200427565 (1) 玖、發明說明 【發明所屬之技術領域】 本發明係關於微結構之微熱壓印成型方法’具體而言 ，關於以經過升溫的高壓流體直接加熱加壓於置於模具上 之待壓印標的，藉以將模具上的微結構複製至待壓印標的 上之快速加熱冷卻暨均勻施壓的微熱壓印方法。 【先前技術】 近年來，微機電系統（Micro-Electro-Mechanical Systems，簡稱MEMS)的發展在世界各地都備受矚目。此 系統爲一種包括光學、機械、電子、材料、控制、化學等 多重科技整合的技術，利用此微型製造技術可使產品微小 化而提高其性能、品質、可靠度及附加價値，同時降低製 造成本。細如毫髮的微機電系統未來在光電通訊、影像傳 輸、生化醫療、資訊儲存、與精密機械等應用領域將扮演 重要的角色。 微熱壓印法（Hot E mb os sing)是微機電系統製造領域之 中，重要的微結構複製（Replication)成型技術。此製程乃 是用來將矽晶圓母版（Stamper，Master，亦可稱模具）或電 鑄鎳模版上面的微結構複製至待壓印標的，以完成高精度 與高品質之微機電成品製造。其中，微結構係指以微米（ // m)或奈米（nm)爲尺寸量度單位。所做出之微結構可以直 接用作零組件，或是經過其他製程再利用。 其應用領域可分爲微透鏡（Micro Lens)、微光柵 (2) (2)200427565 (Grating)、微繞射元件（Diffractive Optical Element)等微 光學元件成型；微生物晶片（Bio-Chip)、微通道（Micro Channel)、微感測器（Micro Sensors)等微生技成型；薄壁 、溝槽（Micro Groove)、微齒輪等微機械元件成型；微加 速規等具微電子電路與微結構之元件成型等。熱壓印製程 被認爲在微機電產業中，是降低生產成本，提高產能的關 鍵複製量產製程。 微熱壓印製程主要包括下述步驟：備料、加熱、熱壓 、保壓冷卻、脫模取出成品。以常用之待壓印物塑膠而言 ，熱壓印時塑膠材料之溫度必須在其玻璃轉移溫度（Glass Transition Temperature)以上才會開始軟化，以壓板施壓 下降壓住塑膠/模具，塑膠因壓印力產生流動變形而充塡 微模穴。塑料充塡完畢之後，必須將溫度降至玻璃轉移溫 度之下方能進行脫模。此時，溫度下降會使塑膠材料產生 收縮，因此必須維持一定之壓印力當作保壓力，讓模穴內 之塑料在產生收縮之同時，能繼續有塑料充塡模穴，補充 塑料收縮掉的部分’俟溫度降至玻璃轉移溫度之下脫模取 出成品。 習知的微熱壓印製程皆係利用油壓缸、氣壓缸或馬達 /螺桿作爲加壓機構，直接驅動壓板壓住塑膠與模具來熱 壓成型。舉例而言，如第6圖所示，根據習知技藝，熱壓 印過程爲首先將模具1〇2固定在上壓板l〇3a上，模具 1 〇2上方通常會再加墊一層緩衝材料（通常是矽膠），而作 爲待壓印標的之塑膠材料1 〇 1置放於下壓板1 〇 3 b處，壓 (3) (3)200427565 板爲一加熱冷卻裝置1 0 5構造，此壓板可用以加熱及冷卻 塑膠和模具。之後由油壓缸、氣壓缸或馬達/螺桿加壓機 構（106)，直接驅動壓板壓住塑膠與模具來熱壓成型；待 經過一段適當的壓印時間，及冷卻再開模取出成品。 習知的微熱壓印技術可參考德國 JENOPTIK Mikrotechnik公司所提出之美國第5,993，189號專利、德 國1 96,4 8,8 44號專利，都採取用壓板熱壓機構方式。 根據習知的微熱壓印成型法，是藉由壓板機構 (103a, 103b)來加熱加壓。壓板本身具有加熱冷卻功能，又 稱爲熱盤。壓板（熱盤）內的加熱器或加熱管路105發熱後 ，先加熱整塊熱盤，再藉由熱傳導（Conduction)方式，將 熱量傳遞至壓板上的模具1 02與塑膠1 0 1，以使塑膠達到 軟化溫度，才能進行壓印。在冷卻階段，藉由壓板內之冷 卻管路1 〇 5通入冷流體，須先冷卻整塊壓板，才能冷卻待 壓印物。此種壓板式熱盤加熱冷卻方式，需將整塊熱盤升 溫及降溫，每一循環（Cycle)約需花費數十分鐘至數小時 ，製程耗時且浪費能源。在微結構製品之複製成型中，熱 壓成型的製程時間明顯較其他兩種競爭製程（微射出成型 、鑄造成型）長。時間成本之高，實爲此一製程之弊病。 此外，微熱印成型法在執行熱壓印時，由於壓板中間 處壓印力大，靠近壓板邊緣處則壓印力小。因此，在實施 微熱壓印成型法時，通常以矽膠板（Silicone Rubber)作爲 模具之緩衝襯墊使模具與待壓印物能緊密地貼合，以緩和 與平衡壓力不均之影響，達到均勻之成型。然而矽膠板容 -6- (4) (4)200427565 易伸張變形，且受限於固態材料本身的伸張特性，壓印力 無法達到理想均勻分佈狀態。在充塡階段，壓印力分佈的 不均會導致塑膠在各微模穴充塡不一；在冷卻階段，保壓 壓印力的不均則會造成塑膠收縮的不均勻，嚴重影響成品 微結構複製後的尺寸，使微機電成品無法達到高精度與高 品質之要求。這項缺陷使得目前熱壓印製程良率不高，複 製量產功能大打折扣。 然而，由於採用直接壓板熱壓印機構方式，所以，在 © 進行大面積熱壓印時，壓力分佈問題更是一項極困難的挑 戰。玻璃、矽晶圓等脆性材料模具，在壓印過程中，容易 破裂。因此，當前熱壓印面積均侷限於小尺寸。舉例而言 ，德國 JENOPTIK Mikrotechnik 公司之最先進機型HEX-03， 其 最大熱 壓印面 積只有 130mm。 再者，在現今發展至1 2英吋晶圓之半導體產業技術 中，矽製程製作面積也愈來愈大，微熱壓印成型製程需要 能夠進行快速加熱冷卻暨均勻施壓的大面積壓印，以使以 ® 矽製程爲基礎的微機電系統的製造，能夠降低每單位面積 的製作成本，提升總體產能。 【發明內容】 鑑於上述習知技術之問題，本發明提供快速加熱冷卻 且均勻施壓之微熱壓印成型方法。 根據本發明之一態樣，提供用於模製微結構的快速加 熱冷卻暨均勻施壓之微熱壓印成型方法，在密閉室內’將 -7 - (5) (5)200427565 待壓印標的設於模具上而形成待壓印組合，直接施壓至該 待壓印組合，將形成於該模具上的微結構複製至該待壓印 標的，其特徵在於：該待壓印標的將該密閉室內分隔成第 一及第二空間，該模具與該待壓印標的所形成之待壓印組 合處於第二空間內，在待壓印標的處於可塑性狀態下，以 通入於第一空間內之高壓流體直接施壓至該待壓印組合， 不須藉由任何施壓機構施壓至該待壓印組合，即可將該模 具上的微結構複製至該待壓印標的上。 根據本發明之另一態樣，提供用於模製微結構的快速 加熱冷卻暨均勻施壓之微熱壓印成型方法，用於將微結構 複製至待壓印標的的雙面上，在密閉室內，以密封膜 、 二分別的模具、與夾於二模具之間的待壓印標的形成待壓 印組合，將二分別模具上的微結構複製至該待壓印標的上 ，其特徵在於：該密封膜將該密閉室分隔成第一空間及第 二空間，該待壓組合處於第二空間內，在該待壓印標的處 於可塑性狀態下，以通入第一空間內之高壓流體，直接施 壓至該待壓印組合，不須藉由任何施壓機構施壓至該待壓 印組合，即可將二分別的模具組上的微結構同時複製至該 待壓印標的之^面上。 又根據本發明，該待壓印標的係由升溫至足以使待壓 印標的處於可塑性狀態之通入第一空間內的高壓流體加熱 至可塑性狀態。 再根據本發明，如果使用氣體，該待壓印標的係經由 遠紅外線加熱器、高週波加熱器、紫外光加熱器、及鹵素 (6) (6)200427565 燈等輻射加熱器加熱至足以處於可塑性狀態，再藉由氣體 全面均勻施壓。 再者，根據本發明，在該升溫的高壓流體通入該待壓 印組合一段時間後，將諸如液態氮等冷卻流體導入密閉室 內，快速冷卻該待壓印組合。 在執行熱壓印時，高壓流體之壓力爲〇·5 kgf/cm2至 3 5 0 k g f/ c m 2，熱壓進行時間爲1 〇秒至3 0分鐘。 根據本發明，在密閉空間中，使用溫度升高的高壓流 體以進行微熱壓印成型時，由於流體分子之等壓分佈特性 ，熱壓印面積不受限制，可精準地進行極大面積之熱壓印 ，並且因高壓流體本身之溫度高至足以使待壓印標的處於 塑化狀態，因而可以免除習知技藝冗長的升溫時間長或冷 卻時間長等缺點，可以簡化製程及高效率地完成熱壓印， 進而降低成本。 【實施方式】 較佳實施例詳述 實施例1 圖1(a)至1(d)係顯示根據本發明之模製微結構的快速 加熱冷卻暨均勻施壓之微熱壓印成型方法之第一實施例。 如圖1 (a)所示，預先將作爲待壓印標的1之諸如塑膠膜材 料（P C膜）1平鋪置放於具有預定微結構之模具2上，以 模具2具有微結構之一面與待壓印標的相接觸。如此形成 之塑膠/模具之堆疊組合係設在操作台1 0上。舉例而言， 熱壓印模具2爲脆性材料（如矽晶圓母模、玻璃母模等等） (7) (7)200427565 接著如圖1 (b )所示，將一密閉腔1 2蓋在此塑膠/模具 堆疊組合上，而與塑膠/模具堆疊形成一密閉空間，密閉 腔連接至油壓或曲柄（圖上未示出）以進行快速開合密閉腔 動作。此密閉腔經由管路1 4連接至一高壓流體源1 8及一 壓力控制閥1 6，高壓流體源1 8提供經過升溫的高壓流體 。舉例而言，流體可爲諸如惰性氣體等氣體或是諸如油等 流體。 然後如圖1(c)所示，從高壓流體源18通入經過升溫 的高壓流體，經由壓力控制閥將此流體壓力調至塑膠膜的 成型壓力條件，舉例而言，大約〇.5〜35〇kgf/cm2之流體壓 力。由於高壓流體的溫度高至足以將作爲壓印標的1之塑 膠加熱至其玻璃轉移溫度以上，所以，可以使塑膠處於軟 化可塑性狀態。在此高壓流體中，由於塑膠膜因已軟化並 受壓印力而開始模穴的充塡，待一段時間後，開始進行冷 卻並同時持續保壓。如圖4所示，在進行冷卻時’可以將 冷卻水或是冷媒等導入設在操作台或是模腔內部中的冷卻 導管以執行冷卻。 當塑膠完成整體工件輪廓的充塡後，將流體洩出’再 打開密閉腔，取出成品（如圖1(d)所示）。 實施例2 圖2(a)至2(e)係顯示根據本發明之第二實施例，用以 模製雙表面微結構元件。如圖2(a)所示，預先將作爲待壓 -10- (8) (8)200427565 印標的1之成型用塑膠膜材料（如PC膜）1夾放於上、下 模具2a、2b之間，使其成爲一上模具/塑膠膜/下模具之 三明治堆疊組合。上模具與下模具分別具有微結構形成於 上，在組成三明治堆疊時，係以上模具與下模具個別設有 微結構的面互相對立而將塑膠膜1夾在其間。其中該上模 具/塑膠膜/下模具之三明治堆疊組合係放在一操作台10 上。 接著如圖2(b)所示，再將一片密封膜8平鋪在此三明 治堆疊組合之上，而形成了密封膜/上模具/塑膠膜/下模具 之四層堆疊組合。此密封膜8會將三明治堆疊組合完全覆 蓋並留下餘留部份足以與操作台1 〇緊密接合，再如下所 述般藉由密閉腔1 2壓於其上而形成密閉空間。 接著，如圖2(c)所示，以一密閉腔12將塑膠膜1及 密封膜8之餘留部份緊壓在工作台1 〇上，而使此四層堆 疊組合完全置於密閉腔1 2內。密閉腔1 2連接至油壓或曲 柄（圖上未示出）以進行快速開合密閉腔動作。此密閉腔1 2 經由管路1 4連接至一高壓流體源1 8及一壓力控制閥1 6 。如上所述般，高壓流體源供應經過升溫的高壓流體。 然後如圖2(d)所示，從高壓流體源18通入經過升溫 的高壓流體，經由壓力控制閥將此流體壓力調至塑膠膜的 成型壓力條件，舉例而言，大約〇·5〜3 5 0kgf/cm2之壓力。 由於高壓流體的溫度高至足以將作爲壓印標的之塑膠加熱 至其玻璃轉移溫度以上，所以，可以使塑膠處於軟化可塑 性狀態。在此高壓流體中，由於塑膠膜因已軟化並受壓印 -11 - (9) (9)200427565 力而開始模穴的充塡’待一段時間後，開始進行冷卻並同 時持續保壓。如圖4所示，在進行冷卻時，可以將冷卻水 或是冷媒等導入設在操作台或是模腔內部中的冷卻導管以 執行冷卻。 此熱壓時間，較佳地在1 0秒-3 0分鐘。此外，密封 膜8的玻璃轉換溫度較佳地高於作爲待壓印標的之塑膠膜 1的玻璃轉印溫度。 在整體微結構輪廓完整地轉印於塑膠膜1後，經由壓 β 力控制閥1 6將流體洩出，再打開密閉腔1 2，取出成品（ 如圖2(e)所示）。 實施例3 圖3(a)至3(e)係顯示根據本發明的模製微結構的快速 加熱冷卻暨均勻施壓之微熱壓印成型方法之第三實施例。 如圖3 ( a)所示，預先將例如高分子溶液塗佈於例如矽晶圓 等基底5上，再加以烘烤硬化而形成待壓印層4，然後將 具有微結構之模具2的一面置於待壓印層4上’成爲模具 /矽晶圓堆疊組合。將此堆疊組合置放在一操作台1 0上。 接著，如圖3 (b)所示’再將一片密閉膜8平鋪在此模 具/矽晶圓堆疊組合之上，而形成了密封膜/模具/基底之層 狀堆疊組合。此密封膜的功丨系用來旨日合祖、閉肖空_ 丫了流體 微熱壓印。 再來，如圖3 (c)所示’將一密閉腔1 2蓋住此層狀堆 疊組合，使其成爲一密閉空間’密閉腔1 2連接至油壓缸 -12- (10) (10)200427565 或曲柄（圖上未示出）以進行快速開合密閉腔12動作。此 密閉腔1 2經由管路1 4連接至一高壓流體源1 8及一壓力 控制閥1 ό 〇 然後如圖3(d)所示，從高壓流體源18通入經過升溫 的高壓流體，經由壓力控制閥將此流體壓力調至待壓印層 4的成型壓力條件，舉例而言，大約0.5〜3 5 0 kgf/cm2之流 體壓力。由於高壓流體的溫度高至足以將作爲壓印標的之 待壓印層加熱至其玻璃轉移溫度以上，所以，可以使此待 ® 壓印層處於軟化可塑性狀態。在此高壓流體中’由於壓印 層因已軟化並受壓印力而開始模穴的充塡’待一段時間後 ，開始進行冷卻並同時持續保壓。如圖4所示，在進行冷 卻時，可以將冷卻水或是冷媒等導入設在操作台或是模腔 內部中的冷卻導管以執行冷卻。 當模具2上的整體微結構輪廓完全轉印至待壓印層4 上後，經由壓力控制閥1 6將流體排出，再打開密閉腔’200427565 (1) 发明 Description of the invention [Technical field to which the invention belongs] The present invention relates to a micro-hot stamping method for microstructures. Specifically, the invention relates to a method of directly heating and pressing a heated high-pressure fluid on a mold to be placed on a mold. Micro-heat embossing method for rapid heating, cooling, and uniform pressure application of the microstructure on the mold by which the microstructure on the mold is copied to the target to be embossed. [Previous Technology] In recent years, the development of Micro-Electro-Mechanical Systems (MEMS) has attracted much attention around the world. This system is a multi-technology integration technology including optics, machinery, electronics, materials, control, chemistry, etc. Using this micro-manufacturing technology can miniaturize the product and improve its performance, quality, reliability and additional price, while reducing manufacturing costs . The micro-electromechanical system, which is small in size, will play an important role in the application fields of optoelectronic communication, image transmission, biochemical medicine, information storage, and precision machinery. Hot embossing is an important microstructure replication molding technology in the field of microelectromechanical system manufacturing. This process is used to copy the microstructure on the silicon wafer master (Stamper, Master, also called mold) or electroformed nickel stencil to the target to be imprinted to complete the manufacture of high-precision and high-quality micro-electromechanical products. . The microstructure refers to a unit of measurement in micrometers (// m) or nanometers (nm). The resulting microstructure can be used directly as a component or reused through other processes. Its application fields can be divided into micro-lens (Micro Lens), micro-grating (2) (2) 200427565 (Grating), micro-diffractive element (Diffractive Optical Element) and other micro-optical element molding; microbial wafer (Bio-Chip), micro Micro-channel technology (Micro Channel), micro-sensors (Micro Sensors), etc .; thin-wall, groove (Micro Groove), micro-gear and other micro-mechanical components; micro-acceleration gauges with microelectronic circuits and micro-structures Component molding, etc. The hot stamping process is considered to be a key copying mass production process in the micro-electromechanical industry to reduce production costs and increase production capacity. The micro-hot stamping process mainly includes the following steps: material preparation, heating, hot pressing, pressure holding cooling, and demoulding to remove the finished product. In terms of commonly used plastics to be imprinted, the temperature of the plastic material must be above the glass transition temperature during hot embossing before it starts to soften. The plastic / mold is pressed by the pressure of the pressure plate and lowered. The printing force generates flow deformation and fills the micro mold cavity. After the plastic is filled, the temperature must be lowered below the glass transition temperature for demoulding. At this time, the temperature drop will cause the plastic material to shrink, so it is necessary to maintain a certain embossing force as a holding pressure, so that the plastic in the cavity can continue to be filled with plastic while the shrinkage occurs, and the plastic will shrink. Part of the '俟 temperature drops below the glass transition temperature to demold the finished product. The conventional micro-hot stamping process uses a hydraulic cylinder, a pneumatic cylinder, or a motor / screw as a pressurizing mechanism, and directly drives the pressing plate to press the plastic and the mold for hot pressing. For example, as shown in FIG. 6, according to the conventional technique, the hot stamping process is to first fix the mold 102 on the upper plate 103a, and a layer of buffer material is usually added above the mold 102 ( Silicone is usually used), and the plastic material 1 〇1, which is the target to be imprinted, is placed at the bottom plate 1 〇3 b. The plate (3) (3) 200427565 is a heating and cooling device 105 structure. This plate can be used. To heat and cool plastics and molds. After that, the hydraulic cylinder, pneumatic cylinder or motor / screw pressurizing mechanism (106) directly drives the pressure plate to press the plastic and mold for hot-press molding; after a suitable imprint time, and after cooling, the mold is opened to take out the finished product. The conventional micro-hot embossing technology can refer to the US Patent No. 5,993,189 and the German Patent No. 1,96,4,8,44 and 44 proposed by JENOPTIK Mikrotechnik of Germany, both adopting a platen hot pressing mechanism. According to the conventional micro-hot embossing method, heat and pressure are applied by a platen mechanism (103a, 103b). The platen itself has a heating and cooling function, also known as a hot plate. After the heater or heating pipe 105 in the platen (hot plate) generates heat, the entire plate is first heated, and then the heat is transferred to the mold 1 02 and plastic 1 0 1 on the platen by the method of conduction. Allow the plastic to reach the softening temperature before embossing. In the cooling stage, cold fluid is introduced through the cooling pipe 105 in the pressure plate, and the entire pressure plate must be cooled before cooling the material to be imprinted. This platen-type hot plate heating and cooling method requires the entire hot plate to be heated and cooled. Each cycle takes about tens of minutes to several hours, and the process is time-consuming and wastes energy. In the replication molding of microstructured products, the process time of hot press molding is obviously longer than the other two competing processes (micro injection molding, casting molding). The high cost of time is indeed a drawback of this process. In addition, in the micro-hot stamping method, when the hot stamping is performed, since the stamping force is large at the middle of the platen, the stamping force is small near the edge of the platen. Therefore, in the implementation of the micro-hot embossing method, a Silicone Rubber (Silicone Rubber) is usually used as the cushioning cushion of the mold, so that the mold and the object to be imprinted can be closely adhered to alleviate and balance the impact of uneven pressure and achieve uniform Of molding. However, the capacity of the silicone sheet -6- (4) (4) 200427565 is easy to stretch and deform, and due to the stretch characteristics of the solid material itself, the imprint force cannot reach the ideal uniform distribution state. In the filling stage, the uneven distribution of the embossing force will cause the plastic to fill differently in the micro-cavities; in the cooling stage, the uneven retaining embossing force will cause the uneven shrinkage of the plastic, which will seriously affect the finished product. The size of the structure after copying makes the finished micro-electromechanical products unable to meet the requirements of high precision and high quality. This defect makes the current yield rate of the hot stamping process is not high, and the replication mass production function is greatly reduced. However, due to the direct platen hot stamping mechanism, when using large area hot stamping, the problem of pressure distribution is a very difficult challenge. Molds of brittle materials such as glass and silicon wafers are prone to cracking during the embossing process. Therefore, the current hot embossing area is limited to a small size. For example, the most advanced model of the German company JENOPTIK Mikrotechnik HEX-03 has a maximum hot stamping area of only 130 mm. In addition, in the semiconductor industry technology that has developed to 12-inch wafers today, the silicon manufacturing area has become larger and larger, and the micro-hot stamping molding process requires large-area stamping capable of rapid heating and cooling and uniform pressure. The manufacturing of MEMS based on the ® silicon process can reduce the production cost per unit area and increase the overall capacity. [Summary of the Invention] In view of the problems of the conventional techniques described above, the present invention provides a micro-hot embossing method for rapid heating and cooling and uniform pressure application. According to one aspect of the present invention, a micro-heat embossing molding method for rapid heating and cooling of mold microstructures and uniform pressure application is provided. In a sealed room, the setting of -7-(5) (5) 200427565 to be embossed is set. The combination to be imprinted is formed on the mold, and the pressure is directly applied to the combination to be imprinted, and the microstructure formed on the mold is copied to the target to be imprinted, which is characterized in that the target to be imprinted is enclosed in an enclosed room. It is divided into a first space and a second space, and the mold and the mark to be embossed are in a second space. When the mark to be embossed is in a plastic state, the high pressure in the first space is passed through. The fluid is directly pressed to the to-be-embossed combination, and the microstructure on the mold can be copied to the to-be-embossed target without applying pressure to the to-be-embossed combination by any pressing mechanism. According to another aspect of the present invention, there is provided a micro-heat embossing molding method for rapid heating and cooling of mold microstructures and uniform pressure application, for copying microstructures to both sides of a target to be embossed in a closed chamber. The seal structure, two separate molds, and the mark to be imprinted formed between the two molds are used to form a to-be-embossed combination, and the microstructure on the two separate molds is copied to the to-be-imprinted mark, which is characterized in that: The sealing film divides the closed chamber into a first space and a second space. The combination to be pressed is located in the second space. When the target to be printed is in a plastic state, the high-pressure fluid in the first space is directly applied. When pressed to the to-be-embossed combination, the microstructures on two separate mold sets can be simultaneously copied to the ^ face of the to-be-embossed target without applying pressure to the to-be-embossed combination by any pressure mechanism. According to the present invention, the target to be embossed is heated to a plastic state by a high-pressure fluid that is heated enough to cause the target to be embossed to pass into the first space in a plastic state. According to the present invention, if a gas is used, the target to be imprinted is heated by a radiant heater such as a far-infrared heater, a high-frequency heater, an ultraviolet heater, and a halogen (6) (6) 200427565 lamp to be sufficiently plastic. State, and then the pressure is fully and evenly applied by the gas. Furthermore, according to the present invention, after the heated high-pressure fluid is passed into the combination to be embossed for a period of time, a cooling fluid such as liquid nitrogen is introduced into the closed chamber to rapidly cool the combination to be embossed. When performing hot embossing, the pressure of the high-pressure fluid is 0.5 kgf / cm2 to 350 kg f / cm2, and the hot pressing time is 10 seconds to 30 minutes. According to the present invention, when a high-temperature fluid with an elevated temperature is used to perform micro-hot embossing in a confined space, the hot-embossed area is not limited due to the isobaric distribution characteristics of the fluid molecules, and the hot pressing of a large area can be accurately performed Printing, and because the temperature of the high-pressure fluid itself is high enough to make the target to be embossed in a plasticized state, it can avoid the shortcomings of long and long heating time or long cooling time, which can simplify the process and complete hot pressing efficiently. Printing, thereby reducing costs. [Embodiment] The preferred embodiment is described in detail in Example 1. Figures 1 (a) to 1 (d) show the first method of micro-heat embossing for rapid heating and cooling and uniform pressure of a molded microstructure according to the present invention. Examples. As shown in FIG. 1 (a), a material such as a plastic film (PC film) 1 as a target 1 to be imprinted is laid in advance on a mold 2 having a predetermined microstructure, and the mold 2 has a microstructure on one side and The contacts to be imprinted. The thus-formed plastic / mold stack combination is set on the operation table 10. For example, the hot stamping mold 2 is a brittle material (such as a silicon wafer master mold, a glass master mold, etc.) (7) (7) 200427565 Next, as shown in FIG. 1 (b), a closed cavity 12 is covered. On this plastic / mold stack combination, a closed space is formed with the plastic / mold stack, and the closed cavity is connected to an oil pressure or a crank (not shown in the figure) for quick opening and closing of the closed cavity. The closed chamber is connected to a high-pressure fluid source 18 and a pressure control valve 16 via a pipeline 14. The high-pressure fluid source 18 provides a heated high-pressure fluid. For example, the fluid may be a gas such as an inert gas or a fluid such as oil. Then, as shown in FIG. 1 (c), the heated high-pressure fluid is passed in from the high-pressure fluid source 18, and the pressure of the fluid is adjusted to the molding pressure condition of the plastic film through a pressure control valve. For example, about 0.5 to 35 〇kgf / cm2 fluid pressure. Since the temperature of the high-pressure fluid is high enough to heat the plastic 1 as an imprint target above its glass transition temperature, the plastic can be placed in a softened and plastic state. In this high-pressure fluid, because the plastic film has been softened and under embossing force, filling of the mold cavity has begun. After a period of time, cooling is started and pressure is continuously maintained. As shown in FIG. 4, when cooling is performed, the cooling water or refrigerant may be introduced into a cooling duct provided in the operation table or inside the cavity to perform cooling. After the plastic is filled with the overall workpiece outline, the fluid is drained ’and the closed cavity is opened to take out the finished product (as shown in Figure 1 (d)). Embodiment 2 Figs. 2 (a) to 2 (e) show a second embodiment for molding a dual-surface microstructured element according to the present invention. As shown in Fig. 2 (a), a plastic film material (such as a PC film) 1 for molding that is to be pressed -10- (8) (8) 200427565 1 is placed in advance on the upper and lower molds 2a, 2b. Make it a sandwich stacking combination of upper mold / plastic film / lower mold. The upper mold and the lower mold respectively have microstructures formed on the upper mold. When forming a sandwich stack, the upper mold and the lower mold are provided with microstructured surfaces facing each other to sandwich the plastic film 1 therebetween. The sandwich stacking combination of the upper mold / plastic film / lower mold is placed on an operation table 10. Next, as shown in FIG. 2 (b), a piece of sealing film 8 is tiled on top of this San Meiji stacking assembly to form a four-layer stacking assembly of sealing film / upper mold / plastic film / lower mold. This sealing film 8 completely covers the sandwich stack combination and leaves a sufficient portion to be tightly connected to the operation table 10, and then forms a closed space by pressing the closed cavity 12 on it as described below. Next, as shown in FIG. 2 (c), the remaining part of the plastic film 1 and the sealing film 8 is tightly pressed on the workbench 10 with a closed cavity 12, so that the four-layer stacking assembly is completely placed in the closed cavity. 1 2 within. The closed chamber 12 is connected to an oil pressure or crank (not shown) for quick opening and closing of the closed chamber. The closed chamber 12 is connected to a high-pressure fluid source 18 and a pressure control valve 16 via a pipeline 14. As described above, the high-pressure fluid source supplies the heated high-pressure fluid. Then, as shown in FIG. 2 (d), the heated high-pressure fluid is passed in from the high-pressure fluid source 18, and the pressure of the fluid is adjusted to the molding pressure condition of the plastic film through a pressure control valve. For example, about 0.5 to 3 50 kgf / cm2 pressure. Since the temperature of the high-pressure fluid is high enough to heat the plastic used as an imprint target above its glass transition temperature, the plastic can be softened and plasticized. In this high-pressure fluid, because the plastic film has been softened and imprinted -11-(9) (9) 200427565, the filling of the mold cavity has begun. After a period of time, the cooling is started and the pressure is continuously maintained. As shown in FIG. 4, during cooling, cooling water or a refrigerant can be introduced into a cooling duct provided in the operation table or inside the mold cavity to perform cooling. The heat pressing time is preferably in the range of 10 seconds to 30 minutes. In addition, the glass transition temperature of the sealing film 8 is preferably higher than the glass transfer temperature of the plastic film 1 as a target to be imprinted. After the overall microstructure outline is completely transferred to the plastic film 1, the fluid is discharged through the pressure β force control valve 16 and the closed chamber 12 is opened to take out the finished product (as shown in FIG. 2 (e)). Embodiment 3 Figs. 3 (a) to 3 (e) show a third embodiment of the micro-heat embossing method for rapid heating and cooling and uniform pressure of a molded microstructure according to the present invention. As shown in FIG. 3 (a), a polymer solution, such as a silicon wafer, is coated on a substrate 5 in advance, and then baked and hardened to form a layer 4 to be imprinted, and then one side of the mold 2 having a microstructure is formed. It is placed on the layer 4 to be imprinted to become a mold / silicon wafer stacking combination. This stacking assembly is placed on an operation table 10. Next, as shown in FIG. 3 (b), a sealing film 8 is further laid on this mold / silicon wafer stack combination to form a layered stack combination of a sealing film / mold / base. The function of this sealing film is to combine Japanese ancestors and closed Xiaokong _ fluid. Micro-heat embossing. Then, as shown in FIG. 3 (c), 'closing a closed cavity 12 to cover this layered stacking combination to make it a closed space.' The closed cavity 1 2 is connected to the hydraulic cylinder -12- (10) (10 ) 200427565 or crank (not shown) for quick opening and closing of the closed chamber 12 action. The closed chamber 12 is connected to a high-pressure fluid source 18 and a pressure control valve 1 via a pipeline 14 and then as shown in FIG. The pressure control valve adjusts the pressure of the fluid to the molding pressure condition of the layer 4 to be imprinted, for example, a fluid pressure of about 0.5 to 350 kgf / cm2. Since the temperature of the high-pressure fluid is high enough to heat the layer to be imprinted as an imprint target above its glass transition temperature, the layer to be imprinted can be softened and plasticized. In this high-pressure fluid, 'cause filling of the mold cavity is started because the embossed layer is softened and subjected to embossing force', after a period of time, cooling is started and pressure is maintained. As shown in Fig. 4, during cooling, cooling water or a refrigerant can be introduced into a cooling duct provided in the operation table or inside the mold cavity to perform cooling. When the overall microstructure profile on the mold 2 is completely transferred to the layer 4 to be imprinted, the fluid is discharged through the pressure control valve 16 and the closed cavity is opened again ’
取出成品（如圖3 ( e)所示）。 I 實施例4 本實施例與上述實施例不同之處在於通入至密閉腔內 之諸如媒油等高壓流體的溫度控制。根據本實施例’通入 密閉腔1 2內的高壓流體在通入之前先經升溫至一溫度° 當此升溫的高壓流體通入密閉腔內後，再以高溫流體通入 如圖4所示之設於密閉腔內的導管1 0 0，以使高壓流體升溫 至足以使待壓印標的處於可塑形狀態。本實施例可以與貫 -13 - (11) (11)200427565 施例1至4自由地組合以完成微熱壓印成形。 實施例5 在上述實施例中，皆以高溫流體執行熱壓印成型。根 據本實施例，與上述實施例相異之處主要在於以未經加熱 的高壓流體通入模腔內，然後，如圖5所示之設於模腔 1 2內的輻射加熱器1 9執行加熱，使侍壓印物達到玻璃轉 印溫度，再施以高壓氣體，執行熱壓印。舉例而言，輻射 加熱器可爲遠紅外線加熱器、高週波、紫外光、鹵素燈等 加熱器。本實施例可以與上述實施例1- 5自由地組合以執 行微熱壓印成型。 雖然上述中以較佳實施例說明本發明，但是，其僅作 爲說明之用並非用以限定本發明，任何熟悉此項技藝者， 在不脫離本發明之精神和範圍內，可對上述實施例作改變 及修改，本發明之範圍以後附之申請專利範圍所界定者爲 準。 舉例而言，依據本發明，進行流體微熱壓印成型所使 用的流體爲蒸汽、油、氣體空氣，或其它惰性氣體（如氬 氣、氮氣等），或這些氣體的混合氣體、以及水、液態氣 等冷卻流體。 舉例而言，待壓印標的除了塑膠模、塑膠板、光阻等 高分子單體外，尙可使用例如鋁箔、金箔等金屬箔和陶瓷 胚料。此外，本說明書中所指的塑膠板係指厚度〇.2mm 以上，塑膠膜係指厚度〇. 2 mm以下。 -14- (12) (12)200427565 舉例而s ’本發明所使用的微熱壓印模具（母版）包括 :經由微機械微加工之丨吴具、經由砂製程製作出之砂晶圓 母版模具（舉例而言’ 4英吋、6英吋、8英吋、1 2英吋 或更大皆可）、電鑄翻製鎳模具、玻璃基板模具、或其他 經由各種微細加工之微模具等。 本發明之特徵及其優點摘要如下： 1 .根據本發明之微熱壓印成型方法，在製程上由於 使用流體或熱_射體直接加熱/冷卻待壓印物，可免除傳 鲁 統壓板式加熱冷卻冗長的升降溫時間，可達到快速加熱冷 卻、縮短製程時間、節省能源之功效。 2 .根據本發明之微熱壓印成型方法，使用經過升溫 的流體直接對待壓印標的進行微熱壓印成型，而不需要任 何其它致動器及/或施壓機構。由於流體分子之等向性、 等壓性壓力分佈特性，可達到完全均句壓力分佈之快速微 熱壓印成型。因此熱壓印面積不受限制，可進行極大面積 之熱壓印（例如4英吋、6英吋、8英吋、1 2英吋或以上 鲁 等皆可）。 3 ·相較於以往熱壓印習用技術，可快速達到完全均 勻壓力分佈之進步效果。因流體之等壓分佈特性，因此可 直接由諸如玻璃、矽晶圓等脆性材料製成的模具壓印，無 須再將其翻製成電鑄模具。可簡化製造步驟，快速完成熱 壓印，降低成本，並兼具環保性、淸潔性及節省能源。 4 .根據本發明之微熱壓印成型方法，可允許進行雙 面微結構熱壓印成型，製程彈性大。 -15- (13) (13)200427565 【圖式簡單說明】 在參考附圖之下述說明中，本發明的上述及其它目的 、優點、及特徵將更加淸楚呈現，其中， 圖1(a)至1(d)是示意圖，用以說明依據本發明之模製 微結構的快速加熱冷卻暨均勻施壓之微熱壓印成型方法的 操作之第一實施例。 圖2(a)至2(e)是示意圖，用以說明依據本發明之模製 微結構的快速加熱冷卻暨均勻施壓之微熱壓印成型方法的 操作之第二實施例。 圖3(a)至3(e)是示意圖，用以說明依據本發明之模製 微結構的快速加熱冷卻暨均勻施壓之微熱壓印成型方法的 操作之第三實施例。 圖4是示意圖，顯示設於模腔內之加溫/冷卻裝置， 用以執行根據本發明的實施例的冷卻及加熱步驟。 圖5是示意圖，顯示第五實施例輻射加熱器，作爲依 據本發明第五實施例之待壓印標的加熱之用。 圖6係顯示習知的微熱壓印實施例。 主要元件對照表 1 :待壓印標的 2 :模具 2a :上模具 2b :下模具 (14)200427565 4 :待壓印層 5 :基底 8 :密封膜 1 〇 :操作台 1 2 :密閉腔 1 4 :管路 1 6 :壓力控制閥Take out the finished product (as shown in Figure 3 (e)). I Embodiment 4 This embodiment is different from the above-mentioned embodiment in the temperature control of a high-pressure fluid such as a medium oil, etc., which is passed into the closed cavity. According to this embodiment, the high-pressure fluid that is passed into the closed cavity 12 is heated to a temperature before being passed through. When this heated high-pressure fluid is passed into the closed cavity, the high-temperature fluid is introduced as shown in FIG. 4. The catheter 100 is arranged in a closed cavity to make the high-pressure fluid warm enough to make the target to be embossed in a moldable state. This embodiment can be freely combined with Embodiments 1 to 4 to (11) (11) 200427565 to complete micro-hot embossing. Embodiment 5 In the above embodiments, hot embossing is performed using a high-temperature fluid. According to this embodiment, the difference from the above embodiment is mainly that an unheated high-pressure fluid is passed into the mold cavity, and then, a radiant heater 19 provided in the mold cavity 12 as shown in FIG. 5 is executed. Heating to bring the imprint to the glass transfer temperature, and then applying high pressure gas to perform hot imprint. For example, the radiant heater may be a heater such as a far-infrared heater, high frequency, ultraviolet light, halogen lamp, and the like. This embodiment can be freely combined with the above-mentioned Embodiments 1 to 5 to perform micro-hot embossing. Although the present invention has been described with the preferred embodiments, it is only for the purpose of illustration and is not intended to limit the present invention. Any person skilled in the art can make modifications to the above embodiments without departing from the spirit and scope of the present invention. For changes and modifications, the scope of the present invention shall be defined by the scope of the appended patents. For example, according to the present invention, the fluid used for fluid micro-hot stamping molding is steam, oil, gas air, or other inert gases (such as argon, nitrogen, etc.), or a mixture of these gases, as well as water and liquid. Gas and other cooling fluids. For example, in addition to the polymer monomers such as plastic molds, plastic plates, and photoresistors to be imprinted, metal foils such as aluminum foil, gold foil, and ceramic blanks can be used. In addition, the plastic plate referred to in this specification means a thickness of 0.2 mm or more, and the plastic film means a thickness of 0.2 mm or less. -14- (12) (12) 200427565 as an example and s' The micro-hot stamping mold (master) used in the present invention includes: micro-machined micro-machined Wu tool, sand wafer master produced by sand process Molds (for example, '4 inches, 6 inches, 8 inches, 12 inches or more are possible), electroformed nickel molds, glass substrate molds, or other micro-molds through various micro-processing, etc. . The features and advantages of the present invention are summarized as follows: 1. According to the micro-hot embossing method of the present invention, since a fluid or a thermal emitter is used to directly heat / cool the object to be embossed during the manufacturing process, the platen-type heating of the transmission system can be eliminated The long cooling and cooling time can achieve rapid heating and cooling, shorten the process time, and save energy. 2. According to the micro-hot embossing method of the present invention, a heated fluid is used to directly perform micro-hot embossing on a target to be embossed without any other actuator and / or pressure mechanism. Due to the isotropic and isobaric pressure distribution characteristics of the fluid molecules, rapid micro-hot embossing with complete uniform sentence pressure distribution can be achieved. Therefore, the hot stamping area is not limited, and hot stamping with a large area can be performed (for example, 4 inches, 6 inches, 8 inches, 12 inches or more). 3 · Compared with the conventional hot stamping technology, it can quickly achieve the progress of completely uniform pressure distribution. Due to the isobaric distribution of the fluid, molds made directly from brittle materials such as glass and silicon wafers can be stamped without having to turn them into electroformed molds. It can simplify manufacturing steps, quickly complete hot embossing, reduce costs, and have environmental protection, cleanliness and energy savings. 4. According to the micro-hot embossing method of the present invention, double-sided micro-structure hot embossing can be allowed, and the process flexibility is large. -15- (13) (13) 200427565 [Brief description of the drawings] In the following description with reference to the drawings, the above and other objects, advantages, and characteristics of the present invention will be more clearly presented. Among them, FIG. 1 (a ) To 1 (d) are schematic diagrams for explaining the first embodiment of the operation of the rapid heating and cooling of the molded microstructure and the micro-hot embossing method for uniform pressure application according to the present invention. Figs. 2 (a) to 2 (e) are schematic diagrams for explaining a second embodiment of the operation of the rapid heating and cooling of mold microstructures and the micro-hot stamping molding method for uniformly applying pressure according to the present invention. Figs. 3 (a) to 3 (e) are schematic views for explaining a third embodiment of the operation of the rapid heating and cooling of mold microstructures and the micro-hot stamping molding method for uniformly applying pressure according to the present invention. FIG. 4 is a schematic diagram showing a heating / cooling device provided in a mold cavity for performing cooling and heating steps according to an embodiment of the present invention. Fig. 5 is a schematic view showing a radiant heater of a fifth embodiment for heating a target to be imprinted according to a fifth embodiment of the present invention. Fig. 6 shows a conventional micro-embossing embodiment. Comparison table of main components 1: target 2 to be imprinted: mold 2a: upper mold 2b: lower mold (14) 200427565 4: layer to be imprinted 5: substrate 8: sealing film 1 〇: operating table 1 2: closed cavity 1 4 : Line 16: Pressure control valve
1 8 :高壓流體源 1 9 :輻射加熱器 1 00 :導管 1 0 1 :待壓印標的 102 :模具 1 0 3 a :上壓板 1 0 3 b :下壓板 1 〇 5 :加熱冷卻裝置18: high-pressure fluid source 19: radiant heater 1 00: duct 1 0 1: target to be imprinted 102: mold 1 0 3 a: upper platen 1 0 3 b: lower platen 1 0 5: heating and cooling device
1 〇 6 :加壓機構 1 〇 7 :機座 -17-1 06: Pressurizing mechanism 107: Base -17-