TW200516034A - Process of resin plate of package material and a cap forming device - Google Patents

Process of resin plate of package material and a cap forming device

Info

Publication number
TW200516034A
TW200516034A TW092132121A TW92132121A TW200516034A TW 200516034 A TW200516034 A TW 200516034A TW 092132121 A TW092132121 A TW 092132121A TW 92132121 A TW92132121 A TW 92132121A TW 200516034 A TW200516034 A TW 200516034A
Authority
TW
Taiwan
Prior art keywords
cap
resin plate
forming device
package material
mentioned
Prior art date
Application number
TW092132121A
Other languages
Chinese (zh)
Other versions
TWI308896B (en
Inventor
Kazuo Ueda
Mitsuhiko Shinohara
Yoshifumi Miki
Hiroshi Kondo
Original Assignee
Shikoku Kakoki Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shikoku Kakoki Kabushiki Kaisha filed Critical Shikoku Kakoki Kabushiki Kaisha
Priority to TW092132121A priority Critical patent/TW200516034A/en
Publication of TW200516034A publication Critical patent/TW200516034A/en
Application granted granted Critical
Publication of TWI308896B publication Critical patent/TWI308896B/zh

Links

Landscapes

  • Closures For Containers (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

This invention of a process of resin plate of package material and a cap forming device without heating mechanism to form the above-mentioned material as a form-retainable cap, includes: to punch one or more than two cap blanks from the resin plate of package material by cap forming device (1); to shape the above-mentioned cap blanks into desired shapes by forming concave module (7) and convex module (5). The above-mentioned forming concave (7) is provided with several channels (73) or prominences set along its inner periphery; the above-mentioned convex module (5) is provided with several channels or prominences along its outer periphery.
TW092132121A 2003-11-14 2003-11-14 Process of resin plate of package material and a cap forming device TW200516034A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW092132121A TW200516034A (en) 2003-11-14 2003-11-14 Process of resin plate of package material and a cap forming device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092132121A TW200516034A (en) 2003-11-14 2003-11-14 Process of resin plate of package material and a cap forming device

Publications (2)

Publication Number Publication Date
TW200516034A true TW200516034A (en) 2005-05-16
TWI308896B TWI308896B (en) 2009-04-21

Family

ID=45071925

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092132121A TW200516034A (en) 2003-11-14 2003-11-14 Process of resin plate of package material and a cap forming device

Country Status (1)

Country Link
TW (1) TW200516034A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI554353B (en) * 2009-12-25 2016-10-21 Shibaura Mechatronics Corp Sealing device
CN108380780A (en) * 2018-04-23 2018-08-10 华源包装（咸宁）有限公司 A kind of lid equipment processed
CN113387009A (en) * 2021-06-11 2021-09-14 温州市中心医院 Medicine bottle adds medicine production line
WO2022237127A1 (en) * 2021-05-13 2022-11-17 新天力科技股份有限公司 Cover body forming system and manufacturing method for cover body

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI554353B (en) * 2009-12-25 2016-10-21 Shibaura Mechatronics Corp Sealing device
CN108380780A (en) * 2018-04-23 2018-08-10 华源包装（咸宁）有限公司 A kind of lid equipment processed
WO2022237127A1 (en) * 2021-05-13 2022-11-17 新天力科技股份有限公司 Cover body forming system and manufacturing method for cover body
CN113387009A (en) * 2021-06-11 2021-09-14 温州市中心医院 Medicine bottle adds medicine production line

Also Published As

Publication number Publication date
TWI308896B (en) 2009-04-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees