TW200501858A - Method of forming and treating a metal film, semiconductor device and wiring board - Google Patents
Method of forming and treating a metal film, semiconductor device and wiring boardInfo
- Publication number
- TW200501858A TW200501858A TW092135063A TW92135063A TW200501858A TW 200501858 A TW200501858 A TW 200501858A TW 092135063 A TW092135063 A TW 092135063A TW 92135063 A TW92135063 A TW 92135063A TW 200501858 A TW200501858 A TW 200501858A
- Authority
- TW
- Taiwan
- Prior art keywords
- treatment
- resin
- metal film
- forming
- treating
- Prior art date
Links
- 239000002184 metal Substances 0.000 title abstract 2
- 229910052751 metal Inorganic materials 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 4
- 229910052802 copper Inorganic materials 0.000 abstract 4
- 239000010949 copper Substances 0.000 abstract 4
- 239000011347 resin Substances 0.000 abstract 4
- 229920005989 resin Polymers 0.000 abstract 4
- 230000003750 conditioning effect Effects 0.000 abstract 3
- 239000006059 cover glass Substances 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 2
- 230000004913 activation Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
- C23C18/1667—Radiant energy, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/204—Radiation, e.g. UV, laser
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electrochemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A method of forming a metal film of copper on the surface of a resin substrate by successively effecting the conditioning treatment, Pd activation treatment, electroless copper plating treatment and electrolytic copper plating treatment. In the conditioning treatment, a conditioning treatment solution is interposed in the form of a thin layer between the surface and a cover glass plate, and the surface is irradiated with ultraviolet light from the upper side of the cover glass plate. Irradiation with ultraviolet light in the presence of the treatment solution causes the molecules in the surface of the resin to chemically react with the component of the treatment solution, whereby the surface of the resin is more activated to improve the adhesion with copper that is deposited on the surface of the resin.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002360793A JP4064801B2 (en) | 2002-12-12 | 2002-12-12 | Metal film formation processing method, semiconductor device, and wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200501858A true TW200501858A (en) | 2005-01-01 |
Family
ID=32588126
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092135063A TW200501858A (en) | 2002-12-12 | 2003-12-11 | Method of forming and treating a metal film, semiconductor device and wiring board |
Country Status (5)
Country | Link |
---|---|
US (1) | US20040118690A1 (en) |
JP (1) | JP4064801B2 (en) |
KR (1) | KR20040051522A (en) |
CN (1) | CN1508285A (en) |
TW (1) | TW200501858A (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4161107B2 (en) * | 2005-04-13 | 2008-10-08 | セイコーエプソン株式会社 | Plating method and electronic device |
US8394289B2 (en) | 2006-04-18 | 2013-03-12 | Okuno Chemicals Industries Co., Ltd. | Composition for etching treatment of resin molded article |
CN101606445B (en) * | 2006-09-26 | 2012-02-22 | 阿尔普士电气股份有限公司 | Method for manufacturing printed wiring board |
WO2008056603A1 (en) * | 2006-11-06 | 2008-05-15 | Alps Electric Co., Ltd. | Electroless copper plating method |
US20080175986A1 (en) * | 2007-01-24 | 2008-07-24 | Kenneth Crouse | Second surface metallization |
US8000105B2 (en) * | 2008-07-14 | 2011-08-16 | International Business Machines Corporation | Tubular memory module |
US8795502B2 (en) | 2010-05-12 | 2014-08-05 | International Business Machines Corporation | Electrodeposition under illumination without electrical contacts |
JP5968657B2 (en) * | 2012-03-22 | 2016-08-10 | 東京エレクトロン株式会社 | Plating treatment method, plating treatment system, and storage medium |
CN106567058B (en) * | 2015-10-09 | 2019-03-19 | 凯基有限公司 | Chromium-free environment-friendly metal-coated membrane structural system |
JP2020019983A (en) * | 2018-07-31 | 2020-02-06 | セイコーエプソン株式会社 | Wiring substrate and method for manufacturing wiring substrate |
KR102329838B1 (en) * | 2019-04-30 | 2021-11-22 | 도레이첨단소재 주식회사 | Flexible metal clad laminate film, article including the same and method of preparing the film |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19746893B4 (en) * | 1997-10-23 | 2005-09-01 | Siemens Ag | Optoelectronic component with heat sink in the base part and method for the production |
US6589883B2 (en) * | 2000-03-29 | 2003-07-08 | Georgia Tech Research Corporation | Enhancement, stabilization and metallization of porous silicon |
JP3527694B2 (en) * | 2000-08-11 | 2004-05-17 | 新光電気工業株式会社 | Manufacturing method of wiring board |
TW562873B (en) * | 2001-08-31 | 2003-11-21 | Kanto Kasei Kogyo | Method of plating nonconductor product |
-
2002
- 2002-12-12 JP JP2002360793A patent/JP4064801B2/en not_active Expired - Fee Related
-
2003
- 2003-12-10 KR KR1020030089255A patent/KR20040051522A/en not_active Application Discontinuation
- 2003-12-11 TW TW092135063A patent/TW200501858A/en unknown
- 2003-12-11 US US10/732,252 patent/US20040118690A1/en not_active Abandoned
- 2003-12-12 CN CNA2003101185971A patent/CN1508285A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20040118690A1 (en) | 2004-06-24 |
JP2004190104A (en) | 2004-07-08 |
JP4064801B2 (en) | 2008-03-19 |
CN1508285A (en) | 2004-06-30 |
KR20040051522A (en) | 2004-06-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200501858A (en) | Method of forming and treating a metal film, semiconductor device and wiring board | |
Charbonnier et al. | Polymer pretreatments for enhanced adhesion of metals deposited by the electroless process | |
TWI415680B (en) | Palladium complex and the use of the catalyst to impart treatment liquid | |
TW200714741A (en) | Patterned electroless metallization processes for large area electronics | |
DE59503657D1 (en) | Process for the structured metallization of the surface of substrates | |
TW200730063A (en) | Method for forming wiring on insulating resin layer | |
MY148655A (en) | Metal pattern forming method, metal pattern obtained by the same, printed wiring board, conductive film forming method, and conductive film obtained by the same | |
WO2007111671A8 (en) | Polyimide substrate and method of manufacturing printed wiring board using the same | |
US8052858B2 (en) | Pretreatment method for electroless plating material and method for producing member having plated coating | |
TW200635464A (en) | Method for producing printed wiring board | |
DE3681222D1 (en) | METHOD FOR CHEMICALLY METALLIZING AN ELECTRICALLY POOR CONDUCTING BODY FROM AN INORGANIC MATERIAL. | |
EP1375595A4 (en) | Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates | |
WO2003021005A1 (en) | Method of plating nonconductor product | |
JP2007017921A (en) | Printed circuit board and method for producing the same | |
TW200730670A (en) | Method of using ultrasonics to plate silver | |
TW200640938A (en) | Resin base material, electronic part base material having electroless plating applied thereon, and manufacturing method of the electronic part base material | |
US7078789B2 (en) | Method of forming a metal film, semiconductor device and wiring board | |
MY135932A (en) | "method for electroless metalisation of polymer substrate" | |
EP0272420A3 (en) | Photopatterned aromatic polymeric substrates, method for making same and use | |
JP4769934B2 (en) | Plastic surface modification method, plastic surface plating method, and plastic | |
JP2010001543A (en) | Method for forming copper film, and wiring board | |
JP5956553B2 (en) | Resin product with plating film and manufacturing method thereof | |
KR100904251B1 (en) | Selective adsorption method of novel precious metal catalyst on polymer surface | |
JP4332795B2 (en) | Electroless plating method | |
JP2005248314A (en) | Plating method for nonconducting plate |