TW200518292A - Semiconductor chip-carrying substrate and its manufacturing method - Google Patents

Semiconductor chip-carrying substrate and its manufacturing method

Info

Publication number
TW200518292A
TW200518292A TW092133464A TW92133464A TW200518292A TW 200518292 A TW200518292 A TW 200518292A TW 092133464 A TW092133464 A TW 092133464A TW 92133464 A TW92133464 A TW 92133464A TW 200518292 A TW200518292 A TW 200518292A
Authority
TW
Taiwan
Prior art keywords
holes
manufacturing
semiconductor chip
carrying substrate
metal substrate
Prior art date
Application number
TW092133464A
Other languages
English (en)
Other versions
TWI232565B (en
Inventor
rong-gan Lin
Original Assignee
Hsuan Chi Kuang Tien Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hsuan Chi Kuang Tien Semiconductor Corp filed Critical Hsuan Chi Kuang Tien Semiconductor Corp
Priority to TW092133464A priority Critical patent/TWI232565B/zh
Application granted granted Critical
Publication of TWI232565B publication Critical patent/TWI232565B/zh
Publication of TW200518292A publication Critical patent/TW200518292A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)
TW092133464A 2003-11-28 2003-11-28 Semiconductor chip-carrying substrate and its manufacturing method TWI232565B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW092133464A TWI232565B (en) 2003-11-28 2003-11-28 Semiconductor chip-carrying substrate and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092133464A TWI232565B (en) 2003-11-28 2003-11-28 Semiconductor chip-carrying substrate and its manufacturing method

Publications (2)

Publication Number Publication Date
TWI232565B TWI232565B (en) 2005-05-11
TW200518292A true TW200518292A (en) 2005-06-01

Family

ID=36320067

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092133464A TWI232565B (en) 2003-11-28 2003-11-28 Semiconductor chip-carrying substrate and its manufacturing method

Country Status (1)

Country Link
TW (1) TWI232565B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111834234A (zh) * 2020-07-28 2020-10-27 华进半导体封装先导技术研发中心有限公司 通孔填充方法及结构
CN111834235A (zh) * 2020-07-28 2020-10-27 华进半导体封装先导技术研发中心有限公司 通孔填充方法及结构

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111834234A (zh) * 2020-07-28 2020-10-27 华进半导体封装先导技术研发中心有限公司 通孔填充方法及结构
CN111834235A (zh) * 2020-07-28 2020-10-27 华进半导体封装先导技术研发中心有限公司 通孔填充方法及结构

Also Published As

Publication number Publication date
TWI232565B (en) 2005-05-11

Similar Documents

Publication Publication Date Title
TW200625572A (en) Three dimensional package structure of semiconductor chip embedded in substrate and method for fabricating the same
TWI257135B (en) Thermally enhanced three dimension package and method for manufacturing the same
TWI256719B (en) Semiconductor device package module and manufacturing method thereof
WO2006132822A3 (en) Method for making electronic devices
TW200514284A (en) LED lighting source and LED lighting apparatus
TW200733275A (en) Semiconductor device and method of manufacturing the same
SG122895A1 (en) Hyper thermally enhanced semiconductor package system
TW200614446A (en) Chip package structure, chip packaging process, chip carrier and manufacturing process thereof
TW200605282A (en) Manufacturing method of semiconductor device
TW200509337A (en) Semiconductor assembled heat sink structure for embedding electronic components
TW200620464A (en) Semiconductor device and methods for fabricating the same
WO2009142391A3 (ko) 발광소자 패키지 및 그 제조방법
TW200717826A (en) Method for manufacturing semiconductor package
TW200603374A (en) Semiconductor device and method of manufacturing the same
TW200802635A (en) Heat sink package structure and method for fabricating the same
TW200634955A (en) Semiconductor device and semiconductor-device manufacturing method
TW200644196A (en) Method for forimg wafer-level heat spreader structure and packaging structure thereof
TW200717668A (en) Semiconductor device, method for manufacturing such semiconductor device and substrate for such semiconductor device
TW200618222A (en) Heat dissipating package structure and fabrication method thereof
SG113495A1 (en) Thermally enhanced stacked die package
TW200601468A (en) Method for fabricating semiconductor package
TW200518292A (en) Semiconductor chip-carrying substrate and its manufacturing method
TWI256105B (en) Method of forming chip type low-k dielectric layer
TW200744161A (en) Method for manufacturing semiconductor device
TW200725841A (en) Thermally enhanced thin flip-chip package