TW200502995A - Power cable compositions for strippable adhesion - Google Patents

Power cable compositions for strippable adhesion

Info

Publication number
TW200502995A
TW200502995A TW093108401A TW93108401A TW200502995A TW 200502995 A TW200502995 A TW 200502995A TW 093108401 A TW093108401 A TW 093108401A TW 93108401 A TW93108401 A TW 93108401A TW 200502995 A TW200502995 A TW 200502995A
Authority
TW
Taiwan
Prior art keywords
power cable
semiconductive
cable
composition
cable compositions
Prior art date
Application number
TW093108401A
Other languages
Chinese (zh)
Inventor
Timothy J Person
John Klier
Salvatore F Shurott
Original Assignee
Dow Global Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Inc filed Critical Dow Global Technologies Inc
Publication of TW200502995A publication Critical patent/TW200502995A/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C08L23/0853—Vinylacetate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L15/00—Compositions of rubber derivatives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L7/00—Compositions of natural rubber
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/06—Polysulfones; Polyethersulfones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Organic Insulating Materials (AREA)

Abstract

The present invention is a semiconductive power cable composition made from or containing (a) a mixture of a high-temperature polymer and a soft polymer, and (b) a conductive filler, wherein a semiconductive cable layer prepared from the composition strippably adheres to a second cable layer. The invention also includes a semiconductive cable layer prepared from the semiconductive power cable composition as well as a power cable construction prepared by applying the semiconductive cable layer over a wire or cable.
TW093108401A 2003-03-27 2004-03-26 Power cable compositions for strippable adhesion TW200502995A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US45794303P 2003-03-27 2003-03-27

Publications (1)

Publication Number Publication Date
TW200502995A true TW200502995A (en) 2005-01-16

Family

ID=33131732

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093108401A TW200502995A (en) 2003-03-27 2004-03-26 Power cable compositions for strippable adhesion

Country Status (8)

Country Link
US (1) US20060182961A1 (en)
EP (1) EP1611585A2 (en)
JP (1) JP2006521679A (en)
CN (1) CN1762029A (en)
CA (1) CA2520362A1 (en)
MX (1) MXPA05010313A (en)
TW (1) TW200502995A (en)
WO (1) WO2004088674A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI469157B (en) * 2007-09-25 2015-01-11 Dow Global Technologies Llc Styrenic polymers as blend components to control adhesion between olefinic substrates

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WO2008041965A2 (en) * 2005-08-08 2008-04-10 Cabot Corporation Polymeric compositions containing nanotubes
EP1936638A1 (en) * 2006-12-18 2008-06-25 Abb Research Ltd. An electric insulator and use thereof
KR101257152B1 (en) * 2010-03-16 2013-04-23 엘에스전선 주식회사 Semiconductive Composition And The Power Cable Using The Same
US20140011029A1 (en) * 2011-03-29 2014-01-09 Paul J. Brigandi Semiconductive Shield Composition with Improved Strippability
JP5639010B2 (en) * 2011-06-20 2014-12-10 株式会社ビスキャス Semiconductive resin composition and power cable
US9336929B2 (en) * 2012-05-18 2016-05-10 Schlumberger Technology Corporation Artificial lift equipment power cables
EP2711938B1 (en) * 2012-09-25 2014-11-26 Nexans Silicone multilayer insulation for electric cable
EP2711934B1 (en) * 2012-09-25 2018-07-11 Nexans Silicone multilayer insulation for electric cable
NO20121547A1 (en) * 2012-12-21 2014-06-23 Nexans ROV cable insulation systems
WO2014126404A1 (en) * 2013-02-14 2014-08-21 엘에스전선 주식회사 Power cable
KR102018922B1 (en) * 2013-04-24 2019-09-05 한국전력공사 Power cable
KR102038709B1 (en) * 2013-05-15 2019-10-30 한국전력공사 Power cable
KR102020069B1 (en) * 2013-04-29 2019-11-04 한국전력공사 Compact power cable with increased capacitance
KR102020068B1 (en) * 2013-04-29 2019-11-04 한국전력공사 Power cable
CA2971145C (en) 2014-12-17 2021-06-08 Prysmian S.P.A. Energy cable having a cold-strippable semiconductive layer
KR102664628B1 (en) 2015-10-07 2024-05-09 다우 글로벌 테크놀로지스 엘엘씨 Semiconductive shielding composition
CN105820558A (en) * 2016-05-04 2016-08-03 安徽省康利亚股份有限公司 High-abrasion-resistance, halogen-free and flame-retardant insulation material for thin-wall locomotive cable
US11355261B2 (en) 2016-12-21 2022-06-07 Dow Global Technologies Llc Curable semiconducting composition
CN107880383A (en) * 2017-11-03 2018-04-06 成都乐维斯科技有限公司 A kind of novel cable insulating materials
FR3090985B1 (en) 2018-12-21 2020-12-18 Nexans Cable comprising an easily peelable semiconductor layer
KR102057683B1 (en) * 2019-04-05 2019-12-19 (주)에스플러스컴텍 Carbon-based wire manufacturing method and manufacturing apparatus using the same

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IT1165292B (en) * 1979-08-30 1987-04-22 Pirelli ELECTRIC CABLE PERFECTED FOR MEDIUM VOLTAGES
JPH01246707A (en) * 1988-03-29 1989-10-02 Hitachi Cable Ltd Semiconductive resin composition
EP0858081A3 (en) * 1997-02-07 1999-02-03 Mitsubishi Chemical Corporation Semiconductive resin composition and process for producing the same
JP3551755B2 (en) * 1998-04-03 2004-08-11 日立電線株式会社 Easily peelable semiconductive resin composition and electric wire / cable
JP4399076B2 (en) * 1999-04-28 2010-01-13 日本ユニカー株式会社 Peelable semiconductive resin composition for external semiconductive layer of water-crosslinked polyethylene insulated power cable
DE60007914T2 (en) * 1999-05-13 2004-12-23 Union Carbide Chemicals & Plastics Technology Corp., Danbury Semiconductor cable shield
JP4533506B2 (en) * 1999-09-27 2010-09-01 日本ユニカー株式会社 Peelable semiconductive resin composition for externally semiconductive layer of chemically crosslinked polyethylene insulated power cable
JP4215356B2 (en) * 1999-10-14 2009-01-28 日本ユニカー株式会社 Water-crosslinked polyolefin resin composition, method for producing the same, silane blend used therein, and molded product of the resin composition
JP3777958B2 (en) * 2000-07-27 2006-05-24 日立電線株式会社 Cross-linked polyethylene insulated power cable suitable for recycling
US6274066B1 (en) * 2000-10-11 2001-08-14 General Cable Technologies Corporation Low adhesion semi-conductive electrical shields
JP2002179854A (en) * 2000-12-11 2002-06-26 Du Pont Mitsui Polychem Co Ltd Resin composition
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI469157B (en) * 2007-09-25 2015-01-11 Dow Global Technologies Llc Styrenic polymers as blend components to control adhesion between olefinic substrates

Also Published As

Publication number Publication date
WO2004088674A1 (en) 2004-10-14
US20060182961A1 (en) 2006-08-17
JP2006521679A (en) 2006-09-21
MXPA05010313A (en) 2005-11-17
EP1611585A2 (en) 2006-01-04
WO2004088674B1 (en) 2004-12-16
CA2520362A1 (en) 2004-10-14
CN1762029A (en) 2006-04-19

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