TW200505036A - Packaging structure for image sensor module and the manufacturing method thereof - Google Patents

Packaging structure for image sensor module and the manufacturing method thereof

Info

Publication number
TW200505036A
TW200505036A TW092120869A TW92120869A TW200505036A TW 200505036 A TW200505036 A TW 200505036A TW 092120869 A TW092120869 A TW 092120869A TW 92120869 A TW92120869 A TW 92120869A TW 200505036 A TW200505036 A TW 200505036A
Authority
TW
Taiwan
Prior art keywords
lens
chamber
image sensor
manufacturing
packaging structure
Prior art date
Application number
TW092120869A
Other languages
Chinese (zh)
Other versions
TWI225308B (en
Inventor
xiu-wen Du
zhi-cheng Wu
chao-kai You
Shang-Feng Xie
Original Assignee
Kingpak Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kingpak Tech Inc filed Critical Kingpak Tech Inc
Priority to TW92120869A priority Critical patent/TWI225308B/en
Application granted granted Critical
Publication of TWI225308B publication Critical patent/TWI225308B/en
Publication of TW200505036A publication Critical patent/TW200505036A/en

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  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

The present invention provides a packaging structure for image sensor module and the manufacturing method thereof, which includes the following steps: providing an image sensor configured with a translucent layer thereon; providing a lens seat, formed with a penetrated chamber therein, wherein the chamber periphery is formed with inner thread to fix the lens seat on the image sensor and locating the translucent layer on one side of the chamber; and, providing a lens barrel configured within the chamber of the lens seat, which is configured with an outer thread to be screwed on the inner thread of the lens seat; and, the lens barrel is formed with a penetrated accommodation chamber, and the accommodation chamber is configured from top to down with the translucent hole and the aspherical lens, wherein the aspherical lens is first placed in the mold for injection the lens barrel, and the lens barrel is formed with a first engaging slot during injection molding to be engaged with the periphery of the aspherical lens, so as to fix the aspherical lens within the accommodation chamber.
TW92120869A 2003-07-30 2003-07-30 Packaging structure for image sensor module and the manufacturing method thereof TWI225308B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92120869A TWI225308B (en) 2003-07-30 2003-07-30 Packaging structure for image sensor module and the manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92120869A TWI225308B (en) 2003-07-30 2003-07-30 Packaging structure for image sensor module and the manufacturing method thereof

Publications (2)

Publication Number Publication Date
TWI225308B TWI225308B (en) 2004-12-11
TW200505036A true TW200505036A (en) 2005-02-01

Family

ID=34568448

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92120869A TWI225308B (en) 2003-07-30 2003-07-30 Packaging structure for image sensor module and the manufacturing method thereof

Country Status (1)

Country Link
TW (1) TWI225308B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110941065A (en) * 2018-09-21 2020-03-31 先进光电科技股份有限公司 Optical imaging module

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100438087C (en) * 2005-05-08 2008-11-26 日月光半导体制造股份有限公司 Photoelectric element package process
TWI382897B (en) * 2008-05-16 2013-01-21 Hon Hai Prec Ind Co Ltd Thread die
CN112166375A (en) * 2019-07-29 2021-01-01 深圳市大疆创新科技有限公司 Shooting equipment, cloud platform device and unmanned aerial vehicle

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110941065A (en) * 2018-09-21 2020-03-31 先进光电科技股份有限公司 Optical imaging module

Also Published As

Publication number Publication date
TWI225308B (en) 2004-12-11

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MM4A Annulment or lapse of patent due to non-payment of fees