TW200514872A - Method and system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface - Google Patents

Method and system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface

Info

Publication number
TW200514872A
TW200514872A TW093129188A TW93129188A TW200514872A TW 200514872 A TW200514872 A TW 200514872A TW 093129188 A TW093129188 A TW 093129188A TW 93129188 A TW93129188 A TW 93129188A TW 200514872 A TW200514872 A TW 200514872A
Authority
TW
Taiwan
Prior art keywords
plating
metal
substrate surface
current distribution
automatically controlling
Prior art date
Application number
TW093129188A
Other languages
Chinese (zh)
Inventor
Matthias Bonkass
Dirk Wollstein
Axel Preusse
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of TW200514872A publication Critical patent/TW200514872A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

An electroplating tool is operated in combination with a controller which automatically determines the individual currents for a multi-anode configuration of the plating tool. The calculation of the anode currents may be based on sensitivity data and measurement data as well as on a desired target profile, so that a fast response with respect to process variations may be achieved even for a plating tool including a plurality of process chambers.
TW093129188A 2003-09-30 2004-09-27 Method and system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface TW200514872A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10345376A DE10345376B4 (en) 2003-09-30 2003-09-30 A method and system for automatically controlling a current distribution of a multi-anode array during plating a metal onto a substrate surface
US10/861,997 US20050067290A1 (en) 2003-09-30 2004-06-04 Method and system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface

Publications (1)

Publication Number Publication Date
TW200514872A true TW200514872A (en) 2005-05-01

Family

ID=34353211

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093129188A TW200514872A (en) 2003-09-30 2004-09-27 Method and system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface

Country Status (4)

Country Link
US (1) US20050067290A1 (en)
CN (1) CN1860259A (en)
DE (1) DE10345376B4 (en)
TW (1) TW200514872A (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI429788B (en) * 2006-12-28 2014-03-11 Uyemura C & Co Ltd Method of determining the operating condition of a rotary surface treatment device
DE102007030052B4 (en) * 2007-06-29 2015-10-01 Advanced Micro Devices, Inc. Automatic deposition profile target control
DE102008009641A1 (en) * 2007-08-31 2009-03-05 Advanced Micro Devices, Inc., Sunnyvale Profile control in ring anode plating chambers for multi-step recipes
US8197660B2 (en) 2007-09-10 2012-06-12 Infineon Technologies Ag Electro chemical deposition systems and methods of manufacturing using the same
TW201720969A (en) * 2015-12-14 2017-06-16 台灣先進系統股份有限公司 Adjustable insoluable anode plate for cu-pillar electroplating and method thereof
CN106093519A (en) * 2016-06-03 2016-11-09 厦门市星云睿自动化科技有限公司 Electroplating current based on ZigBee monitoring system
EP3287550B1 (en) 2016-08-23 2019-02-13 ATOTECH Deutschland GmbH Device for vertical galvanic metal deposition on a substrate
CN110512248B (en) 2018-05-21 2022-04-12 盛美半导体设备(上海)股份有限公司 Electroplating apparatus and electroplating method
US11427905B2 (en) * 2019-03-27 2022-08-30 Innoven Energy Llc Controlled variable thickness film deposition on a non-flat substrate for high volume manufacturing
CN112575365A (en) * 2019-09-29 2021-03-30 张宇明 Electroplating anode and electroplating method using same
CN114540921A (en) * 2020-11-26 2022-05-27 盛美半导体设备(上海)股份有限公司 Electroplating apparatus and method
DE102023105206A1 (en) 2023-03-02 2024-09-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Method and system for producing a substrate by means of copper deposition and corresponding substrate

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6027631A (en) * 1997-11-13 2000-02-22 Novellus Systems, Inc. Electroplating system with shields for varying thickness profile of deposited layer
US6113462A (en) * 1997-12-18 2000-09-05 Advanced Micro Devices, Inc. Feedback loop for selective conditioning of chemical mechanical polishing pad
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US6213848B1 (en) * 1999-08-11 2001-04-10 Advanced Micro Devices, Inc. Method for determining a polishing recipe based upon the measured pre-polish thickness of a process layer
US6217412B1 (en) * 1999-08-11 2001-04-17 Advanced Micro Devices, Inc. Method for characterizing polish pad lots to eliminate or reduce tool requalification after changing a polishing pad
US6546306B1 (en) * 1999-08-11 2003-04-08 Advanced Micro Devices, Inc. Method for adjusting incoming film thickness uniformity such that variations across the film after polishing minimized
US6387800B1 (en) * 1999-12-20 2002-05-14 Taiwan Semiconductor Manufacturing Company Method of forming barrier and seed layers for electrochemical deposition of copper
US6592429B1 (en) * 2000-07-28 2003-07-15 Advanced Micro Devices, Inc. Method and apparatus for controlling wafer uniformity in a chemical mechanical polishing tool using carrier head signatures

Also Published As

Publication number Publication date
US20050067290A1 (en) 2005-03-31
DE10345376B4 (en) 2009-04-16
DE10345376A1 (en) 2005-05-12
CN1860259A (en) 2006-11-08

Similar Documents

Publication Publication Date Title
TW200514872A (en) Method and system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
Zhang et al. Effects of electric parameters on properties of anodic coatings formed on magnesium alloys
WO2006050401A3 (en) Processes and systems for formation of high voltage, anodic oxide on a valve metal anode
MY145206A (en) Apparatus for plating semiconductor wafers
WO2003038159A3 (en) Method and conveyorized system for electrolytically processing work pieces
PL404171A1 (en) Apparatus for use in electrolytic refining and in the electrolytic production of metals
JP2003534460A5 (en)
WO2005090639A3 (en) Monitoring electrolytic cell currents
WO2005012597A3 (en) Method and apparatus for electrowinning copper using the ferrous/ferric anode reaction
WO2004083488A3 (en) Electrolytic cell for production of aluminum from alumina
SA519402408B1 (en) Pulsed electrolysis with reference to the open circuit voltage
WO2011063353A3 (en) Electrolyte solution and electropolishing methods
WO2004097074A3 (en) Process and apparatus for positioning replacement anodes in electrolytic cells
BRPI0605050A (en) method for controlling an aluminum reduction cell with pre-cooked anodes
WO2007132081A3 (en) Method for making anodes for aluminum production by fused-salt electrolysis, resulting anodes and use thereof
EP1344849A4 (en) Electrolytic copper plating method, electrolytic copper plating-use phosphorus-containing copper anode and semiconductor wafer with little particles deposition plated by using them
WO2005033377A3 (en) A method and a system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
WO2005021838A3 (en) Measuring duct offgas temperatures to improve electrolytic cell energy efficiency
AU2003249927A8 (en) Device and method for monitoring an electrolytic process
EP1683888A3 (en) Method and apparatus for cathodic arc deposition
CN205652973U (en) Elevator guide rail base
JP2006063448A (en) Apparatus and method for electroplating workpiece
NZ732578A (en) A modified electrolysis cell and a method for modifying same
WO2009044266A3 (en) System and method of plating metal alloys by using galvanic technology
ES2375057T8 (en) METAL ELECTROLYTIC EXTRACTION CELL OF METALS WITH ELECTROLYTE PURIFIER.