TW200504854A - Retaining ring for wafer polishing - Google Patents

Retaining ring for wafer polishing

Info

Publication number
TW200504854A
TW200504854A TW092120835A TW92120835A TW200504854A TW 200504854 A TW200504854 A TW 200504854A TW 092120835 A TW092120835 A TW 092120835A TW 92120835 A TW92120835 A TW 92120835A TW 200504854 A TW200504854 A TW 200504854A
Authority
TW
Taiwan
Prior art keywords
polishing
ring
plural
base ring
retaining ring
Prior art date
Application number
TW092120835A
Other languages
Chinese (zh)
Inventor
Peng-Yih Peng
Original Assignee
Calitech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Calitech Co Ltd filed Critical Calitech Co Ltd
Priority to TW092120835A priority Critical patent/TW200504854A/en
Publication of TW200504854A publication Critical patent/TW200504854A/en

Links

Abstract

The retaining ring of this invention for wafer polishing consists of a polishing ring and a base ring. The polishing ring is composed by plural polishing slices that are arranged to be a ring shape with equal angle. Through designing, a trench can be formed between two neighbored polishing slices to quickly drain the polishing slurry. According to the rotation orientation of the polishing head and polishing pad, the trenches can be clockwise inclined from the inside to the outside to follow the flow direction of the polishing slurry. The base ring is fixed on the polishing ring. There are plural screw holes on the base ring to fix the polishing head. In the radial direction of the base ring, plural through holes can be installed for water or gas draining.
TW092120835A 2003-07-30 2003-07-30 Retaining ring for wafer polishing TW200504854A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW092120835A TW200504854A (en) 2003-07-30 2003-07-30 Retaining ring for wafer polishing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092120835A TW200504854A (en) 2003-07-30 2003-07-30 Retaining ring for wafer polishing

Publications (1)

Publication Number Publication Date
TW200504854A true TW200504854A (en) 2005-02-01

Family

ID=57798213

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092120835A TW200504854A (en) 2003-07-30 2003-07-30 Retaining ring for wafer polishing

Country Status (1)

Country Link
TW (1) TW200504854A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103659548A (en) * 2013-12-06 2014-03-26 清华大学 Polishing head

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103659548A (en) * 2013-12-06 2014-03-26 清华大学 Polishing head

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