TW200510934A - Radiation-sensitive resin composition and method for forming pattern using the composition - Google Patents
Radiation-sensitive resin composition and method for forming pattern using the compositionInfo
- Publication number
- TW200510934A TW200510934A TW093117021A TW93117021A TW200510934A TW 200510934 A TW200510934 A TW 200510934A TW 093117021 A TW093117021 A TW 093117021A TW 93117021 A TW93117021 A TW 93117021A TW 200510934 A TW200510934 A TW 200510934A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- alkali
- weight
- parts
- radiation
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
Abstract
A radiation-sensitive resin composition containing (A) 100 parts by weight of alkali-soluble resin, (B) 1 to 40 parts by weight of quinone diazide compound, (C) 20 to 2000 parts by weight of inorganic fine particles and optionally (D) an amine compound having 80 to 300 DEG C of boiling point at ordinary pressure, the alkali-soluble resin having 0.1 to 40% by mole of basic group per total number by moles of repeating structural unit of the alkali-soluble resin. Method of forming patterns using the resin composition is also disclosed, the method comprising disposing a photoresist layer of the resin composition on a substrate, selectively exposing to an active light and developing. A resist pattern which is excellent in anti-oxygen plasma property, heat-resisting property, anti-dryetching property, sensitivity, resolution and pealability and has reduced surface roughness is provided.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003176198 | 2003-06-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200510934A true TW200510934A (en) | 2005-03-16 |
Family
ID=33534888
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093117021A TW200510934A (en) | 2003-06-20 | 2004-06-14 | Radiation-sensitive resin composition and method for forming pattern using the composition |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2004114020A1 (en) |
TW (1) | TW200510934A (en) |
WO (1) | WO2004114020A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007025012A (en) * | 2005-07-13 | 2007-02-01 | Nippon Zeon Co Ltd | Resin composition |
CN101606103A (en) | 2007-02-09 | 2009-12-16 | 索尼化学&信息部件株式会社 | Photosensitive polyimide resin composition |
WO2008123049A1 (en) * | 2007-03-30 | 2008-10-16 | Jsr Corporation | Method for film formation, resin composition for use in the method, structure having insulating film, process for producing the structure, and electronic component |
JP2009133924A (en) * | 2007-11-28 | 2009-06-18 | Jsr Corp | Method for film formation and positive photosensitive resin composition for use in the same |
JP5739325B2 (en) * | 2008-04-23 | 2015-06-24 | ブルーワー サイエンス アイ エヌシー. | Photosensitive hard mask for microlithography |
JP5246259B2 (en) * | 2008-06-11 | 2013-07-24 | Jsr株式会社 | Structure having insulating film and method for producing the same, positive photosensitive resin composition, and electronic component |
KR20110045418A (en) * | 2009-10-27 | 2011-05-04 | 삼성전자주식회사 | Photoresist composition and method of manufacturing a display substrate using the photoresist composition |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0553314A (en) * | 1991-08-22 | 1993-03-05 | Sumitomo Chem Co Ltd | Positive type resist composition |
JPH08319307A (en) * | 1995-05-29 | 1996-12-03 | Nippon Kayaku Co Ltd | Resin composition, resist ink composition and its cured material |
JP3633179B2 (en) * | 1997-01-27 | 2005-03-30 | Jsr株式会社 | Positive photoresist composition |
JP4022312B2 (en) * | 1998-05-08 | 2007-12-19 | 株式会社Kri | Resist composition and pattern forming method |
JP3974718B2 (en) * | 1998-11-09 | 2007-09-12 | Azエレクトロニックマテリアルズ株式会社 | Radiation sensitive resin composition |
JP3909552B2 (en) * | 2000-07-27 | 2007-04-25 | Jsr株式会社 | Radiation-sensitive resin composition and insulating film for organic EL device |
-
2004
- 2004-06-14 TW TW093117021A patent/TW200510934A/en unknown
- 2004-06-17 JP JP2005507277A patent/JPWO2004114020A1/en active Pending
- 2004-06-17 WO PCT/JP2004/008859 patent/WO2004114020A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JPWO2004114020A1 (en) | 2006-08-03 |
WO2004114020A1 (en) | 2004-12-29 |
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