TW200517528A - Material with excellent compressing and stamping performance for electric device - Google Patents

Material with excellent compressing and stamping performance for electric device

Info

Publication number
TW200517528A
TW200517528A TW093136481A TW93136481A TW200517528A TW 200517528 A TW200517528 A TW 200517528A TW 093136481 A TW093136481 A TW 093136481A TW 93136481 A TW93136481 A TW 93136481A TW 200517528 A TW200517528 A TW 200517528A
Authority
TW
Taiwan
Prior art keywords
electric device
mol
stamping performance
crystal grains
compressing
Prior art date
Application number
TW093136481A
Other languages
Chinese (zh)
Other versions
TWI296659B (en
Inventor
Yasutaka Sugawara
Kazuhiko Fukamachi
Original Assignee
Nikko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikko Materials Co Ltd filed Critical Nikko Materials Co Ltd
Publication of TW200517528A publication Critical patent/TW200517528A/en
Application granted granted Critical
Publication of TWI296659B publication Critical patent/TWI296659B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Conductive Materials (AREA)

Abstract

This invention provides a material for an electric device, which can maintain excellent copper alloy material characteristics and display excellent compressing and stamping performance. This invention is to coat the copper alloy with Cu of thickness of 0.05 to 2.00 μm. The Cu alloy comprises 0.1 to 5.0 mass% of one or more kinds of metals in which the standard formation free energy of carbide is ⋚ -42 kJ/mol (≥42 kJ/mol in absolute value) and the balance with Cu and unavoidable impurities, in which the diameter of the equivalent circle of the crystal grains in the cross-section parallel to the rolling direction is 0.5 to 30 μm on the average value, and the average value of an aspect ratio as the ratio between the width and length in the crystal grains is greater than 1/5.
TW093136481A 2003-11-28 2004-11-26 Material with excellent compressing and stamping performance for electric device TW200517528A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003399810 2003-11-28

Publications (2)

Publication Number Publication Date
TW200517528A true TW200517528A (en) 2005-06-01
TWI296659B TWI296659B (en) 2008-05-11

Family

ID=34779850

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093136481A TW200517528A (en) 2003-11-28 2004-11-26 Material with excellent compressing and stamping performance for electric device

Country Status (3)

Country Link
KR (1) KR100676668B1 (en)
CN (1) CN1306050C (en)
TW (1) TW200517528A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110042272B (en) * 2019-05-28 2020-09-01 中南大学 High-conductivity high-strength CuFeNb-series elastic copper alloy and preparation method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07116573B2 (en) * 1985-03-05 1995-12-13 古河電気工業株式会社 Manufacturing method of Cu-based strip for lead frame
JPH01101148A (en) * 1987-10-15 1989-04-19 Matsushita Electric Works Ltd Laminate board
JPH0689440B2 (en) * 1988-06-08 1994-11-09 同和鉱業株式会社 Manufacturing method of high-strength conductive copper-based alloy with excellent press formability
JPH02117701A (en) * 1988-10-25 1990-05-02 Mitsui High Tec Inc Manufacture of composite material for lead frame
JPH1060562A (en) * 1996-08-14 1998-03-03 Furukawa Electric Co Ltd:The Copper alloy for electronic equipment and its production
KR100513947B1 (en) * 2002-03-29 2005-09-09 닛코 킨조쿠 가부시키가이샤 A copper alloy having good pressing workability and manufacturing method therefor

Also Published As

Publication number Publication date
KR100676668B1 (en) 2007-01-31
CN1306050C (en) 2007-03-21
CN1621546A (en) 2005-06-01
KR20050052352A (en) 2005-06-02
TWI296659B (en) 2008-05-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees