DE10345376A1 - A method and system for automatically controlling a current distribution of a multi-anode array during plating a metal onto a substrate surface - Google Patents

A method and system for automatically controlling a current distribution of a multi-anode array during plating a metal onto a substrate surface Download PDF

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Publication number
DE10345376A1
DE10345376A1 DE10345376A DE10345376A DE10345376A1 DE 10345376 A1 DE10345376 A1 DE 10345376A1 DE 10345376 A DE10345376 A DE 10345376A DE 10345376 A DE10345376 A DE 10345376A DE 10345376 A1 DE10345376 A1 DE 10345376A1
Authority
DE
Germany
Prior art keywords
substrate surface
current distribution
automatically controlling
array during
metal onto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE10345376A
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German (de)
Other versions
DE10345376B4 (en
Inventor
Matthias Bonkass
Dirk Wollstein
Axel Preusse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Priority to DE10345376A priority Critical patent/DE10345376B4/en
Priority to US10/861,997 priority patent/US20050067290A1/en
Priority to GB0605102A priority patent/GB2419893B/en
Priority to PCT/US2004/030761 priority patent/WO2005033377A2/en
Priority to JP2006533939A priority patent/JP2007507615A/en
Priority to CNA2004800285231A priority patent/CN1860259A/en
Priority to KR1020067006278A priority patent/KR20060090822A/en
Priority to TW093129188A priority patent/TW200514872A/en
Publication of DE10345376A1 publication Critical patent/DE10345376A1/en
Application granted granted Critical
Publication of DE10345376B4 publication Critical patent/DE10345376B4/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

Abstract

Es wird eine Elektroplattierungsanlage in Kombination mit einer Steuerung betrieben, die automatisch die einzelnen Ströme für eine Mehrfachanodenkonfiguration der Plattierungsanlage bestimmt. Die Berechnung der Anodenströme kann auf Sensitivitätsdaten und Messdaten sowie auf einem gewünschten Sollprofil beruhen, so dass eine schnelle Reaktion in Bezug auf Prozessschwankungen erreicht werden kann, selbst wenn die Plattierungsanlage mehrere Prozesskammern aufweist.An electroplating plant is operated in combination with a controller that automatically determines the individual streams for a multi-anode configuration of the plating plant. The calculation of the anode currents may be based on sensitivity data and measurement data, as well as on a desired target profile, so that a fast response to process variations can be achieved even if the plating plant has multiple process chambers.

DE10345376A 2003-09-30 2003-09-30 A method and system for automatically controlling a current distribution of a multi-anode array during plating a metal onto a substrate surface Expired - Lifetime DE10345376B4 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE10345376A DE10345376B4 (en) 2003-09-30 2003-09-30 A method and system for automatically controlling a current distribution of a multi-anode array during plating a metal onto a substrate surface
US10/861,997 US20050067290A1 (en) 2003-09-30 2004-06-04 Method and system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
PCT/US2004/030761 WO2005033377A2 (en) 2003-09-30 2004-09-17 A method and a system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
JP2006533939A JP2007507615A (en) 2003-09-30 2004-09-17 Method and system for automatically controlling the distribution of current to a multi-anode structure during metal plating on a substrate surface
GB0605102A GB2419893B (en) 2003-09-30 2004-09-17 A method and a system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
CNA2004800285231A CN1860259A (en) 2003-09-30 2004-09-17 A method and a system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
KR1020067006278A KR20060090822A (en) 2003-09-30 2004-09-17 A method and a system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
TW093129188A TW200514872A (en) 2003-09-30 2004-09-27 Method and system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10345376A DE10345376B4 (en) 2003-09-30 2003-09-30 A method and system for automatically controlling a current distribution of a multi-anode array during plating a metal onto a substrate surface

Publications (2)

Publication Number Publication Date
DE10345376A1 true DE10345376A1 (en) 2005-05-12
DE10345376B4 DE10345376B4 (en) 2009-04-16

Family

ID=34353211

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10345376A Expired - Lifetime DE10345376B4 (en) 2003-09-30 2003-09-30 A method and system for automatically controlling a current distribution of a multi-anode array during plating a metal onto a substrate surface

Country Status (4)

Country Link
US (1) US20050067290A1 (en)
CN (1) CN1860259A (en)
DE (1) DE10345376B4 (en)
TW (1) TW200514872A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007030052B4 (en) * 2007-06-29 2015-10-01 Advanced Micro Devices, Inc. Automatic deposition profile target control

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* Cited by examiner, † Cited by third party
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KR101451778B1 (en) * 2006-12-28 2014-10-16 우에무라 고교 가부시키가이샤 Method of determining operating condition for rotary surface treating apparatus
DE102008009641A1 (en) * 2007-08-31 2009-03-05 Advanced Micro Devices, Inc., Sunnyvale Profile control in ring anode plating chambers for multi-step recipes
US8197660B2 (en) 2007-09-10 2012-06-12 Infineon Technologies Ag Electro chemical deposition systems and methods of manufacturing using the same
TW201720969A (en) * 2015-12-14 2017-06-16 台灣先進系統股份有限公司 Adjustable insoluable anode plate for cu-pillar electroplating and method thereof
CN106093519A (en) * 2016-06-03 2016-11-09 厦门市星云睿自动化科技有限公司 Electroplating current based on ZigBee monitoring system
EP3287550B1 (en) * 2016-08-23 2019-02-13 ATOTECH Deutschland GmbH Device for vertical galvanic metal deposition on a substrate
CN110512248B (en) 2018-05-21 2022-04-12 盛美半导体设备(上海)股份有限公司 Electroplating apparatus and electroplating method
US11427905B2 (en) * 2019-03-27 2022-08-30 Innoven Energy Llc Controlled variable thickness film deposition on a non-flat substrate for high volume manufacturing
CN112575365A (en) * 2019-09-29 2021-03-30 张宇明 Electroplating anode and electroplating method using same
CN114540921A (en) * 2020-11-26 2022-05-27 盛美半导体设备(上海)股份有限公司 Electroplating apparatus and method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020125141A1 (en) * 1999-04-13 2002-09-12 Wilson Gregory J. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US20020139678A1 (en) * 1999-04-13 2002-10-03 Wilson Gregory J. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece

Family Cites Families (7)

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Publication number Priority date Publication date Assignee Title
US6027631A (en) * 1997-11-13 2000-02-22 Novellus Systems, Inc. Electroplating system with shields for varying thickness profile of deposited layer
US6113462A (en) * 1997-12-18 2000-09-05 Advanced Micro Devices, Inc. Feedback loop for selective conditioning of chemical mechanical polishing pad
US6546306B1 (en) * 1999-08-11 2003-04-08 Advanced Micro Devices, Inc. Method for adjusting incoming film thickness uniformity such that variations across the film after polishing minimized
US6213848B1 (en) * 1999-08-11 2001-04-10 Advanced Micro Devices, Inc. Method for determining a polishing recipe based upon the measured pre-polish thickness of a process layer
US6217412B1 (en) * 1999-08-11 2001-04-17 Advanced Micro Devices, Inc. Method for characterizing polish pad lots to eliminate or reduce tool requalification after changing a polishing pad
US6387800B1 (en) * 1999-12-20 2002-05-14 Taiwan Semiconductor Manufacturing Company Method of forming barrier and seed layers for electrochemical deposition of copper
US6592429B1 (en) * 2000-07-28 2003-07-15 Advanced Micro Devices, Inc. Method and apparatus for controlling wafer uniformity in a chemical mechanical polishing tool using carrier head signatures

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020125141A1 (en) * 1999-04-13 2002-09-12 Wilson Gregory J. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US20020139678A1 (en) * 1999-04-13 2002-10-03 Wilson Gregory J. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007030052B4 (en) * 2007-06-29 2015-10-01 Advanced Micro Devices, Inc. Automatic deposition profile target control

Also Published As

Publication number Publication date
DE10345376B4 (en) 2009-04-16
TW200514872A (en) 2005-05-01
CN1860259A (en) 2006-11-08
US20050067290A1 (en) 2005-03-31

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