TW200505036A - Packaging structure for image sensor module and the manufacturing method thereof - Google Patents
Packaging structure for image sensor module and the manufacturing method thereofInfo
- Publication number
- TW200505036A TW200505036A TW092120869A TW92120869A TW200505036A TW 200505036 A TW200505036 A TW 200505036A TW 092120869 A TW092120869 A TW 092120869A TW 92120869 A TW92120869 A TW 92120869A TW 200505036 A TW200505036 A TW 200505036A
- Authority
- TW
- Taiwan
- Prior art keywords
- lens
- chamber
- image sensor
- manufacturing
- packaging structure
- Prior art date
Links
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- Studio Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The present invention provides a packaging structure for image sensor module and the manufacturing method thereof, which includes the following steps: providing an image sensor configured with a translucent layer thereon; providing a lens seat, formed with a penetrated chamber therein, wherein the chamber periphery is formed with inner thread to fix the lens seat on the image sensor and locating the translucent layer on one side of the chamber; and, providing a lens barrel configured within the chamber of the lens seat, which is configured with an outer thread to be screwed on the inner thread of the lens seat; and, the lens barrel is formed with a penetrated accommodation chamber, and the accommodation chamber is configured from top to down with the translucent hole and the aspherical lens, wherein the aspherical lens is first placed in the mold for injection the lens barrel, and the lens barrel is formed with a first engaging slot during injection molding to be engaged with the periphery of the aspherical lens, so as to fix the aspherical lens within the accommodation chamber.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92120869A TWI225308B (en) | 2003-07-30 | 2003-07-30 | Packaging structure for image sensor module and the manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92120869A TWI225308B (en) | 2003-07-30 | 2003-07-30 | Packaging structure for image sensor module and the manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI225308B TWI225308B (en) | 2004-12-11 |
TW200505036A true TW200505036A (en) | 2005-02-01 |
Family
ID=34568448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW92120869A TWI225308B (en) | 2003-07-30 | 2003-07-30 | Packaging structure for image sensor module and the manufacturing method thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI225308B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110941065A (en) * | 2018-09-21 | 2020-03-31 | 先进光电科技股份有限公司 | Optical imaging module |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100438087C (en) * | 2005-05-08 | 2008-11-26 | 日月光半导体制造股份有限公司 | Photoelectric element package process |
TWI382897B (en) * | 2008-05-16 | 2013-01-21 | Hon Hai Prec Ind Co Ltd | Thread die |
CN112166375A (en) * | 2019-07-29 | 2021-01-01 | 深圳市大疆创新科技有限公司 | Shooting equipment, cloud platform device and unmanned aerial vehicle |
-
2003
- 2003-07-30 TW TW92120869A patent/TWI225308B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110941065A (en) * | 2018-09-21 | 2020-03-31 | 先进光电科技股份有限公司 | Optical imaging module |
Also Published As
Publication number | Publication date |
---|---|
TWI225308B (en) | 2004-12-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |