TW200520054A - Position detection method, exposure method, position detection device, exposure device, and device-manufacturing method - Google Patents

Position detection method, exposure method, position detection device, exposure device, and device-manufacturing method

Info

Publication number
TW200520054A
TW200520054A TW093133795A TW93133795A TW200520054A TW 200520054 A TW200520054 A TW 200520054A TW 093133795 A TW093133795 A TW 093133795A TW 93133795 A TW93133795 A TW 93133795A TW 200520054 A TW200520054 A TW 200520054A
Authority
TW
Taiwan
Prior art keywords
model
parameters
freedom
position detection
degree
Prior art date
Application number
TW093133795A
Other languages
Chinese (zh)
Other versions
TWI377598B (en
Inventor
Shinichi Nakajima
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200520054A publication Critical patent/TW200520054A/en
Application granted granted Critical
Publication of TWI377598B publication Critical patent/TWI377598B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection

Abstract

The purpose of the present invention is to proceed wafer alignment with high accuracy and in a short time. In step 502, a model AIC(M') of a model M' having a small degree of freedom of parameters is compared to AIC(M) of a model M having a large degree of freedom of parameters, and the smaller one is selected as a model of EGA. When the model M is selected and its residual is not smaller than a predetermined value, select a model in which all the coefficients having a greater degree of freedom of parameters than that of the model M are parameters. When the number of valid samples is smaller than the degree of freedom of parameters in this model, the number of valid samples is increased, and the sample shot is additionally measured. Afterwards, in step 524, the coefficient of the model currently selected is reflected in the knowledge available in advance when performing wafer alignment next time. Also, in step 508 or step 518, the number of valid samples is increased or decreased according to the degree of freedom of parameters of the current model.
TW093133795A 2003-11-07 2004-11-05 Position detection method, exposure method, position detection device, exposure device, and device-manufacturing method TW200520054A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003378229 2003-11-07

Publications (2)

Publication Number Publication Date
TW200520054A true TW200520054A (en) 2005-06-16
TWI377598B TWI377598B (en) 2012-11-21

Family

ID=34567168

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093133795A TW200520054A (en) 2003-11-07 2004-11-05 Position detection method, exposure method, position detection device, exposure device, and device-manufacturing method

Country Status (3)

Country Link
JP (1) JP4596166B2 (en)
TW (1) TW200520054A (en)
WO (1) WO2005045364A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI579661B (en) * 2013-09-10 2017-04-21 佳能股份有限公司 Method of obtaining a position of a second shot region neighboring a first shot region, exposure method, exposure apparatus, and method of manufacturing article

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1744217B1 (en) * 2005-07-12 2012-03-14 ASML Netherlands B.V. Method of selecting a grid model for correcting grid deformations in a lithographic apparatus and lithographic assembly using the same
JP4873230B2 (en) * 2006-05-19 2012-02-08 株式会社ニコン Exposure method, exposure apparatus, measurement method, and measurement apparatus
KR101664962B1 (en) * 2012-05-29 2016-10-11 에이에스엠엘 네델란즈 비.브이. A method to determine the usefulness of alignment marks to correct overlay, and a combination of a lithographic apparatus and an overlay measurement system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0669017B2 (en) * 1985-10-08 1994-08-31 株式会社ニコン Alignment method
JP3230271B2 (en) * 1991-08-30 2001-11-19 株式会社ニコン Alignment method, alignment apparatus, exposure method and exposure apparatus
JPH11295056A (en) * 1998-04-15 1999-10-29 Nikon Corp Position detecting method, positioning method, and exposing method
WO2000019497A1 (en) * 1998-09-30 2000-04-06 Nikon Corporation Alignment method and method for producing device using the alignment method
JP2002324756A (en) * 2001-02-26 2002-11-08 Nikon Corp Position measuring apparatus, aligner, exposure system and device manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI579661B (en) * 2013-09-10 2017-04-21 佳能股份有限公司 Method of obtaining a position of a second shot region neighboring a first shot region, exposure method, exposure apparatus, and method of manufacturing article
US10031429B2 (en) 2013-09-10 2018-07-24 Canon Kabushiki Kaisha Method of obtaining position, exposure method, and method of manufacturing article

Also Published As

Publication number Publication date
WO2005045364A1 (en) 2005-05-19
TWI377598B (en) 2012-11-21
JP4596166B2 (en) 2010-12-08
JPWO2005045364A1 (en) 2007-05-17

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees