TW200509214A - Immersion fluid for immersion lithography, and method of performing immersion lithography - Google Patents

Immersion fluid for immersion lithography, and method of performing immersion lithography

Info

Publication number
TW200509214A
TW200509214A TW093124633A TW93124633A TW200509214A TW 200509214 A TW200509214 A TW 200509214A TW 093124633 A TW093124633 A TW 093124633A TW 93124633 A TW93124633 A TW 93124633A TW 200509214 A TW200509214 A TW 200509214A
Authority
TW
Taiwan
Prior art keywords
immersion
immersion fluid
fluid
immersion lithography
lithography
Prior art date
Application number
TW093124633A
Other languages
Chinese (zh)
Other versions
TWI243409B (en
Inventor
Yee Chia Yeo
Burn Jeng Lin
Chen Ming Hu
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/803,712 external-priority patent/US7700267B2/en
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Publication of TW200509214A publication Critical patent/TW200509214A/en
Application granted granted Critical
Publication of TWI243409B publication Critical patent/TWI243409B/en

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

An immersion lithographic system comprises an optical surface, an immersion fluid with a pH less than 7 contacting at least a portion of the optical surface, and a semiconductor structure having a topmost photoresist layer wherein a portion of the photoresist is in contact with the immersion fluid. Further, a method for illuminating a semiconductor structure having a topmost photoresist layer comprising the steps of: introducing an immersion fluid into a space between an optical surface and the photoresist layer wherein the immersion fluid has a pH of less than 7, and directing light preferably with a wavelength of less than 450nm through the immersion fluid and onto the photoresist.
TW93124633A 2003-08-25 2004-08-17 Immersion fluid for immersion lithography, and method of performing immersion lithography TWI243409B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US49819503P 2003-08-25 2003-08-25
US10/803,712 US7700267B2 (en) 2003-08-11 2004-03-18 Immersion fluid for immersion lithography, and method of performing immersion lithography

Publications (2)

Publication Number Publication Date
TW200509214A true TW200509214A (en) 2005-03-01
TWI243409B TWI243409B (en) 2005-11-11

Family

ID=34594584

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93124633A TWI243409B (en) 2003-08-25 2004-08-17 Immersion fluid for immersion lithography, and method of performing immersion lithography

Country Status (3)

Country Link
CN (1) CN100535753C (en)
SG (1) SG109582A1 (en)
TW (1) TWI243409B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1996145B (en) * 2005-12-31 2010-08-25 上海集成电路研发中心有限公司 Method for reducing water pollution of optical elements in immersion type photoengraving technology
US7903232B2 (en) * 2006-04-12 2011-03-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5900354A (en) * 1997-07-03 1999-05-04 Batchelder; John Samuel Method for optical inspection and lithography
TWI347741B (en) * 2003-05-30 2011-08-21 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
CN2746425Y (en) * 2003-08-25 2005-12-14 台湾积体电路制造股份有限公司 Infiltration photoetching system

Also Published As

Publication number Publication date
TWI243409B (en) 2005-11-11
SG109582A1 (en) 2005-03-30
CN1655061A (en) 2005-08-17
CN100535753C (en) 2009-09-02

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