TW200517028A - Leadframe for enhancing solder bonding reliability of leads and method of solder bonding - Google Patents
Leadframe for enhancing solder bonding reliability of leads and method of solder bondingInfo
- Publication number
- TW200517028A TW200517028A TW092131049A TW92131049A TW200517028A TW 200517028 A TW200517028 A TW 200517028A TW 092131049 A TW092131049 A TW 092131049A TW 92131049 A TW92131049 A TW 92131049A TW 200517028 A TW200517028 A TW 200517028A
- Authority
- TW
- Taiwan
- Prior art keywords
- solder
- solder bonding
- leads
- layer
- lead body
- Prior art date
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
A leadframe for enhancing solder bonding reliabilityof leads and method of solder bonding are proposed. An electronic component (e.g. Thin Small Outline Package, TSOP) having a plurality of outer leads to respectively contact with at least one circuit board is provided and the outer lead has a lead body, a stress buffer layer (e.g. nickel layer) plating onto a surface of the lead body and a leadless solder layer (such as pure tin or Sn-Bi, Sn-Cu alloy solder material) for coating the stress buffer layer. The stress buffer layer interposed between the lead body and the leadless solder layer can absorb excess thermal stress of the lead body and the leadless solder layer, so as to avoid whisker resulting from protrusion of metal atoms with higher CTE in a surface of the solder material by excess thermal stress, and enhance solder bonding reliability of leads.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092131049A TWI246373B (en) | 2003-11-06 | 2003-11-06 | Leadframe for enhancing solder bonding reliability of leads and method of solder bonding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092131049A TWI246373B (en) | 2003-11-06 | 2003-11-06 | Leadframe for enhancing solder bonding reliability of leads and method of solder bonding |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200517028A true TW200517028A (en) | 2005-05-16 |
TWI246373B TWI246373B (en) | 2005-12-21 |
Family
ID=37191418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092131049A TWI246373B (en) | 2003-11-06 | 2003-11-06 | Leadframe for enhancing solder bonding reliability of leads and method of solder bonding |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI246373B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108668437A (en) * | 2017-03-27 | 2018-10-16 | 三星电子株式会社 | Metal unit is installed and the electronic equipment of metal unit is installed including surface in surface |
-
2003
- 2003-11-06 TW TW092131049A patent/TWI246373B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108668437A (en) * | 2017-03-27 | 2018-10-16 | 三星电子株式会社 | Metal unit is installed and the electronic equipment of metal unit is installed including surface in surface |
Also Published As
Publication number | Publication date |
---|---|
TWI246373B (en) | 2005-12-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |