TW200518313A - Method of fabricating a MOSFET device - Google Patents

Method of fabricating a MOSFET device

Info

Publication number
TW200518313A
TW200518313A TW092132342A TW92132342A TW200518313A TW 200518313 A TW200518313 A TW 200518313A TW 092132342 A TW092132342 A TW 092132342A TW 92132342 A TW92132342 A TW 92132342A TW 200518313 A TW200518313 A TW 200518313A
Authority
TW
Taiwan
Prior art keywords
substrate
drain
liner
source
implanted
Prior art date
Application number
TW092132342A
Other languages
English (en)
Other versions
TWI231989B (en
Inventor
Ming-Sheng Tung
Yueh-Chuan Lee
Fang-Yu Yeh
Chi Lin
Original Assignee
Promos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Promos Technologies Inc filed Critical Promos Technologies Inc
Priority to TW092132342A priority Critical patent/TWI231989B/zh
Priority to US10/788,807 priority patent/US20050106844A1/en
Application granted granted Critical
Publication of TWI231989B publication Critical patent/TWI231989B/zh
Publication of TW200518313A publication Critical patent/TW200518313A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/6653—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using the removal of at least part of spacer, e.g. disposable spacer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1025—Channel region of field-effect devices
    • H01L29/1029—Channel region of field-effect devices of field-effect transistors
    • H01L29/1033—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
    • H01L29/1041—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure with a non-uniform doping structure in the channel region surface
    • H01L29/1045—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure with a non-uniform doping structure in the channel region surface the doping structure being parallel to the channel length, e.g. DMOS like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66568—Lateral single gate silicon transistors
    • H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
    • H01L29/6659—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with both lightly doped source and drain extensions and source and drain self-aligned to the sides of the gate, e.g. lightly doped drain [LDD] MOSFET, double diffused drain [DDD] MOSFET
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66568—Lateral single gate silicon transistors
    • H01L29/66659—Lateral single gate silicon transistors with asymmetry in the channel direction, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Semiconductor Memories (AREA)
TW092132342A 2003-11-18 2003-11-18 Method of fabricating a MOSFET device TWI231989B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW092132342A TWI231989B (en) 2003-11-18 2003-11-18 Method of fabricating a MOSFET device
US10/788,807 US20050106844A1 (en) 2003-11-18 2004-02-27 Method of fabricating a MOSFET device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092132342A TWI231989B (en) 2003-11-18 2003-11-18 Method of fabricating a MOSFET device

Publications (2)

Publication Number Publication Date
TWI231989B TWI231989B (en) 2005-05-01
TW200518313A true TW200518313A (en) 2005-06-01

Family

ID=34568649

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092132342A TWI231989B (en) 2003-11-18 2003-11-18 Method of fabricating a MOSFET device

Country Status (2)

Country Link
US (1) US20050106844A1 (zh)
TW (1) TWI231989B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7396713B2 (en) * 2005-10-07 2008-07-08 International Business Machines Corporation Structure and method for forming asymmetrical overlap capacitance in field effect transistors
US7612414B2 (en) 2007-03-29 2009-11-03 International Business Machines Corporation Overlapped stressed liners for improved contacts
US10868141B2 (en) * 2015-12-31 2020-12-15 Taiwan Semiconductor Manufacturing Company Ltd. Spacer structure and manufacturing method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003124339A (ja) * 2001-10-11 2003-04-25 Toshiba Corp 半導体装置およびその製造方法
US6881622B2 (en) * 2002-05-30 2005-04-19 Taiwan Semiconductor Manufacturing Co., Ltd Aqueous ammonium hydroxide amorphous silicon etch method for forming microelectronic capacitor structure
US6777298B2 (en) * 2002-06-14 2004-08-17 International Business Machines Corporation Elevated source drain disposable spacer CMOS
US6762085B2 (en) * 2002-10-01 2004-07-13 Chartered Semiconductor Manufacturing Ltd. Method of forming a high performance and low cost CMOS device
US6924180B2 (en) * 2003-02-10 2005-08-02 Chartered Semiconductor Manufacturing Ltd. Method of forming a pocket implant region after formation of composite insulator spacers
US20050048732A1 (en) * 2003-08-26 2005-03-03 International Business Machines Corporation Method to produce transistor having reduced gate height

Also Published As

Publication number Publication date
TWI231989B (en) 2005-05-01
US20050106844A1 (en) 2005-05-19

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees