TW200511541A - Fine pitch gold bump fabrication process and its package article - Google Patents

Fine pitch gold bump fabrication process and its package article

Info

Publication number
TW200511541A
TW200511541A TW092124453A TW92124453A TW200511541A TW 200511541 A TW200511541 A TW 200511541A TW 092124453 A TW092124453 A TW 092124453A TW 92124453 A TW92124453 A TW 92124453A TW 200511541 A TW200511541 A TW 200511541A
Authority
TW
Taiwan
Prior art keywords
gold
fabrication process
fine pitch
bump
gold bump
Prior art date
Application number
TW092124453A
Other languages
Chinese (zh)
Other versions
TWI222198B (en
Inventor
song-ping Lu
Kun-Yong Huang
yan-qing Lin
zhong-bang Qi
Original Assignee
Fupo Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fupo Electronics Corp filed Critical Fupo Electronics Corp
Priority to TW092124453A priority Critical patent/TWI222198B/en
Application granted granted Critical
Publication of TWI222198B publication Critical patent/TWI222198B/en
Publication of TW200511541A publication Critical patent/TW200511541A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

A fine pitch gold bump fabrication process is carried out on a wafer, which has a plurality of chips, each of which has a plurality of bump pads. The fabrication process comprises forming a gold electroplating seed metal film with thickness of 1500-2500 Å on the wafer where there are bump pads, electroplating a gold metal pattern layer on the electroplating seed metal film, in which the metal pattern layer has a plurality of gold bumps individually located on the bump pads, and finally removing the portion of the electroplating seed metal film, which is not located beneath the gold bumps to complete the gold bump fabrication process with pitch of 15-35 μm. Therefore, good height uniformity of the gold bumps and high degree of surface planarity of the gold bumps are achieved.
TW092124453A 2003-09-04 2003-09-04 Fine pitch gold bump fabrication process and its package article TWI222198B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW092124453A TWI222198B (en) 2003-09-04 2003-09-04 Fine pitch gold bump fabrication process and its package article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092124453A TWI222198B (en) 2003-09-04 2003-09-04 Fine pitch gold bump fabrication process and its package article

Publications (2)

Publication Number Publication Date
TWI222198B TWI222198B (en) 2004-10-11
TW200511541A true TW200511541A (en) 2005-03-16

Family

ID=34433011

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092124453A TWI222198B (en) 2003-09-04 2003-09-04 Fine pitch gold bump fabrication process and its package article

Country Status (1)

Country Link
TW (1) TWI222198B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385281B (en) * 2005-09-30 2013-02-11 Metalor Technologies Japan Corp Gold bump or gold wiring formation method
US9450061B2 (en) 2013-05-06 2016-09-20 Himax Technologies Limited Metal bump structure for use in driver IC and method for forming the same
CN112864021A (en) * 2019-11-27 2021-05-28 南茂科技股份有限公司 Conductive bump and method for making the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385281B (en) * 2005-09-30 2013-02-11 Metalor Technologies Japan Corp Gold bump or gold wiring formation method
US9450061B2 (en) 2013-05-06 2016-09-20 Himax Technologies Limited Metal bump structure for use in driver IC and method for forming the same
US10128348B2 (en) 2013-05-06 2018-11-13 Himax Technologies Limited Metal bump structure for use in driver IC and method for forming the same
CN112864021A (en) * 2019-11-27 2021-05-28 南茂科技股份有限公司 Conductive bump and method for making the same

Also Published As

Publication number Publication date
TWI222198B (en) 2004-10-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees