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Application filed by Symmorphix IncfiledCriticalSymmorphix Inc
Publication of TW200512872ApublicationCriticalpatent/TW200512872A/en
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Publication of TWI334194BpublicationCriticalpatent/TWI334194B/en
In accordance with the present invention, a dielectric barrier layer is presented. A barrier layer according to the present invention includes a densified amorphous dielectric layer deposited on a substrate by pulsed-DC, substrate biased physical vapor deposition, wherein the densified amorphous dielectric layer is a barrier layer. A method of forming a barrier layer according to the present inventions includes providing a substrate and depositing a highly densified, amorphous, dielectric material over the substrate in a pulsed-dc, biased, wide target physical vapor deposition process. Further, the process can include performing a soft-metal breath treatment on the substrate. Such barrier layers can be utilized as electrical layers, optical layers, immunological layers, or tribological layers.
TW93114493A2003-09-252004-05-21Dielectric barrier layer films
TWI334194B
(en)
Method for producing an organic light-emitting diode device having a structure with a textured surface and resulting oled having a structure with a textured surface