TW200518292A - Semiconductor chip-carrying substrate and its manufacturing method - Google Patents
Semiconductor chip-carrying substrate and its manufacturing methodInfo
- Publication number
- TW200518292A TW200518292A TW092133464A TW92133464A TW200518292A TW 200518292 A TW200518292 A TW 200518292A TW 092133464 A TW092133464 A TW 092133464A TW 92133464 A TW92133464 A TW 92133464A TW 200518292 A TW200518292 A TW 200518292A
- Authority
- TW
- Taiwan
- Prior art keywords
- holes
- manufacturing
- semiconductor chip
- carrying substrate
- metal substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092133464A TWI232565B (en) | 2003-11-28 | 2003-11-28 | Semiconductor chip-carrying substrate and its manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092133464A TWI232565B (en) | 2003-11-28 | 2003-11-28 | Semiconductor chip-carrying substrate and its manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI232565B TWI232565B (en) | 2005-05-11 |
TW200518292A true TW200518292A (en) | 2005-06-01 |
Family
ID=36320067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092133464A TWI232565B (en) | 2003-11-28 | 2003-11-28 | Semiconductor chip-carrying substrate and its manufacturing method |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI232565B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111834235A (zh) * | 2020-07-28 | 2020-10-27 | 华进半导体封装先导技术研发中心有限公司 | 通孔填充方法及结构 |
CN111834234A (zh) * | 2020-07-28 | 2020-10-27 | 华进半导体封装先导技术研发中心有限公司 | 通孔填充方法及结构 |
-
2003
- 2003-11-28 TW TW092133464A patent/TWI232565B/zh active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111834235A (zh) * | 2020-07-28 | 2020-10-27 | 华进半导体封装先导技术研发中心有限公司 | 通孔填充方法及结构 |
CN111834234A (zh) * | 2020-07-28 | 2020-10-27 | 华进半导体封装先导技术研发中心有限公司 | 通孔填充方法及结构 |
Also Published As
Publication number | Publication date |
---|---|
TWI232565B (en) | 2005-05-11 |
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