TW200510579A - Combined processing device and method - Google Patents

Combined processing device and method

Info

Publication number
TW200510579A
TW200510579A TW093107027A TW93107027A TW200510579A TW 200510579 A TW200510579 A TW 200510579A TW 093107027 A TW093107027 A TW 093107027A TW 93107027 A TW93107027 A TW 93107027A TW 200510579 A TW200510579 A TW 200510579A
Authority
TW
Taiwan
Prior art keywords
processing
substrate
electrode
processing device
combined
Prior art date
Application number
TW093107027A
Other languages
Chinese (zh)
Inventor
Osamu Nabeya
Takayuki Saito
Tsukuru Suzuki
Yasushi Toma
Ikutaro Noji
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of TW200510579A publication Critical patent/TW200510579A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

This invention provides a combined processing device which is capable of correctly processing a conductive material such as a copper film with a low surface pressure and a high rate while the occurrence of pits is effectively prevented. The combined processing device of this invention contains a substrate holder (42) for holding a substrate (W), a mechanical processing portion (82) for processing the surface of substrate with a processing method including a mechanical action, a processing table (46) contains individually a processing electrode (86) and a electrolytic processing portion (84), the processing electrode (86) being provided with an ion exchanging member (92), and the electrolytic processing portion (84) being adapted to perform the processing of the substrate (W) by applying a voltage across the processing electrode (86) and the substrate (W) while the substrate (W) is kept in contact with the ion exchanging member (92). The combined processing device further contains a liquid supply portion (94) for supplying a liquid between the substrate (W) and the processing electrode (86), and between the substrate (W) and the mechanical processing portion (82), and a driving portion for moving the substrate (W) and processing table (46) relative to each other.
TW093107027A 2003-03-19 2004-03-17 Combined processing device and method TW200510579A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003076500 2003-03-19

Publications (1)

Publication Number Publication Date
TW200510579A true TW200510579A (en) 2005-03-16

Family

ID=33027893

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093107027A TW200510579A (en) 2003-03-19 2004-03-17 Combined processing device and method

Country Status (4)

Country Link
US (1) US7563356B2 (en)
JP (1) JPWO2004083494A1 (en)
TW (1) TW200510579A (en)
WO (1) WO2004083494A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5341447B2 (en) * 2008-09-19 2013-11-13 旭化成せんい株式会社 Textured polishing cloth
JP2011176342A (en) * 2011-04-11 2011-09-08 Ebara Corp Polishing method and wiring forming method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2002A (en) * 1841-03-12 Tor and planter for plowing
JP2565385B2 (en) 1988-09-30 1996-12-18 理化学研究所 Combined processing method and apparatus of electrolytic dressing grinding method and polishing method using conductive whetstone as tool
US6328872B1 (en) * 1999-04-03 2001-12-11 Nutool, Inc. Method and apparatus for plating and polishing a semiconductor substrate
US6354916B1 (en) * 2000-02-11 2002-03-12 Nu Tool Inc. Modified plating solution for plating and planarization and process utilizing same
JP4141114B2 (en) 2000-07-05 2008-08-27 株式会社荏原製作所 Electrolytic processing method and apparatus
US7074113B1 (en) * 2000-08-30 2006-07-11 Micron Technology, Inc. Methods and apparatus for removing conductive material from a microelectronic substrate
JP2002093761A (en) 2000-09-19 2002-03-29 Sony Corp Polishing method, polishing system, plating method and plating system
JP4043234B2 (en) * 2001-06-18 2008-02-06 株式会社荏原製作所 Electrolytic processing apparatus and substrate processing apparatus

Also Published As

Publication number Publication date
US7563356B2 (en) 2009-07-21
WO2004083494A1 (en) 2004-09-30
JPWO2004083494A1 (en) 2006-06-22
US20060175191A1 (en) 2006-08-10

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