TW200517028A - Leadframe for enhancing solder bonding reliability of leads and method of solder bonding - Google Patents

Leadframe for enhancing solder bonding reliability of leads and method of solder bonding

Info

Publication number
TW200517028A
TW200517028A TW092131049A TW92131049A TW200517028A TW 200517028 A TW200517028 A TW 200517028A TW 092131049 A TW092131049 A TW 092131049A TW 92131049 A TW92131049 A TW 92131049A TW 200517028 A TW200517028 A TW 200517028A
Authority
TW
Taiwan
Prior art keywords
solder
solder bonding
leads
layer
lead body
Prior art date
Application number
TW092131049A
Other languages
Chinese (zh)
Other versions
TWI246373B (en
Inventor
Don-Son Jiang
Yu-Po Wang
Cheng-Hsu Hsiao
Original Assignee
Siliconware Precision Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siliconware Precision Industries Co Ltd filed Critical Siliconware Precision Industries Co Ltd
Priority to TW092131049A priority Critical patent/TWI246373B/en
Publication of TW200517028A publication Critical patent/TW200517028A/en
Application granted granted Critical
Publication of TWI246373B publication Critical patent/TWI246373B/en

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  • Lead Frames For Integrated Circuits (AREA)

Abstract

A leadframe for enhancing solder bonding reliabilityof leads and method of solder bonding are proposed. An electronic component (e.g. Thin Small Outline Package, TSOP) having a plurality of outer leads to respectively contact with at least one circuit board is provided and the outer lead has a lead body, a stress buffer layer (e.g. nickel layer) plating onto a surface of the lead body and a leadless solder layer (such as pure tin or Sn-Bi, Sn-Cu alloy solder material) for coating the stress buffer layer. The stress buffer layer interposed between the lead body and the leadless solder layer can absorb excess thermal stress of the lead body and the leadless solder layer, so as to avoid whisker resulting from protrusion of metal atoms with higher CTE in a surface of the solder material by excess thermal stress, and enhance solder bonding reliability of leads.
TW092131049A 2003-11-06 2003-11-06 Leadframe for enhancing solder bonding reliability of leads and method of solder bonding TWI246373B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW092131049A TWI246373B (en) 2003-11-06 2003-11-06 Leadframe for enhancing solder bonding reliability of leads and method of solder bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092131049A TWI246373B (en) 2003-11-06 2003-11-06 Leadframe for enhancing solder bonding reliability of leads and method of solder bonding

Publications (2)

Publication Number Publication Date
TW200517028A true TW200517028A (en) 2005-05-16
TWI246373B TWI246373B (en) 2005-12-21

Family

ID=37191418

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092131049A TWI246373B (en) 2003-11-06 2003-11-06 Leadframe for enhancing solder bonding reliability of leads and method of solder bonding

Country Status (1)

Country Link
TW (1) TWI246373B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108668437A (en) * 2017-03-27 2018-10-16 三星电子株式会社 Metal unit is installed and the electronic equipment of metal unit is installed including surface in surface

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108668437A (en) * 2017-03-27 2018-10-16 三星电子株式会社 Metal unit is installed and the electronic equipment of metal unit is installed including surface in surface

Also Published As

Publication number Publication date
TWI246373B (en) 2005-12-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees