TW200512310A - Substrate processing apparatus - Google Patents

Substrate processing apparatus

Info

Publication number
TW200512310A
TW200512310A TW093122227A TW93122227A TW200512310A TW 200512310 A TW200512310 A TW 200512310A TW 093122227 A TW093122227 A TW 093122227A TW 93122227 A TW93122227 A TW 93122227A TW 200512310 A TW200512310 A TW 200512310A
Authority
TW
Taiwan
Prior art keywords
pin
substrate
processing apparatus
gas
substrate processing
Prior art date
Application number
TW093122227A
Other languages
Chinese (zh)
Other versions
TWI297737B (en
Inventor
yong-feng Chen
Original Assignee
Chi Mei Optoelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chi Mei Optoelectronics Corp filed Critical Chi Mei Optoelectronics Corp
Publication of TW200512310A publication Critical patent/TW200512310A/en
Application granted granted Critical
Publication of TWI297737B publication Critical patent/TWI297737B/en

Links

Landscapes

  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A substrate processing apparatus is capable of decreasing the jam of the substrate transferring after the substrate moving up or down in reaction chambers of semiconductor equipments like CVD equipments, the decreasing of jam increases the productivity of LCD array substrates.The substrate processing apparatus 10 comprises: a pin 12 supporting, lifting and lowering the substrate 42; a pin guider 14, formed into a tube-shape allowing the pin 12 pass through, which has inward surface forming with concaves 19; a gas introducing hole 16 transporting gas into the pin guider 14 and a exhausting hole 18 exhausting the gas. The gas transported into the pin guider 14 can form an air-bearing layer between the pin 12 and the pin guider 14 and make the pin 12 move up-down smoothly.
TW93122227A 2003-07-24 2004-07-23 Substrate processing apparatus TWI297737B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003200989A JP4412640B2 (en) 2003-07-24 2003-07-24 Substrate processing equipment

Publications (2)

Publication Number Publication Date
TW200512310A true TW200512310A (en) 2005-04-01
TWI297737B TWI297737B (en) 2008-06-11

Family

ID=34261205

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93122227A TWI297737B (en) 2003-07-24 2004-07-23 Substrate processing apparatus

Country Status (2)

Country Link
JP (1) JP4412640B2 (en)
TW (1) TWI297737B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100367485C (en) * 2003-04-21 2008-02-06 东京毅力科创株式会社 Device for applying semiconductor treatment to treatment subject substrate
JP6451508B2 (en) * 2015-05-29 2019-01-16 株式会社Sumco Epitaxial growth apparatus, epitaxial wafer manufacturing method, and lift pin for epitaxial growth apparatus

Also Published As

Publication number Publication date
TWI297737B (en) 2008-06-11
JP4412640B2 (en) 2010-02-10
JP2005042141A (en) 2005-02-17

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees