CA2520362A1 - Power cable compositions for strippable adhesion - Google Patents
Power cable compositions for strippable adhesion Download PDFInfo
- Publication number
- CA2520362A1 CA2520362A1 CA002520362A CA2520362A CA2520362A1 CA 2520362 A1 CA2520362 A1 CA 2520362A1 CA 002520362 A CA002520362 A CA 002520362A CA 2520362 A CA2520362 A CA 2520362A CA 2520362 A1 CA2520362 A1 CA 2520362A1
- Authority
- CA
- Canada
- Prior art keywords
- semiconductive
- polymer
- composition
- cable
- power cable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- 239000000203 mixture Substances 0.000 title claims abstract description 105
- 229920000642 polymer Polymers 0.000 claims abstract description 85
- 239000011231 conductive filler Substances 0.000 claims abstract description 24
- 238000010276 construction Methods 0.000 claims abstract description 5
- -1 polypropylenes Polymers 0.000 claims description 46
- 238000009413 insulation Methods 0.000 claims description 37
- 239000007822 coupling agent Substances 0.000 claims description 23
- 239000003795 chemical substances by application Substances 0.000 claims description 18
- 238000012360 testing method Methods 0.000 claims description 18
- 229920000573 polyethylene Polymers 0.000 claims description 16
- 239000004698 Polyethylene Substances 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 14
- 239000004743 Polypropylene Substances 0.000 claims description 11
- 229920001577 copolymer Polymers 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 229920001155 polypropylene Polymers 0.000 claims description 11
- 238000004132 cross linking Methods 0.000 claims description 7
- 229920001971 elastomer Polymers 0.000 claims description 7
- 229920000728 polyester Polymers 0.000 claims description 7
- 239000005060 rubber Substances 0.000 claims description 7
- 239000006229 carbon black Substances 0.000 claims description 6
- 235000019241 carbon black Nutrition 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 229920001778 nylon Polymers 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 3
- 239000000178 monomer Substances 0.000 claims description 3
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 2
- 239000004917 carbon fiber Substances 0.000 claims description 2
- 239000002041 carbon nanotube Substances 0.000 claims description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims description 2
- 229920002492 poly(sulfone) Polymers 0.000 claims description 2
- 229920003235 aromatic polyamide Polymers 0.000 claims 1
- 239000010410 layer Substances 0.000 description 63
- 150000002978 peroxides Chemical class 0.000 description 14
- 238000009472 formulation Methods 0.000 description 11
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 9
- 239000005977 Ethylene Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 150000001540 azides Chemical class 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000000155 melt Substances 0.000 description 7
- 150000001451 organic peroxides Chemical class 0.000 description 7
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 7
- 239000005038 ethylene vinyl acetate Substances 0.000 description 6
- 150000004756 silanes Chemical class 0.000 description 6
- 238000013329 compounding Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 229920001519 homopolymer Polymers 0.000 description 5
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 4
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 4
- 239000012933 diacyl peroxide Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229940117958 vinyl acetate Drugs 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 229920003048 styrene butadiene rubber Polymers 0.000 description 3
- 239000004711 α-olefin Substances 0.000 description 3
- NMYFVWYGKGVPIW-UHFFFAOYSA-N 3,7-dioxabicyclo[7.2.2]trideca-1(11),9,12-triene-2,8-dione Chemical compound O=C1OCCCOC(=O)C2=CC=C1C=C2 NMYFVWYGKGVPIW-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920002292 Nylon 6 Polymers 0.000 description 2
- 229920002302 Nylon 6,6 Polymers 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- LNENVNGQOUBOIX-UHFFFAOYSA-N azidosilane Chemical class [SiH3]N=[N+]=[N-] LNENVNGQOUBOIX-UHFFFAOYSA-N 0.000 description 2
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 2
- JRZBPELLUMBLQU-UHFFFAOYSA-N carbonazidic acid Chemical class OC(=O)N=[N+]=[N-] JRZBPELLUMBLQU-UHFFFAOYSA-N 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 239000002355 dual-layer Substances 0.000 description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 description 2
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- CPGRMGOILBSUQC-UHFFFAOYSA-N phosphoryl azide Chemical class [N-]=[N+]=NP(=O)(N=[N+]=[N-])N=[N+]=[N-] CPGRMGOILBSUQC-UHFFFAOYSA-N 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- 239000004604 Blowing Agent Substances 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 229920003345 Elvax® Polymers 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229920009204 Methacrylate-butadiene-styrene Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- LKAVYBZHOYOUSX-UHFFFAOYSA-N buta-1,3-diene;2-methylprop-2-enoic acid;styrene Chemical compound C=CC=C.CC(=C)C(O)=O.C=CC1=CC=CC=C1 LKAVYBZHOYOUSX-UHFFFAOYSA-N 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- HGVPOWOAHALJHA-UHFFFAOYSA-N ethene;methyl prop-2-enoate Chemical compound C=C.COC(=O)C=C HGVPOWOAHALJHA-UHFFFAOYSA-N 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 1
- 239000005043 ethylene-methyl acrylate Substances 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920006112 polar polymer Polymers 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 229920005606 polypropylene copolymer Polymers 0.000 description 1
- 229920000874 polytetramethylene terephthalate Polymers 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L15/00—Compositions of rubber derivatives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L7/00—Compositions of natural rubber
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/06—Polysulfones; Polyethersulfones
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Composite Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Organic Insulating Materials (AREA)
Abstract
The present invention is a semiconductive power cable composition made from or containing (a) a mixture of a high~temperature polymer and a soft polymer, and (b) a conductive filler, wherein a semiconductive cable layer prepared from the composition strippably adheres to a second cable layer. The invention also includes a semiconductive cable layer prepared from the semiconductive power cable composition as well as a power cable construction prepared by applying the semiconductive cable layer over a wire or cable.
Description
POWER CABLE COMPOSITIONS FOR STRIPPABLE ADHESION
This invention relates to power cable compositions. Specifically, it relates to semiconductive power cable compositions, articles (such as a semiconductive cable layer and power cable constructions) prepared from the semiconductive compositions, and processes for preparing the semiconductive compositions and related articles.
Power cables, rated for a conductor operating temperature of 90-degree Centigrade or higher, axe commonly prepared by extruding chemically-crosslinkable polymer materials around the conductor. Following extrusion, the chemically-crosslinkable polymeric materials are crosslinked to resist material deformation at the rated cable operating temperature and related overload conditions.
to For medium- and high-voltage cable designs, the chemically-crosslinkable polymeric materials commonly contain conductive fillers to render the resulting cable layer semiconductive. The chemically-crosslinlcable polymeric materials are extruded to prepare an electrical stress control layer between the metallic conductor and a polymer-dielectric insulation layer and may also be used as an electrical stress control layer between the polymer dielectric layer and grounding wires or tapes. The various layers are typically co-extruded and subsequently, simultaneously crosslinked.
In addition, some cable constructions can include protective sheaths, moisture barriers, or protective jackets.
Co-extrusion and simultaneous crosslinking are generally desirable because the resulting cable layers axe closely bonded. Close bonding prevents partial delamination of the layers and precludes void forming between the layers, thereby preventing premature cable failure. Delamination and void formation can result from flexure and/or heat during the normal use of the cable.
Unfortunately, close bonding as a result of co-extrusion and simultaneous crosslinking is not free of disadvantages. Notably, the method of manufacture presents problems for applications in which stripping the outermost electrical stress control layer (or semiconductive layer) from the polymer-dielectric insulation layer is desirable. (It is believed that crosslinking bond occur across the interface between the electrical stress control layer and the polymer-dielectric insulation layer.
Those bonds must be broken to strip the layers apart.) Stripping the semiconductive layer away from the insulation layer damages the insulation layer when the force to separate the layers is excessive.
to It is desirable for the semiconductive layer to adhere to the insulation layer under normal operating conditions while being easily strippable from the insulation layer on demand. These features promote utilisation of the cable for its normal life and ease of installation of such accessories as joints, splices, and terminations.
Currently, the chemically-crosslinkable polymeric materials often contain polar polymers to reduce their melt miscibility with insulation materials, which generally contain non-polar polyolefinic polymers. 1'~ost commonly, the chemically-crosslinkable polymer materials are based upon ethylene vinyl acetate copolymers, having a vinyl acetate comonomer content of greater than 28°/~ by weight. A
disadvantage of these high-polarity copolymers is that they tend to yield compounds 2o prone to agglomeration. It is desirable to avoid the problem of agglomeration.
The present invention is a semiconductive power cable composition comprising (a) a mixture of a high-temperature polymer and a soft polymer, and (b) a conductive filler, wherein a semiconductive cable layer prepared from the composition strippably adheres to a second cable layer. The invention also includes a semiconductive cable layer prepared from the semiconductive power cable composition as well as a power cable construction prepared by applying the semiconductive cable layer over a wire or cable.
Moreover, the present invention includes a process for preparing the semiconductive power cable composition comprising the step of blending a mixture of a high-temperature polymer, a soft polymer, and a conductive filler.
Alternatively, the process comprises the steps of (a) reactively-coupling a mixture of a high-temperature polymer, a soft polymer, and a first coupling agent, in the presence of a conductive filler and wherein the resulting mixture having a reduced curative level, and (b) admixing a second coupling agent, wherein the second coupling agent does to not substantially affect the curative level of the resulting mixture.
The present invention also includes a process for preparing a power cahle comprising the steps of (a) extruding a power cable semiconductive composition over a metallic conductor to yield a semiconductive cable layer over the metallic conductor, (b) extruding a chemically-crosslinkable insulation composition over the semiconductive cable layer, (c) extruding a second semiconductive power cable composition over the polymer-dielectric insulation to yield a second semiconductive cable layer, and (d) crosslinking the chemically-crosslinkable insulation composition to yield a crosslinked, polymer-dielectric insulation.
The invented semiconductive power cable composition comprises (a) a 2o mixture of a high-temperature polymer and a soft polymer and (b) a conductive filler, wherein a semiconductive cable layer prepared from the composition strippably adheres to a second cable layer. Preferably, the resulting semiconductive cable layer with have a heat resistance of less than 100% as measured by a Hot Creep test at a testing temperature of 150 degrees Centigrade (Test Method described in ICEA T-2s 562, and referenced in ANSI/ICEA Standards S-94-649 and S-97-682).
This invention relates to power cable compositions. Specifically, it relates to semiconductive power cable compositions, articles (such as a semiconductive cable layer and power cable constructions) prepared from the semiconductive compositions, and processes for preparing the semiconductive compositions and related articles.
Power cables, rated for a conductor operating temperature of 90-degree Centigrade or higher, axe commonly prepared by extruding chemically-crosslinkable polymer materials around the conductor. Following extrusion, the chemically-crosslinkable polymeric materials are crosslinked to resist material deformation at the rated cable operating temperature and related overload conditions.
to For medium- and high-voltage cable designs, the chemically-crosslinkable polymeric materials commonly contain conductive fillers to render the resulting cable layer semiconductive. The chemically-crosslinlcable polymeric materials are extruded to prepare an electrical stress control layer between the metallic conductor and a polymer-dielectric insulation layer and may also be used as an electrical stress control layer between the polymer dielectric layer and grounding wires or tapes. The various layers are typically co-extruded and subsequently, simultaneously crosslinked.
In addition, some cable constructions can include protective sheaths, moisture barriers, or protective jackets.
Co-extrusion and simultaneous crosslinking are generally desirable because the resulting cable layers axe closely bonded. Close bonding prevents partial delamination of the layers and precludes void forming between the layers, thereby preventing premature cable failure. Delamination and void formation can result from flexure and/or heat during the normal use of the cable.
Unfortunately, close bonding as a result of co-extrusion and simultaneous crosslinking is not free of disadvantages. Notably, the method of manufacture presents problems for applications in which stripping the outermost electrical stress control layer (or semiconductive layer) from the polymer-dielectric insulation layer is desirable. (It is believed that crosslinking bond occur across the interface between the electrical stress control layer and the polymer-dielectric insulation layer.
Those bonds must be broken to strip the layers apart.) Stripping the semiconductive layer away from the insulation layer damages the insulation layer when the force to separate the layers is excessive.
to It is desirable for the semiconductive layer to adhere to the insulation layer under normal operating conditions while being easily strippable from the insulation layer on demand. These features promote utilisation of the cable for its normal life and ease of installation of such accessories as joints, splices, and terminations.
Currently, the chemically-crosslinkable polymeric materials often contain polar polymers to reduce their melt miscibility with insulation materials, which generally contain non-polar polyolefinic polymers. 1'~ost commonly, the chemically-crosslinkable polymer materials are based upon ethylene vinyl acetate copolymers, having a vinyl acetate comonomer content of greater than 28°/~ by weight. A
disadvantage of these high-polarity copolymers is that they tend to yield compounds 2o prone to agglomeration. It is desirable to avoid the problem of agglomeration.
The present invention is a semiconductive power cable composition comprising (a) a mixture of a high-temperature polymer and a soft polymer, and (b) a conductive filler, wherein a semiconductive cable layer prepared from the composition strippably adheres to a second cable layer. The invention also includes a semiconductive cable layer prepared from the semiconductive power cable composition as well as a power cable construction prepared by applying the semiconductive cable layer over a wire or cable.
Moreover, the present invention includes a process for preparing the semiconductive power cable composition comprising the step of blending a mixture of a high-temperature polymer, a soft polymer, and a conductive filler.
Alternatively, the process comprises the steps of (a) reactively-coupling a mixture of a high-temperature polymer, a soft polymer, and a first coupling agent, in the presence of a conductive filler and wherein the resulting mixture having a reduced curative level, and (b) admixing a second coupling agent, wherein the second coupling agent does to not substantially affect the curative level of the resulting mixture.
The present invention also includes a process for preparing a power cahle comprising the steps of (a) extruding a power cable semiconductive composition over a metallic conductor to yield a semiconductive cable layer over the metallic conductor, (b) extruding a chemically-crosslinkable insulation composition over the semiconductive cable layer, (c) extruding a second semiconductive power cable composition over the polymer-dielectric insulation to yield a second semiconductive cable layer, and (d) crosslinking the chemically-crosslinkable insulation composition to yield a crosslinked, polymer-dielectric insulation.
The invented semiconductive power cable composition comprises (a) a 2o mixture of a high-temperature polymer and a soft polymer and (b) a conductive filler, wherein a semiconductive cable layer prepared from the composition strippably adheres to a second cable layer. Preferably, the resulting semiconductive cable layer with have a heat resistance of less than 100% as measured by a Hot Creep test at a testing temperature of 150 degrees Centigrade (Test Method described in ICEA T-2s 562, and referenced in ANSI/ICEA Standards S-94-649 and S-97-682).
As the term is used herein, "strippably adheres" means that the semiconductive layer adheres to a second layer (usually, an insulation layer) under normal operating conditions of the power cable while having the property of being easily strippable from the second layer (i.e., delaminating/separating the semiconductive layer from the second layer without substantially damaging the second layer) on demand. With reference to strip tension, the term "strippably adheres" means a strip tension between 3 and 24 pounds per 0.5 inch wide strip (1.3 to 10.9 kilograms per 13 millimeter wide strip). This test method is also is also referenced in ANSI/ICEA Standards S-94-649 and S-97-682.
to A high-temperature polymer, as that term is used herein, means a polymer having suitable heat resistance for the semiconductive cable layer but lacking other desirable properties. For e:~ample, the high-temperature polymer may not have desirable processing characteristics or other material properties. Suitable high-temperature polymers include polypropylenes, polyesters, nylons, polysulfones, and polyaxamides. Preferred high-temperature polymers are polypropylenes. The high temperature polymer is preferably in the c~mposition in an amount less than 50 weight percent. More preferably, the high temperature polymer is present in an amount between 10 and 40 weight percent. Most preferably, it is present in an amount between 20 and 30 weight percent.
A soft polymer, as that term is used herein, means a polymer that enhances the processing characteristics of the high-temperature polymer and provides a networking source as the soft polymer is coupled to the high-temperature polymer for additional heat resistance. Suitable soft polymers include polyethylenes, polypropylenes, polyesters, and rubbers. Preferred soft polymers are polyethylenes.
Polyethylenes include homopolymers of ethylene and copolymers of ethylene and one or more alpha-olefins, and, optionally, a dime. The polyethylene can also be a copolymer of ethylene and an unsaturated ester such as a vinyl ester (e.g., vinyl acetate or an acrylic or methacrylic acid ester), a copolymer of ethylene and an unsaturated acid such as acrylic or methacrylic acid, or a copolymer of ethylene and a vinyl silane (e.g., vinyltrimethoxysilane and vinyltriethoxysilane) as well as interpolymers of any of these comonomers. Post-modified polyethylenes of any other of the above are considered within the scope of this invention as well as blends thereof. Preferred polyethylenes are homopolymers of ethylene, copolymers of to ethylene and one or more alpha-olefins, and a copolymer of ethylene and an unsaturated ester. More preferred polyethylenes for soft polymers are copolymers of a polar monomer and a nonpolar comonomer. Most preferred polyethylenes are copolymers of ethylene and an unsaturated ester.
Suitable polypropylenes include homopolymers of propylene, copolymers of propylene and other olefins, and terpolymers of propylene, ethylene, and dimes.
Suitable polyesters include thermoplastic resins comprising a saturated dicarboxylic acid and a saturated difunctional alcohol. Specific examples include polyethylene terephthalate, polypropylene terephthalate (or trimethylene terephthalate), polybutylene terephthalate, polytetramethylene terephthalate, 2o polyhexamethylene terephthalate, polycyclohexane-1,4-dimethylol terephthalate, and polyneopentyl terephthalate. Preferred polyesters are polyethylene terephthalate, polypropylene terephthalate (or trimethylene terephthalate), and polybutylene terephthalate.
Suitable nylons include nylon 6, nylon 6,6, and nylons based upon longer chain-length diamines. Preferred nylons are nylon 6 and nylon 6,6.
to A high-temperature polymer, as that term is used herein, means a polymer having suitable heat resistance for the semiconductive cable layer but lacking other desirable properties. For e:~ample, the high-temperature polymer may not have desirable processing characteristics or other material properties. Suitable high-temperature polymers include polypropylenes, polyesters, nylons, polysulfones, and polyaxamides. Preferred high-temperature polymers are polypropylenes. The high temperature polymer is preferably in the c~mposition in an amount less than 50 weight percent. More preferably, the high temperature polymer is present in an amount between 10 and 40 weight percent. Most preferably, it is present in an amount between 20 and 30 weight percent.
A soft polymer, as that term is used herein, means a polymer that enhances the processing characteristics of the high-temperature polymer and provides a networking source as the soft polymer is coupled to the high-temperature polymer for additional heat resistance. Suitable soft polymers include polyethylenes, polypropylenes, polyesters, and rubbers. Preferred soft polymers are polyethylenes.
Polyethylenes include homopolymers of ethylene and copolymers of ethylene and one or more alpha-olefins, and, optionally, a dime. The polyethylene can also be a copolymer of ethylene and an unsaturated ester such as a vinyl ester (e.g., vinyl acetate or an acrylic or methacrylic acid ester), a copolymer of ethylene and an unsaturated acid such as acrylic or methacrylic acid, or a copolymer of ethylene and a vinyl silane (e.g., vinyltrimethoxysilane and vinyltriethoxysilane) as well as interpolymers of any of these comonomers. Post-modified polyethylenes of any other of the above are considered within the scope of this invention as well as blends thereof. Preferred polyethylenes are homopolymers of ethylene, copolymers of to ethylene and one or more alpha-olefins, and a copolymer of ethylene and an unsaturated ester. More preferred polyethylenes for soft polymers are copolymers of a polar monomer and a nonpolar comonomer. Most preferred polyethylenes are copolymers of ethylene and an unsaturated ester.
Suitable polypropylenes include homopolymers of propylene, copolymers of propylene and other olefins, and terpolymers of propylene, ethylene, and dimes.
Suitable polyesters include thermoplastic resins comprising a saturated dicarboxylic acid and a saturated difunctional alcohol. Specific examples include polyethylene terephthalate, polypropylene terephthalate (or trimethylene terephthalate), polybutylene terephthalate, polytetramethylene terephthalate, 2o polyhexamethylene terephthalate, polycyclohexane-1,4-dimethylol terephthalate, and polyneopentyl terephthalate. Preferred polyesters are polyethylene terephthalate, polypropylene terephthalate (or trimethylene terephthalate), and polybutylene terephthalate.
Suitable nylons include nylon 6, nylon 6,6, and nylons based upon longer chain-length diamines. Preferred nylons are nylon 6 and nylon 6,6.
Suitable rubbers include thermoplastic rubbers, ethylene propylene dime rubber, styrene-butadiene block copolymers, styrene-butadiene rubber, polybutadiene rubbers, isoprene rubbers, nitrite rubbers, polychloroprene rubbers, hydrogenated styrene-butadiene block copolymers, methacrylate butadiene styrene rubber, acrylic elastomers (such ethylene methylacrylate), fluoroelastomers, and thermoplastic elastomers (such as thermoplastic urethanes, polyamids, and polyester ethers).
Suitable conductive fillers include carbon blacks, carbon fibers, carbon nanotubes, graphite particles, metals, and metal-coated particles. Preferred conductive fillers are carbon blacks. Preferably, the conductive filler will be present to in the composition in an amount sufficient to impart a volume resistivity of less than 50,000 ohm-cm for a semiconductive cable layer prepared therefrom, as measured by the methods described in ICEA S-66-524.
In addition, a curing agent may be present in the semiconductive composition.
Suitable curing agents include organic peroxides, azides, organofunctional silanes, maleated polyolefms, phenols, and sulfur vulcanizing agents. Suitable organic peroxides include aromatic diacyl peroxides, aliphatic diacyl peroxides, dibasic acid peroxides, ketone peroxides, alkyl peroxyesters, and alkyl hydroperoxides.
Suitable azide curing agents include alkyl azide, aryl azides, aryl azides, azidoformates, phosphoryl azides, phosphinic azides, silyl azides, and polyfunctional azides.
2o Suitable silanes include unsaturated silanes that comprise an ethylenically unsaturated hydrocarbyl group, such as a vinyl, allyl, isopropenyl, butenyl, cyclohexenyl or y-(meth)acryloxy allyl group, and a hydrolyzable group, such as, for example, a hydrocarbyloxy, hydrocarbonyloxy, or hydrocarbylamino group. Preferred curing agents are organic peroxides.
Suitable conductive fillers include carbon blacks, carbon fibers, carbon nanotubes, graphite particles, metals, and metal-coated particles. Preferred conductive fillers are carbon blacks. Preferably, the conductive filler will be present to in the composition in an amount sufficient to impart a volume resistivity of less than 50,000 ohm-cm for a semiconductive cable layer prepared therefrom, as measured by the methods described in ICEA S-66-524.
In addition, a curing agent may be present in the semiconductive composition.
Suitable curing agents include organic peroxides, azides, organofunctional silanes, maleated polyolefms, phenols, and sulfur vulcanizing agents. Suitable organic peroxides include aromatic diacyl peroxides, aliphatic diacyl peroxides, dibasic acid peroxides, ketone peroxides, alkyl peroxyesters, and alkyl hydroperoxides.
Suitable azide curing agents include alkyl azide, aryl azides, aryl azides, azidoformates, phosphoryl azides, phosphinic azides, silyl azides, and polyfunctional azides.
2o Suitable silanes include unsaturated silanes that comprise an ethylenically unsaturated hydrocarbyl group, such as a vinyl, allyl, isopropenyl, butenyl, cyclohexenyl or y-(meth)acryloxy allyl group, and a hydrolyzable group, such as, for example, a hydrocarbyloxy, hydrocarbonyloxy, or hydrocarbylamino group. Preferred curing agents are organic peroxides.
In addition, the semiconductive power cable composition may further comprise a coupling agent. The term "coupling agent," as used herein, means a compound or mixture of compounds used for the purposes of coupling or grafting a polymer or polymer blend. The coupling agent may be present in an amount sufficient to reduce the amount of a curing agent required to impart heat resistance to the semiconductive cable layer. The coupling agent may be the same compound as the curing agent..
Suitable coupling agents include organic peroxides, azides, organofunctional silanes, maleated polyolefms, phenols, and sulfur vulcanizing agents. Suitable to organic peroxides include aromatic diacyl peroxides, aliphatic diacyl peroxides, dibasic acid peroxides, ketone peroxides, alkyl peroxyesters, and alkyl hydroperoxides. Suitable azide coupling agents include alkyl azide, aryl azides, aryl azides, azidoformates, phosphoryl azides, phosphinic azides, silyl azides, and polyfunctional azides. Suitable silanes include unsaturated silanes that comprise an ethylenically unsaturated hydrocarbyl group, such as a vinyl, allyl, isopropenyl, butenyl, cycloheacenyl or ~-(meth)acryloxy allyl group, and a hydrolyzable group, such as, for example, a hydrocarbyloxy, hydrocarbonyloxy, or hydrocarbylamino group. Preferred coupling agents are organic peroxides.
In addition, the semiconductive power cable composition may further comprise a compatibilizing polymer. As used herein, the term "compatibilizing polymers" includes those polymers having an affinity for both the high-temperature polymer and the soft polymer. Preferred compatibilizing polymer are copolymers (such as ethylene-alpha-olefin copolymers) and functionalized polymers (such as maleated polyolefins and glycidil-functional polyolefins). Based on the selection of the high-temperature and soft polymers, a person skilled in the art can readily identify other suitable compatibilizing polymers.
In addition, the composition may contain other additives such as antioxidants, stabilizers, blowing agents, pigments, processing aids, and cure boosters.
In a preferred embodiment, the present invention is a semiconductive power cable composition comprising (a) a mixture of a high-temperature polymer and a soft polymer and (b) a conductive filler, wherein a semiconductive cable layer prepared from the composition strippably adheres to a second cable layer. The high-temperature polymer and the soft polymer may have different heat resistance.
In a to more preferred embodiment, the semiconductive cable layer has a heat resistance of less than 100% as measured by a Hot Creep test at a testing temperature of 150 degrees Centigrade. Also, in a more preferred embodiment, the second cable layer is a chemically-crosslinked layer.
In an alternate embodiment, a semiconductive cable layer is prepared from the semiconductive power cable composition. In a yet another embodiment, a power cable constuuction is prepared by applying the semiconductive cable layer over a wire or cable.
In another alternate embodiment, the present invention is a process for preparing a semiconductive power cable composition comprising the step of blending a mixture of a high-temperature polymer, a soft polymer, and a conductive filler, wherein a semiconductive cable layer prepared from the composition strippably adheres to a second cable layer. In this embodiment, the mixture may further comprise a coupling agent. Preferably, the coupling agent reduces the amount of a curing agent required to impart heat resistance to a semiconductive cable layer s prepared from a mixture of the high-temperature polymer, the soft polymer, and the conductive filler in the absence of the coupling agent.
In yet another embodiment, the invention is a process for preparing a semiconductive power cable composition comprising the steps of (a) reactively-coupling a mixture of a high-temperature polymer, a soft polymer, and a coupling agent, in the presence of a conductive filler, and (b) admixing a curing agent, wherein a semiconductive cable layer prepared from the composition strippably adheres to a second cable layer. Preferably, the coupling agent reduces the amount of the curing agent required to impart heat resistance to a semiconductive cable layer prepared from 1 o a mixture of the high-temperature polymer, the soft polymer, and the conductive filler in the absence of the coupling agent.
In another embodiment of the present invention, the invention is a process for preparing a power cable comprising the steps of (a) extruding a semiconductive power cable composition comprising a mixture of a high-temperature polymer, a soft polymer, and a conductive filler, over a metallic conductor to yield a semiconductive cable layer over the metallic conductor, and (b) extruding a polymer-dielectric insulation over the semiconductive cable layer. This embodiment may further comprise the step of (c) extruding a second semiconductive power cable composition over the polymer-dielectric insulation to yield a second semiconductive cable layer.
2o In an alternate aspect of this embodiment, the invention is a process comprising the steps of (a) extruding a power cable semiconductive composition comprising a mixture of a high-temperature polymer, a soft polymer, and a conductive filler, over a metallic conductor to yield a semiconductive cable layer over the metallic conductor, (b) extruding a chemically-crosslinkable insulation composition over the semiconductive cable layer, (c) extruding a second semiconductive power cable composition over the polymer-dielectric insulation to yield a second semiconductive cable layer, and (d) crosslinking the chemically-crosslinkable insulation composition to yield a crosslinked, polymer-dielectric insulation.
EXAMPLES
The following non-limiting examples illustrate the invention.
Exam les 1-7 In Comparative Examples 1, 6, and 7 and Examples 2, 4, and 5, the mixtures were combined in a lab-scale compounder to achieve a melt temperature of 190 degrees Centigrade for 5 minutes. In Example 3, the mixture of the high-temperature to polymer, the soft polymer, and the conductive filler were combined in a lab-scale compounder to achieve a melt temperature of 190 degrees Centigrade for 5 minutes and then allowed to cool9 then the peroxide was added at 120 degrees Centigrade.
Each exemplified formulation was evaluated for Hot Creep performance and adhesion to a polyethylene-insulation substrate. The Hot Creep test specimens were evaluated for their resistance to thermal deformation under load conditions of N/sq. cm, tensile stress for 15 minutes at 150 degrees Centigrade. Elongation and residual deformation were measured. Residual deformation is reported in Table I as Hot Set.
For the adhesion measurement, 30 mil plaques of the exemplified formulations 2o were prepared. A polyethylene-insulation substrate was prepared from The Dow Chemical Company's commercially available HFDB-4202 crosslinkable polyethylene insulation at 120 degrees Centigrade. Subsequently, the test plaques and the polyethylene-insulation substrate were molded together under pressure at a temperature in excess of 1 ~0 degrees Centigrade for a length time sufficient for the ?5 substrate to cure. Next, the dual-layer specimens were conditioned at ambient to temperature overnight. A one-half inch wide strip was scored from the dual-layer specimen. A 90-degree peel test was performed in an INSTRONTM tensile machine at a peel rate of 20inches per minute.
The polymeric materials for the exemplified formulations were added in the concentrations shown in Table I and include:
(1) duPont Elvax 265TM ethylene vinylacetate copolymer (EVA-1), having a vinylacetate content of 28% by weight and a melt index of 3 g/1 Ominutes;
(2) DXM-451TM ethylene vinylacetate copolymer (EVA-2), having a to vinylacetate content of 18% by weight and a melt index of 3 g/lOminutes and commercially available from The Dow Chemical Company;
(3) 5D45TM polypropylene (PP-1), which was a fractional homopolymer having a melt flow rate of 0.8 and commercially available from The Dow Chemical Company; and (4~) a homopolymer of polypropylene (PP-2) having a melt flow rate of 20.
The carbon black was CSX614 and commercially available from Cabot Corporation. Each formulation contained 55 parts per hundred polymer (pphr) of carbon black. The peroxide used was TRIGANOX 101, and commercially available 2o from Akzo Nobel. For Comparative Example 1 and Examples 2-5, the peroxide was added in the amount of 0.4 pphr during the compounding. For Comparative Example 6, the peroxide was added in the amount of 0.4 pphr following the compounding.
The formulation for Comparative Example 7 did not contain any peroxide.
While the peroxide in the formulation exemplified as Comparative Example 1 was fully reacted during compounding, the test specimens were unable to withstand n the Hot Creep load. Without any residual unreacted peroxide, the test specimen for Comparative Example 1 was fully bonded to the polyethylene-insulation substrate.
This bonding also demonstrates that, if the formulation had not contained any peroxide during the compounding, the resulting test specimen would have fully bond itself to the polyethylene-insulation substrate and that current practices using EVA-2 would result in a fully-bonded test specimen.
Table I shows that formulation exemplified as Example 2 had desirable Hot Creep and strippability from the polyethylene-insulation substrate. While the Example 3 formulation showed improved heat resistance, its test specimens became to fully bonded to the polyethylene-insulation substrate. Examples 4 and 5 demonstrated formulations with improvements over the Example 2 formulation in heat resistance and strippability.
While Comparative Example 6 demonstrated excellent heat resistance, its unreacted peroxide ~i.e., peroxide not consumed during compounding) did not sufficiently reduce the curative level of the mixture to prevent the test specimens from fully bonding to the polyethylene-insulation substrate. Comparative Example 7, which is a blend with no coupling agent, yielded test specimens with relatively poor heat resistance.
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P -, Example 8 In Example 8, a mixture was combined in a lab-scale compounder to achieve a melt temperature of 190 degrees Centigrade for 5 minutes. The mixture contained 65 parts of EVA-1, 35 parts of PP-l, 55 parts per hundred polymer (pphr) of Cabot Corporation CSX614 carbon black, and 0.4 pphr Akzo Nobel TRIGANOX 101 peroxide.
As part of a 15-kilovolt power cable design, the mixture was extruded as a semiconductive layer over a peroxide crosslinkable polyethylene insulation (HFDB-4202). The HFDB-4202 crosslinkable polyethylene insulation is available commercially from The Dow Chemical Company.
The 15-kilovolt power cable design used a 1/0 AWG aluminum conductor, 15 mils of a crosslinkable semiconductive power cable compound, 175 mils of the crosslinkable polyethylene insulation, and 40 mils of the semiconductive power cable composition of Example 8. The extruded cable was passed through a hot, dry nitrogen tube (continuous vulcanization tube) wherein the thermal decomposition of organic peroxide initiates polymer crosslinking. The cured cable was then passed through a cooling water trough.
The outer semiconductive power cable composition of Example 8 was found to strippably adhere to the crosslinked polyethylene cable insulation, having a strip tension of 11-12 pounds per 0.5 inches. It also had a Hot Creep elongation of 19%
when tested at 150 degrees Centigrade and 0.2 MPa of applied tensile stress.
Suitable coupling agents include organic peroxides, azides, organofunctional silanes, maleated polyolefms, phenols, and sulfur vulcanizing agents. Suitable to organic peroxides include aromatic diacyl peroxides, aliphatic diacyl peroxides, dibasic acid peroxides, ketone peroxides, alkyl peroxyesters, and alkyl hydroperoxides. Suitable azide coupling agents include alkyl azide, aryl azides, aryl azides, azidoformates, phosphoryl azides, phosphinic azides, silyl azides, and polyfunctional azides. Suitable silanes include unsaturated silanes that comprise an ethylenically unsaturated hydrocarbyl group, such as a vinyl, allyl, isopropenyl, butenyl, cycloheacenyl or ~-(meth)acryloxy allyl group, and a hydrolyzable group, such as, for example, a hydrocarbyloxy, hydrocarbonyloxy, or hydrocarbylamino group. Preferred coupling agents are organic peroxides.
In addition, the semiconductive power cable composition may further comprise a compatibilizing polymer. As used herein, the term "compatibilizing polymers" includes those polymers having an affinity for both the high-temperature polymer and the soft polymer. Preferred compatibilizing polymer are copolymers (such as ethylene-alpha-olefin copolymers) and functionalized polymers (such as maleated polyolefins and glycidil-functional polyolefins). Based on the selection of the high-temperature and soft polymers, a person skilled in the art can readily identify other suitable compatibilizing polymers.
In addition, the composition may contain other additives such as antioxidants, stabilizers, blowing agents, pigments, processing aids, and cure boosters.
In a preferred embodiment, the present invention is a semiconductive power cable composition comprising (a) a mixture of a high-temperature polymer and a soft polymer and (b) a conductive filler, wherein a semiconductive cable layer prepared from the composition strippably adheres to a second cable layer. The high-temperature polymer and the soft polymer may have different heat resistance.
In a to more preferred embodiment, the semiconductive cable layer has a heat resistance of less than 100% as measured by a Hot Creep test at a testing temperature of 150 degrees Centigrade. Also, in a more preferred embodiment, the second cable layer is a chemically-crosslinked layer.
In an alternate embodiment, a semiconductive cable layer is prepared from the semiconductive power cable composition. In a yet another embodiment, a power cable constuuction is prepared by applying the semiconductive cable layer over a wire or cable.
In another alternate embodiment, the present invention is a process for preparing a semiconductive power cable composition comprising the step of blending a mixture of a high-temperature polymer, a soft polymer, and a conductive filler, wherein a semiconductive cable layer prepared from the composition strippably adheres to a second cable layer. In this embodiment, the mixture may further comprise a coupling agent. Preferably, the coupling agent reduces the amount of a curing agent required to impart heat resistance to a semiconductive cable layer s prepared from a mixture of the high-temperature polymer, the soft polymer, and the conductive filler in the absence of the coupling agent.
In yet another embodiment, the invention is a process for preparing a semiconductive power cable composition comprising the steps of (a) reactively-coupling a mixture of a high-temperature polymer, a soft polymer, and a coupling agent, in the presence of a conductive filler, and (b) admixing a curing agent, wherein a semiconductive cable layer prepared from the composition strippably adheres to a second cable layer. Preferably, the coupling agent reduces the amount of the curing agent required to impart heat resistance to a semiconductive cable layer prepared from 1 o a mixture of the high-temperature polymer, the soft polymer, and the conductive filler in the absence of the coupling agent.
In another embodiment of the present invention, the invention is a process for preparing a power cable comprising the steps of (a) extruding a semiconductive power cable composition comprising a mixture of a high-temperature polymer, a soft polymer, and a conductive filler, over a metallic conductor to yield a semiconductive cable layer over the metallic conductor, and (b) extruding a polymer-dielectric insulation over the semiconductive cable layer. This embodiment may further comprise the step of (c) extruding a second semiconductive power cable composition over the polymer-dielectric insulation to yield a second semiconductive cable layer.
2o In an alternate aspect of this embodiment, the invention is a process comprising the steps of (a) extruding a power cable semiconductive composition comprising a mixture of a high-temperature polymer, a soft polymer, and a conductive filler, over a metallic conductor to yield a semiconductive cable layer over the metallic conductor, (b) extruding a chemically-crosslinkable insulation composition over the semiconductive cable layer, (c) extruding a second semiconductive power cable composition over the polymer-dielectric insulation to yield a second semiconductive cable layer, and (d) crosslinking the chemically-crosslinkable insulation composition to yield a crosslinked, polymer-dielectric insulation.
EXAMPLES
The following non-limiting examples illustrate the invention.
Exam les 1-7 In Comparative Examples 1, 6, and 7 and Examples 2, 4, and 5, the mixtures were combined in a lab-scale compounder to achieve a melt temperature of 190 degrees Centigrade for 5 minutes. In Example 3, the mixture of the high-temperature to polymer, the soft polymer, and the conductive filler were combined in a lab-scale compounder to achieve a melt temperature of 190 degrees Centigrade for 5 minutes and then allowed to cool9 then the peroxide was added at 120 degrees Centigrade.
Each exemplified formulation was evaluated for Hot Creep performance and adhesion to a polyethylene-insulation substrate. The Hot Creep test specimens were evaluated for their resistance to thermal deformation under load conditions of N/sq. cm, tensile stress for 15 minutes at 150 degrees Centigrade. Elongation and residual deformation were measured. Residual deformation is reported in Table I as Hot Set.
For the adhesion measurement, 30 mil plaques of the exemplified formulations 2o were prepared. A polyethylene-insulation substrate was prepared from The Dow Chemical Company's commercially available HFDB-4202 crosslinkable polyethylene insulation at 120 degrees Centigrade. Subsequently, the test plaques and the polyethylene-insulation substrate were molded together under pressure at a temperature in excess of 1 ~0 degrees Centigrade for a length time sufficient for the ?5 substrate to cure. Next, the dual-layer specimens were conditioned at ambient to temperature overnight. A one-half inch wide strip was scored from the dual-layer specimen. A 90-degree peel test was performed in an INSTRONTM tensile machine at a peel rate of 20inches per minute.
The polymeric materials for the exemplified formulations were added in the concentrations shown in Table I and include:
(1) duPont Elvax 265TM ethylene vinylacetate copolymer (EVA-1), having a vinylacetate content of 28% by weight and a melt index of 3 g/1 Ominutes;
(2) DXM-451TM ethylene vinylacetate copolymer (EVA-2), having a to vinylacetate content of 18% by weight and a melt index of 3 g/lOminutes and commercially available from The Dow Chemical Company;
(3) 5D45TM polypropylene (PP-1), which was a fractional homopolymer having a melt flow rate of 0.8 and commercially available from The Dow Chemical Company; and (4~) a homopolymer of polypropylene (PP-2) having a melt flow rate of 20.
The carbon black was CSX614 and commercially available from Cabot Corporation. Each formulation contained 55 parts per hundred polymer (pphr) of carbon black. The peroxide used was TRIGANOX 101, and commercially available 2o from Akzo Nobel. For Comparative Example 1 and Examples 2-5, the peroxide was added in the amount of 0.4 pphr during the compounding. For Comparative Example 6, the peroxide was added in the amount of 0.4 pphr following the compounding.
The formulation for Comparative Example 7 did not contain any peroxide.
While the peroxide in the formulation exemplified as Comparative Example 1 was fully reacted during compounding, the test specimens were unable to withstand n the Hot Creep load. Without any residual unreacted peroxide, the test specimen for Comparative Example 1 was fully bonded to the polyethylene-insulation substrate.
This bonding also demonstrates that, if the formulation had not contained any peroxide during the compounding, the resulting test specimen would have fully bond itself to the polyethylene-insulation substrate and that current practices using EVA-2 would result in a fully-bonded test specimen.
Table I shows that formulation exemplified as Example 2 had desirable Hot Creep and strippability from the polyethylene-insulation substrate. While the Example 3 formulation showed improved heat resistance, its test specimens became to fully bonded to the polyethylene-insulation substrate. Examples 4 and 5 demonstrated formulations with improvements over the Example 2 formulation in heat resistance and strippability.
While Comparative Example 6 demonstrated excellent heat resistance, its unreacted peroxide ~i.e., peroxide not consumed during compounding) did not sufficiently reduce the curative level of the mixture to prevent the test specimens from fully bonding to the polyethylene-insulation substrate. Comparative Example 7, which is a blend with no coupling agent, yielded test specimens with relatively poor heat resistance.
W
~
p.., ~ c ~ ~ N
~1 O
U
W a~ _ l~ M ~ O O
O
O
U
~n l0 00 ~ 00 ~
~"
M M ''..iO
~
"
+~
a O
d' 47 ~; c~'J
' ~
r-W G \O M
W
M N
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W \O M ~
O
(U
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~r W
i w U
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Q., ~ ~ i U rn ~ ~, N .,~ .~ +, +, o U W W ~ ~ ~, .
~ ~
o ..~ P H
P -, Example 8 In Example 8, a mixture was combined in a lab-scale compounder to achieve a melt temperature of 190 degrees Centigrade for 5 minutes. The mixture contained 65 parts of EVA-1, 35 parts of PP-l, 55 parts per hundred polymer (pphr) of Cabot Corporation CSX614 carbon black, and 0.4 pphr Akzo Nobel TRIGANOX 101 peroxide.
As part of a 15-kilovolt power cable design, the mixture was extruded as a semiconductive layer over a peroxide crosslinkable polyethylene insulation (HFDB-4202). The HFDB-4202 crosslinkable polyethylene insulation is available commercially from The Dow Chemical Company.
The 15-kilovolt power cable design used a 1/0 AWG aluminum conductor, 15 mils of a crosslinkable semiconductive power cable compound, 175 mils of the crosslinkable polyethylene insulation, and 40 mils of the semiconductive power cable composition of Example 8. The extruded cable was passed through a hot, dry nitrogen tube (continuous vulcanization tube) wherein the thermal decomposition of organic peroxide initiates polymer crosslinking. The cured cable was then passed through a cooling water trough.
The outer semiconductive power cable composition of Example 8 was found to strippably adhere to the crosslinked polyethylene cable insulation, having a strip tension of 11-12 pounds per 0.5 inches. It also had a Hot Creep elongation of 19%
when tested at 150 degrees Centigrade and 0.2 MPa of applied tensile stress.
Claims (20)
1. A semiconductive power cable composition comprising:
a. a mixture of a high-temperature polymer and a soft polymer; and b. a conductive filler, wherein (i) a semiconductive cable layer prepared from the composition strippably adheres to a second cable layer, (ii) in the absence of a curing agent, the semiconductive cable layer having a heat resistance of less than 100% as measured by a Hot Creep test at a testing temperature of 150 degrees Centigrade, (iii) the high temperature polymer being a polymer suitable to impart heat resistance to the semiconductive cable layer, and (iv) the soft polymer being a polymer that enhances the processing characteristics of the high temperature polymer.
a. a mixture of a high-temperature polymer and a soft polymer; and b. a conductive filler, wherein (i) a semiconductive cable layer prepared from the composition strippably adheres to a second cable layer, (ii) in the absence of a curing agent, the semiconductive cable layer having a heat resistance of less than 100% as measured by a Hot Creep test at a testing temperature of 150 degrees Centigrade, (iii) the high temperature polymer being a polymer suitable to impart heat resistance to the semiconductive cable layer, and (iv) the soft polymer being a polymer that enhances the processing characteristics of the high temperature polymer.
2. The semiconductive power cable composition of Claim 1 wherein the high-temperature polymer is selected from the group consisting of polypropylenes, polyesters, nylons, polysulfones, and polyaramides and the soft polymer is selected from the group consisting of polyethylenes, polypropylenes, polyesters, and rubbers.
3. The semiconductive power cable composition of Claim 2 wherein the high-temperature polymer is a polypropylene and the soft polymer is a polyethylene.
4. The semiconductive power cable composition of Claim 3 wherein the polyethylene is a copolymer of a polar monomer and a nonpolar monomer.
5. The semiconductive power cable composition of Claim 1 wherein the conductive filler is selected from the group consisting of carbon blacks, carbon fibers, carbon nanotubes, graphite particles, metals, and metal-coated particles.
6. The semiconductive power cable composition of Claim 1 wherein the second cable layer being chemically-crosslinked.
7. The semiconductive power cable composition of Claim 1, further comprising a curing agent.
8. The semiconductive power cable composition of Claim 1 further comprising a coupling agent.
9. The semiconductive power cable composition of Claim 8 wherein the coupling agent reduces the amount of a curing agent required to impart heat resistance to the semiconductive cable layer.
10. The semiconductive power cable composition of Claim 9 further comprising a curing agent.
11. The semiconductive power cable composition of Claim 1 wherein the mixture further comprises a compatibilizing polymer.
12. A semiconductive cable layer prepared from the semiconductive power cable composition of Claim 1.
13. A power cable construction prepared by applying the semiconductive cable layer of Claim 12 over a wire or cable.
14. A process for preparing a semiconductive power cable composition comprising the step of:
blending a mixture of a high-temperature polymer, a soft polymer, and a conductive filler, wherein (i) a semiconductive cable layer prepared from the composition strippably adheres to a second cable layer, (ii) in the absence of a curing agent, the semiconductive cable layer having a heat resistance of less than 100% as measured by a Hot Creep test at a testing temperature of 150 degrees Centigrade, (iii) the high temperature polymer being a polymer suitable to impart heat resistance to the semiconductive cable layer, and (iv) the soft polymer being a polymer that enhances the processing characteristics of the high temperature polymer,
blending a mixture of a high-temperature polymer, a soft polymer, and a conductive filler, wherein (i) a semiconductive cable layer prepared from the composition strippably adheres to a second cable layer, (ii) in the absence of a curing agent, the semiconductive cable layer having a heat resistance of less than 100% as measured by a Hot Creep test at a testing temperature of 150 degrees Centigrade, (iii) the high temperature polymer being a polymer suitable to impart heat resistance to the semiconductive cable layer, and (iv) the soft polymer being a polymer that enhances the processing characteristics of the high temperature polymer,
15. The process of Claim 14, wherein the mixture further comprises a coupling agent.
16. A process for preparing a semiconductive power cable composition comprising the steps of:
a. reactively-coupling a mixture of a high-temperature polymer, a soft polymer, and a coupling agent, in the presence of a conductive filler, wherein the coupling agent reduces the amount of a curing agent required to impart heat resistance to a semiconductive cable layer prepared from a mixture of the high-temperature polymer, the soft polymer, and the conductive filler in the absence of the coupling agent; and b. admixing a curing agent, wherein a semiconductive cable layer prepared from the composition strippably adheres to a second cable layer.
a. reactively-coupling a mixture of a high-temperature polymer, a soft polymer, and a coupling agent, in the presence of a conductive filler, wherein the coupling agent reduces the amount of a curing agent required to impart heat resistance to a semiconductive cable layer prepared from a mixture of the high-temperature polymer, the soft polymer, and the conductive filler in the absence of the coupling agent; and b. admixing a curing agent, wherein a semiconductive cable layer prepared from the composition strippably adheres to a second cable layer.
17. A process for preparing a power cable comprising the steps of:
a. extruding a semiconductive power cable composition comprising a mixture of a high-temperature polymer, a soft polymer, and a conductive filler, over a metallic conductor to yield a semiconductive cable layer over the metallic conductor; and b. extruding a polymer-dielectric insulation over the semiconductive cable layer.
a. extruding a semiconductive power cable composition comprising a mixture of a high-temperature polymer, a soft polymer, and a conductive filler, over a metallic conductor to yield a semiconductive cable layer over the metallic conductor; and b. extruding a polymer-dielectric insulation over the semiconductive cable layer.
18. The process for preparing a power cable of Claim 17 further comprising the step of c. extruding a second semiconductive power cable composition over the polymer-dielectric insulation to yield a second semiconductive cable layer.
19. A process for preparing a power cable comprising the steps of:
a. extruding a power cable semiconductive composition comprising a mixture of a high-temperature polymer, a soft polymer, and a conductive filler, over a metallic conductor to yield a semiconductive cable layer over the metallic conductor;
b. extruding a chemically-crosslinkable insulation composition over the semiconductive cable layer;
c. extruding a second semiconductive power cable composition over the polymer-dielectric insulation to yield a second semiconductive cable layer;
and d. crosslinking the chemically-crosslinkable insulation composition to yield a crosslinked, polymer-dielectric insulation.
a. extruding a power cable semiconductive composition comprising a mixture of a high-temperature polymer, a soft polymer, and a conductive filler, over a metallic conductor to yield a semiconductive cable layer over the metallic conductor;
b. extruding a chemically-crosslinkable insulation composition over the semiconductive cable layer;
c. extruding a second semiconductive power cable composition over the polymer-dielectric insulation to yield a second semiconductive cable layer;
and d. crosslinking the chemically-crosslinkable insulation composition to yield a crosslinked, polymer-dielectric insulation.
20
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US45794303P | 2003-03-27 | 2003-03-27 | |
US60/457,943 | 2003-03-27 | ||
PCT/US2004/009075 WO2004088674A1 (en) | 2003-03-27 | 2004-03-25 | Power cable compositions for strippable adhesion |
Publications (1)
Publication Number | Publication Date |
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CA2520362A1 true CA2520362A1 (en) | 2004-10-14 |
Family
ID=33131732
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CA002520362A Abandoned CA2520362A1 (en) | 2003-03-27 | 2004-03-25 | Power cable compositions for strippable adhesion |
Country Status (8)
Country | Link |
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US (1) | US20060182961A1 (en) |
EP (1) | EP1611585A2 (en) |
JP (1) | JP2006521679A (en) |
CN (1) | CN1762029A (en) |
CA (1) | CA2520362A1 (en) |
MX (1) | MXPA05010313A (en) |
TW (1) | TW200502995A (en) |
WO (1) | WO2004088674A1 (en) |
Families Citing this family (22)
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BRPI0614329A2 (en) * | 2005-08-08 | 2011-03-22 | Cabot Corp | nanotube-containing polymeric compositions |
EP1936638A1 (en) * | 2006-12-18 | 2008-06-25 | Abb Research Ltd. | An electric insulator and use thereof |
US8080735B2 (en) * | 2007-09-25 | 2011-12-20 | Dow Global Technologies Llc | Styrenic polymers as blend components to control adhesion between olefinic substrates |
KR101257152B1 (en) * | 2010-03-16 | 2013-04-23 | 엘에스전선 주식회사 | Semiconductive Composition And The Power Cable Using The Same |
WO2012135170A1 (en) * | 2011-03-29 | 2012-10-04 | Union Carbide Chemicals & Plastics Technology Llc | Semiconductive shield composition with improved strippability |
JP5639010B2 (en) * | 2011-06-20 | 2014-12-10 | 株式会社ビスキャス | Semiconductive resin composition and power cable |
US9336929B2 (en) * | 2012-05-18 | 2016-05-10 | Schlumberger Technology Corporation | Artificial lift equipment power cables |
EP2711938B1 (en) * | 2012-09-25 | 2014-11-26 | Nexans | Silicone multilayer insulation for electric cable |
EP2711934B1 (en) * | 2012-09-25 | 2018-07-11 | Nexans | Silicone multilayer insulation for electric cable |
NO20121547A1 (en) * | 2012-12-21 | 2014-06-23 | Nexans | ROV cable insulation systems |
KR102038709B1 (en) * | 2013-05-15 | 2019-10-30 | 한국전력공사 | Power cable |
WO2014126404A1 (en) * | 2013-02-14 | 2014-08-21 | 엘에스전선 주식회사 | Power cable |
KR102018922B1 (en) * | 2013-04-24 | 2019-09-05 | 한국전력공사 | Power cable |
KR102020068B1 (en) * | 2013-04-29 | 2019-11-04 | 한국전력공사 | Power cable |
KR102020069B1 (en) * | 2013-04-29 | 2019-11-04 | 한국전력공사 | Compact power cable with increased capacitance |
CA2971145C (en) | 2014-12-17 | 2021-06-08 | Prysmian S.P.A. | Energy cable having a cold-strippable semiconductive layer |
CA3001160C (en) | 2015-10-07 | 2023-10-17 | Union Carbide Chemicals & Plastics Technology Llc | Semiconductive shield composition |
CN105820558A (en) * | 2016-05-04 | 2016-08-03 | 安徽省康利亚股份有限公司 | High-abrasion-resistance, halogen-free and flame-retardant insulation material for thin-wall locomotive cable |
JP7181869B2 (en) | 2016-12-21 | 2022-12-01 | ダウ グローバル テクノロジーズ エルエルシー | Curable semiconductor composition |
CN107880383A (en) * | 2017-11-03 | 2018-04-06 | 成都乐维斯科技有限公司 | A kind of novel cable insulating materials |
FR3090985B1 (en) | 2018-12-21 | 2020-12-18 | Nexans | Cable comprising an easily peelable semiconductor layer |
KR102057683B1 (en) * | 2019-04-05 | 2019-12-19 | (주)에스플러스컴텍 | Carbon-based wire manufacturing method and manufacturing apparatus using the same |
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IT1165292B (en) * | 1979-08-30 | 1987-04-22 | Pirelli | ELECTRIC CABLE PERFECTED FOR MEDIUM VOLTAGES |
JPH01246707A (en) * | 1988-03-29 | 1989-10-02 | Hitachi Cable Ltd | Semiconductive resin composition |
CA2228925A1 (en) * | 1997-02-07 | 1998-08-07 | Mitsubishi Chemical Corporation | Semiconductive resin composition and process for producing the same |
JP3551755B2 (en) * | 1998-04-03 | 2004-08-11 | 日立電線株式会社 | Easily peelable semiconductive resin composition and electric wire / cable |
JP4399076B2 (en) * | 1999-04-28 | 2010-01-13 | 日本ユニカー株式会社 | Peelable semiconductive resin composition for external semiconductive layer of water-crosslinked polyethylene insulated power cable |
ATE258709T1 (en) * | 1999-05-13 | 2004-02-15 | Union Carbide Chem Plastic | SEMICONDUCTIVE CABLE SHIELD |
JP4533506B2 (en) * | 1999-09-27 | 2010-09-01 | 日本ユニカー株式会社 | Peelable semiconductive resin composition for externally semiconductive layer of chemically crosslinked polyethylene insulated power cable |
JP4215356B2 (en) * | 1999-10-14 | 2009-01-28 | 日本ユニカー株式会社 | Water-crosslinked polyolefin resin composition, method for producing the same, silane blend used therein, and molded product of the resin composition |
JP3777958B2 (en) * | 2000-07-27 | 2006-05-24 | 日立電線株式会社 | Cross-linked polyethylene insulated power cable suitable for recycling |
US6274066B1 (en) * | 2000-10-11 | 2001-08-14 | General Cable Technologies Corporation | Low adhesion semi-conductive electrical shields |
JP2002179854A (en) * | 2000-12-11 | 2002-06-26 | Du Pont Mitsui Polychem Co Ltd | Resin composition |
US6455771B1 (en) * | 2001-03-08 | 2002-09-24 | Union Carbide Chemicals & Plastics Technology Corporation | Semiconducting shield compositions |
US6972099B2 (en) * | 2003-04-30 | 2005-12-06 | General Cable Technologies Corporation | Strippable cable shield compositions |
-
2004
- 2004-03-25 EP EP04758293A patent/EP1611585A2/en not_active Withdrawn
- 2004-03-25 WO PCT/US2004/009075 patent/WO2004088674A1/en active Application Filing
- 2004-03-25 CA CA002520362A patent/CA2520362A1/en not_active Abandoned
- 2004-03-25 MX MXPA05010313A patent/MXPA05010313A/en unknown
- 2004-03-25 JP JP2006509265A patent/JP2006521679A/en active Pending
- 2004-03-25 US US10/549,828 patent/US20060182961A1/en not_active Abandoned
- 2004-03-25 CN CNA2004800075604A patent/CN1762029A/en active Pending
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JP2006521679A (en) | 2006-09-21 |
WO2004088674A1 (en) | 2004-10-14 |
TW200502995A (en) | 2005-01-16 |
EP1611585A2 (en) | 2006-01-04 |
CN1762029A (en) | 2006-04-19 |
US20060182961A1 (en) | 2006-08-17 |
WO2004088674B1 (en) | 2004-12-16 |
MXPA05010313A (en) | 2005-11-17 |
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