TW200503212A - Semiconductor cooling device - Google Patents

Semiconductor cooling device

Info

Publication number
TW200503212A
TW200503212A TW093107797A TW93107797A TW200503212A TW 200503212 A TW200503212 A TW 200503212A TW 093107797 A TW093107797 A TW 093107797A TW 93107797 A TW93107797 A TW 93107797A TW 200503212 A TW200503212 A TW 200503212A
Authority
TW
Taiwan
Prior art keywords
refrigerant pump
cooling device
condenser
semiconductor cooling
positive
Prior art date
Application number
TW093107797A
Other languages
Chinese (zh)
Inventor
Masao Nakano
Akira Ikeda
Hiromasa Ashitani
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of TW200503212A publication Critical patent/TW200503212A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A semiconductor cooling device includes a cold plate for cooling a semiconductor element, a condenser, and a positive-displacement refrigerant pump. The cold plate, condenser and refrigerant pump are fluid connected in series with each other to define a refrigerating cycle. A centrifugal refrigerant pump can be used in place of the positive-displacement refrigerant pump. In this case, it is preferred that a receiver tank be interposed between the condenser and the refrigerant pump.
TW093107797A 2003-06-10 2004-03-23 Semiconductor cooling device TW200503212A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003164985A JP2005005367A (en) 2003-06-10 2003-06-10 Cooler of semiconductor element

Publications (1)

Publication Number Publication Date
TW200503212A true TW200503212A (en) 2005-01-16

Family

ID=33508827

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093107797A TW200503212A (en) 2003-06-10 2004-03-23 Semiconductor cooling device

Country Status (4)

Country Link
US (1) US20040250563A1 (en)
JP (1) JP2005005367A (en)
CN (1) CN1574317A (en)
TW (1) TW200503212A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4682859B2 (en) * 2006-02-06 2011-05-11 株式会社日立製作所 Cooling system for electronic equipment
CN105444294A (en) * 2015-12-30 2016-03-30 苏州海特温控技术有限公司 Device integrating water cooling plate heat dissipation system and air-conditioning refrigeration system

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5815370A (en) * 1997-05-16 1998-09-29 Allied Signal Inc Fluidic feedback-controlled liquid cooling module
US6519955B2 (en) * 2000-04-04 2003-02-18 Thermal Form & Function Pumped liquid cooling system using a phase change refrigerant
US6587336B2 (en) * 2001-06-27 2003-07-01 International Business Machines Corporation Cooling system for portable electronic and computer devices
US6942018B2 (en) * 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system

Also Published As

Publication number Publication date
US20040250563A1 (en) 2004-12-16
JP2005005367A (en) 2005-01-06
CN1574317A (en) 2005-02-02

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