TW200519229A - Surface treatment process for enhancing the release of metal ions from sacrificial electrode and sacrificial electrode prepared by said process - Google Patents
Surface treatment process for enhancing the release of metal ions from sacrificial electrode and sacrificial electrode prepared by said processInfo
- Publication number
- TW200519229A TW200519229A TW092135096A TW92135096A TW200519229A TW 200519229 A TW200519229 A TW 200519229A TW 092135096 A TW092135096 A TW 092135096A TW 92135096 A TW92135096 A TW 92135096A TW 200519229 A TW200519229 A TW 200519229A
- Authority
- TW
- Taiwan
- Prior art keywords
- sacrificial electrode
- enhancing
- release
- surface treatment
- metal ions
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
- C02F1/46104—Devices therefor; Their operating or servicing
- C02F1/46109—Electrodes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
- C25F1/02—Pickling; Descaling
- C25F1/04—Pickling; Descaling in solution
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
- C02F1/463—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis by electrocoagulation
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
- C02F2103/34—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32
- C02F2103/346—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32 from semiconductor processing, e.g. waste water from polishing of wafers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Environmental & Geological Engineering (AREA)
- Water Supply & Treatment (AREA)
- Mechanical Engineering (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092135096A TWI261629B (en) | 2003-12-11 | 2003-12-11 | Surface treatment process for enhancing the release of metal ions from sacrificial electrode and sacrificial electrode prepared by said process |
US10/788,382 US7118665B2 (en) | 2003-12-11 | 2004-03-01 | Surface treatment process for enhancing a release rate of metal ions from a sacrificial electrode and a related sacrificial electrode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092135096A TWI261629B (en) | 2003-12-11 | 2003-12-11 | Surface treatment process for enhancing the release of metal ions from sacrificial electrode and sacrificial electrode prepared by said process |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200519229A true TW200519229A (en) | 2005-06-16 |
TWI261629B TWI261629B (en) | 2006-09-11 |
Family
ID=34651822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092135096A TWI261629B (en) | 2003-12-11 | 2003-12-11 | Surface treatment process for enhancing the release of metal ions from sacrificial electrode and sacrificial electrode prepared by said process |
Country Status (2)
Country | Link |
---|---|
US (1) | US7118665B2 (zh) |
TW (1) | TWI261629B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7563939B2 (en) | 2005-12-14 | 2009-07-21 | Mark Slater Denton | Method for treating radioactive waste water |
US8148594B2 (en) * | 2007-08-06 | 2012-04-03 | Energysolutions Diversified Services, Inc. | Process for treating radioactive waste water to prevent overloading demineralizer systems |
SG177768A1 (en) | 2009-08-25 | 2012-03-29 | Prostec Co Ltd | Medical supplies and method of producing the same |
CN106006865A (zh) * | 2016-06-27 | 2016-10-12 | 南京师范大学 | 一种模块化旋转感应平行多圆盘型电絮凝装置 |
CN107460531B (zh) * | 2017-07-03 | 2020-11-13 | 阜南县申通机械制造有限公司 | 一种汽车覆盖件电解除蜡的方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5286933A (en) * | 1976-01-14 | 1977-07-20 | Tokai Electro Chemical Co | Method of treating surface of copper and copper alloy |
US6284309B1 (en) * | 1997-12-19 | 2001-09-04 | Atotech Deutschland Gmbh | Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom |
-
2003
- 2003-12-11 TW TW092135096A patent/TWI261629B/zh active
-
2004
- 2004-03-01 US US10/788,382 patent/US7118665B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US7118665B2 (en) | 2006-10-10 |
TWI261629B (en) | 2006-09-11 |
US20050126918A1 (en) | 2005-06-16 |
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