the opening χι of the gap region X. In addition to increasing the bonding pressure of the upper bonding board 210 and accurately controlling the gap, the liquid crystal can also be When entering the void region X through the opening XI, it has the functions of slowing the flow rate of liquid crystals and allowing the liquid crystals to be shunted into the void region X, which can avoid the disadvantages of the liquid crystals being injected too quickly and causing impurities to penetrate. The first to ninth figures above show the frame of the display panel of the present invention and the method of constituting the display panel. The related descriptions and drawings that are not disclosed therein are only for the purpose of the present invention. Means, one of the preferred embodiments listed, is not sufficient to limit the scope of the present invention. Also, for all modifications and equivalent changes to the technical content, means of the present invention, the scope of the subject matter is not deviated from the scope of the present invention. It will be defined by the scope of patent application below. [Brief description of the drawings] The first diagram is a flow chart of a method for forming a frame of a display panel according to the first embodiment of the present invention 200521907 The second diagram is a cross-sectional view showing the steps of plating a hard material layer on a wafer in the first diagram; The third figure is a cross-sectional view showing the step of applying a photoresist on the hard material layer in the first figure; the fourth step (a) is a cross-sectional view showing one of the photomask exposure and development steps in the first figure; the fourth Figure (b) is a cross-sectional view showing the second step of photomask exposure and development in the first picture; the fifth figure is a cross-section view showing the steps of the inner dike and the outer dike etch forming in the first picture; 'sixth The figure is a cross-sectional view showing the steps of the final forming of the inner dike and the outer dike in the first figure; the seventh figure (a) is a plan view showing the frame structure of the display panel according to the first embodiment of the present invention; the seventh figure (b) is a sectional view showing the application structure of the frame of the present invention in a single display panel element; the eighth figure is a diagram of the second embodiment of the present invention; the ninth diagram is a diagram of the third embodiment of the present invention; the tenth The picture is a top view, it is the liquid of knowledge The display panel in the bezel constituting dispensing mode; a round cross-sectional view of an eleventh lines of the display frame structure of the panel of the conventional liquid crystal. [Simple description of element symbols] < Part of the invention > 11 Hard solid material layer 121 Part 2 Liquid crystal panel array glass substrate 110 Inner dyke 130 Injection channel 132 Injection port 200 Display panel 220 Bonding board 1 Wafer 12 Photoresist Agent 13 photomask 100 frame 120 outer bank 131 injection port 140 spoiler wall 210 plywood 200521907 300 glue injection device 320 return pipe Η LCD X space area 230 glass plate 310 glue pipe F filled resin G2 gap XI opening 10 crystals A round solid surface is plated with a hard solid material layer 20 The surface of the hard solid material layer is coated with a light-blocking agent 30 Exposure and development in a photomask 40 Etching removes the excess hard solid material layer 50 Known part of frame formation > Α frame C paste Plywood D Wafer G1 Clearance B Clearance area C1 Transparent glass plate E
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