TW200504840A - Rework method of etching stop layer - Google Patents

Rework method of etching stop layer

Info

Publication number
TW200504840A
TW200504840A TW092120024A TW92120024A TW200504840A TW 200504840 A TW200504840 A TW 200504840A TW 092120024 A TW092120024 A TW 092120024A TW 92120024 A TW92120024 A TW 92120024A TW 200504840 A TW200504840 A TW 200504840A
Authority
TW
Taiwan
Prior art keywords
layer
etching stop
stop layer
amorphous silicon
patterned resist
Prior art date
Application number
TW092120024A
Other languages
English (en)
Chinese (zh)
Other versions
TWI317535B (https=
Inventor
Shu-Yang Hsu
Ju-Hao Hung
Shih-Kuo Chang
Siegfried Chang
Original Assignee
Au Optronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Au Optronics Corp filed Critical Au Optronics Corp
Priority to TW092120024A priority Critical patent/TW200504840A/zh
Publication of TW200504840A publication Critical patent/TW200504840A/zh
Application granted granted Critical
Publication of TWI317535B publication Critical patent/TWI317535B/zh

Links

Landscapes

  • Thin Film Transistor (AREA)
  • Drying Of Semiconductors (AREA)
TW092120024A 2003-07-22 2003-07-22 Rework method of etching stop layer TW200504840A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW092120024A TW200504840A (en) 2003-07-22 2003-07-22 Rework method of etching stop layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092120024A TW200504840A (en) 2003-07-22 2003-07-22 Rework method of etching stop layer

Publications (2)

Publication Number Publication Date
TW200504840A true TW200504840A (en) 2005-02-01
TWI317535B TWI317535B (https=) 2009-11-21

Family

ID=45073384

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092120024A TW200504840A (en) 2003-07-22 2003-07-22 Rework method of etching stop layer

Country Status (1)

Country Link
TW (1) TW200504840A (https=)

Also Published As

Publication number Publication date
TWI317535B (https=) 2009-11-21

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees