TW200427551A - Pad conditioner and the manufacturing thereof - Google Patents

Abstract

A pad conditioner includes a substrate, a holding layer and pluralities of diamond grains, wherein the material of the substrate comprising ceramic material, the holding layer is disposed on the substrate, and the material of the holding layer comprising ceramic material, and the diamond grains are distributed in the holding layer.

Description

200427551 V. Description of the invention (1) The invention belongs to the invention The present invention is a mechanical method. It is a research method. The previous technology has flattened the resolution of the semiconductor system and increased the level of the surface (Planari is not only its unique non-planarization, but also (Interconnects trench isolation production and surface display production, etc.) (Rotational P 1 mill Rotary flatten the wafer, and then grind (Slurry) the grinding line (P ο 1 ishi uses the grinding head to grasp the drive's loop type grinding. However, in the field, this kind of chemical mechanical polishing (C hemica 1 ishing, C Μ P) device and manufacturing method thereof, and special pad conditioner (Pad Conditioner) and manufacturing process thereof, as element size continues to decrease, lithography exposure increases, and along with reduction of exposure depth of field, requirements for wafer level It is more severe. Therefore, the current zati of wafers rely on the chemical mechanical polishing process to complete the isotropic grinding property. In addition to being used for the contour of the wafer surface, it can be applied to vertical and horizontal metal interconnects). In the production of mosaic structures, the production of advanced shallow components in the previous process, the flattening of micro-electromechanical systems, and the mechanical grinding process, It is often divided into a rotary platform ate η) grinder or a linear moving (Learear) grinding table grinding device. Most of them use a grinding head (Carrier) to grasp the front side of the wafer and press it on a layer with a mortar pad (Pad). The polishing table (Polishing Table) advances ng); In addition, the linear mobile grinder device is also a wafer, and then the front side of the wafer is pressed on the two-wheel grinding pad for polishing. After grinding for a period of time, the above two chemistry

Sui_Yinlai

s | iy88twf.ptd Page 4 200427551 V. Description of the invention (2) There will be residual particles (P artic 1 e) on the polishing pad of the mechanical polishing machine. Some of these particles come from the abrasive particles in the slurry, while others It may be from a thin film removed from the wafer by grinding. Therefore, in order to keep the polishing pad clean, a polishing pad conditioner must be used to remove the residual particles on the polishing pad, so as to increase the life and performance of the polishing pad. 1 to 2 are schematic diagrams showing a conventional method for manufacturing a polishing pad finisher. First, please refer to Fig. 1 to provide a bottom layer 102 made of stainless steel, and then spread diamond particles 104 on the bottom layer 102. The diamond particles 104 can be sized to have a similar size. Next, referring to FIG. 2, a brazing method is used to form a fixing layer 106 made of nickel metal or other alloy on the bottom layer 102 to fix the diamond particles 104 on the bottom layer 102 to form a polishing pad. Finisher. However, when the metal layer is polished, the p Η value of the slurry used is less than 7, so that when the polishing pad finisher is used for the brushing process, the strongly acidic slurry may corrode the polishing pad finisher. The fixed layer causes the diamond particles to easily fall off. Therefore, an external field (E X-situ) brushing method must be used, that is, a polishing pad finisher is used for brushing treatment before or after each batch of polishing process. However, because the external field brushing cannot remove the residual particles in the grinding process at any time, its removal efficiency is worse than the field brushing, and it will increase the complexity of the process. SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a polishing pad finisher and a method for manufacturing the polishing pad finisher, which can closely bond the bottom layer of the polishing pad finisher and the fixing layer, and make it difficult to peel off.

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wf. pt.d page 5 200427551 V. Description of the invention (3) Another object of the present invention is to provide a polishing pad finisher and a method for manufacturing the same, which can make the diamond tightly bond with the bottom layer and the fixed layer, and are not easy to detach. Another object of the present invention is to provide a polishing pad finisher and a method for manufacturing the same, which can make the polishing pad finisher suitable for both acidic and alkaline grinding environments and increase product life. The invention provides a polishing pad finisher, which is mainly composed of a bottom layer, a fixed layer, and a plurality of diamond particles. The material of the bottom layer includes a ceramic material, the fixed layer is disposed on the bottom layer, and the material of the fixed layer includes ceramics. Material, and diamond particles are set on one surface of the fixed layer. The invention provides a method for manufacturing a polishing pad finisher. This method forms a bottom layer, wherein the bottom layer is made of ceramic material, and then a plurality of diamond particles are arranged on one surface of the bottom layer, and then the diamond particles are arranged on the surface. A fixed layer is formed on the bottom surface to fix the diamond particles, and the material of the fixed layer includes a ceramic material. It can be known from the above that, since the bottom layer and the fixed layer of the polishing pad adjuster are both ceramic materials, the expansion coefficients of the two are similar. During the sintering and cooling process, no residual stress is generated, so that the bottom layer and the fixed layer are both It is not easy to peel and crack. In addition, since the ceramic material constituting the bottom layer is a porous material, when ceramic powder is infiltrated to form a fixed layer, the infiltrated ceramic powder can be penetrated into the pores on the surface of the bottom layer, and then the diamond can be made. The particles can be more tightly adhered to the fixed layer and the bottom layer, and are not easy to fall off. Moreover, since the bottom layer and the fixing layer of the polishing pad adjuster of the present invention are

, 4 i; -388t wf. Ptd page 6 200427551 V. Description of the invention (4) It is obtained by sintering ceramic powder, so the formed polishing pad adjuster has good properties of acid and inspection, and can be applied at the same time. It has an empirical and acidic polishing process and can prolong the service life of the polishing pad adjuster. In order to make the above and other objects, features, and advantages of the present invention more comprehensible, preferred embodiments are described below in detail with the accompanying drawings, as follows: Embodiments The present invention provides a grinding and finishing device (Pad Conditioner) and its manufacturing method. The polishing pad finisher manufactured according to this manufacturing method can be applied to various chemical mechanical polishing (Chemical Polishing) devices, such as Rotational Platen polishing. Machine or a linear grinding machine, however, the present invention can have different related variations, and all conforming to the spirit of the present invention are applicable to the scope of the present invention. Figures 3 to 5 are schematic diagrams showing the manufacturing process of the polishing pad finisher of the present invention. First, please refer to FIG. 3, and provide a bottom layer 202. The material of the bottom layer 202 is, for example, a ceramic material, and the bottom layer 2 composed of a ceramic material is preferably a porous material. The ceramic powder (not shown) to be sintered is sintered by a heat press to form a bottom layer 2 02. Next, referring to FIG. 4, the diamond particles 2 0 4 having an appropriate size are arranged on one side surface of the bottom layer 2 2 after screening, and the diamond particles 204 are distributed in a manner other than that shown in FIG. 4. Distributed on one side surface of the bottom layer 202, or in a ring shape on one side surface, or

: -B \ 388twf. Ptd page 7 200427551 V. Description of the invention (5) It is adopted other distribution methods. Next, referring to FIG. 5, a fixed layer 2 6 is formed on the bottom layer 2 to cover and fix the diamond particles 2 0 4, and each diamond particle 2 0 4 is partially exposed to the fixed layer 2 0 6 and beyond. The material of the fixing layer 206 is, for example, a ceramic material, and a method of forming the fixing layer 206 is, for example, forming ceramic powder on the bottom layer 202 by infiltration and covering and fixing the diamond particles 204. Please continue to refer to FIG. 5 to explain the polishing pad organizer of the present invention. The polishing pad organizer of the present invention is composed of a bottom layer 202, diamond particles 204, and a fixed layer 206. Among them, the bottom layer 2 0 2 is made of, for example, a ceramic material, and it is formed, for example, by hot pressing and sintering of a ceramic powder. The φ fixed layer 2 0 6 is disposed on one of the side surfaces of the bottom layer 202. The fixed layer 2 6 is made of, for example, a Taurman material, and the formation method is, for example, ceramic powder by infiltration. Formed on the bottom layer 2 02. Moreover, the diamond particles 204 are embedded on the surface of one side of the fixed layer 206, and the diamond particles 204 can be distributed on one side of the fixed layer 206 in addition to the uniform distribution shown. The side surface is distributed annularly, or other distribution methods are adopted. In the preferred embodiment of the present invention, the shape of the polishing pad organizer is circular, and the diamond distribution area thereon is uniformly arranged on the entire plane. However, the present invention is not limited to this, as long as it is a polishing pad finishing Both the bottom layer and the fixing layer of the device are made of ceramic material, regardless of the shape of the polishing pad organizer # and the diamond distribution area, which are included in the technical features of the present invention.

Kptl 388twf. Ptd Page 8 200427551 V. Description of the invention (6) From the polishing pad organizer and its manufacturing method, it can be known that the present invention has at least the following advantages: 1. The polishing pad adjuster obtained by the manufacturing method of the present invention 2 0 0, because the bottom layer 202 and the fixed layer 204 are both ceramic materials, the expansion coefficients of the two are similar. During the sintering and cooling process, no residual stress will be generated, so that the bottom layer 2 0 2 It is not easy to peel and crack both with the fixing layer 2 0 4. 2. The polishing pad adjuster 200 obtained by the manufacturing method of the present invention, since the ceramic material constituting the bottom layer 202 is a porous material, when the ceramic powder is infiltrated to form the fixed layer 206, The infiltrated ceramic powder can be penetrated into the pores on the surface of the bottom layer 202, so that the diamond particles 204 can be more tightly adhered to the fixed layer 206 and the bottom layer 202, and it is not easy to fall off. 3. The polishing pad adjuster 200 obtained by the manufacturing method of the present invention, since the bottom layer 202 and the fixed layer 206 are obtained by sintering ceramic powder, the formed polishing pad adjuster 200 has Good acid and alkali resistance, it can be used in both alkaline and acid polishing processes, and can extend the service life of the polishing pad adjuster 2000. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and retouches without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection shall be determined by the scope of the attached patent application.

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Claims (1)

200427551 The scope of the patent application is to grind a bottom layer, a fixed layer, including ceramic material: a plurality of diamonds 2. Grind to form a bottom layer on the bottom layer, and the fixed layer is configured, wherein the solid 3. If applying for a special method, The formation of 4. If you apply for a special method, in the formula of the fixed layer, the bottom is set in the pad finishing and the particles, pad finishing, one of the surface of the diamond fixed layer of the benefit range of the bottom layer The method includes: the material of the layer includes a ceramic material; and the bottom layer, wherein the material package of the fixed layer is embedded on one surface of the fixed layer. The manufacturing method of the device includes the following steps: the material of the bottom layer includes ceramic materials; a plurality of diamond particles are arranged on the bottom layer; and a solid material including ceramic materials is formed on the surface of the bottom layer of the particles. The method for manufacturing the polishing pad finisher according to item 2 includes a hot press sintering method. Manufacture of the polishing pad finisher described in item 2 The diamond particles are formed on the surface of the bottom layer by the infiltration method. rA, U88twf.ptd Page 11