TW200425430A - Flip chip package and method of forming - Google Patents

Abstract

A flip chip package is provided. The flip chip package disclosed in the invention includes a substrate, a die, a metal shell and a dielectric liquid. The substrate has an upper surface and a lower surface. The die has an active surface and a rear surface. The active surface of the die is attached to the upper surface of the substrate by bumps, and the die is electrically connected to the substrate. The metal shell has a cavity. The metal shell is adhered to the substrate and an opening of the cavity faces the upper surface of the substrate. The die is hold inside the cavity of the metal shell, and an opening of the cavity is sealed by the substrate. The dielectric liquid is filled in the cavity of the metal shell and in contact with part of the upper surface of the substrate, the rear surface of the die and the side surfaces of the die. The dielectric liquid circulates in the metal shell while the heat transfer phase change of the dielectric liquid happens.

Description

200425430 V. Description of the invention (l) [Technical field to which the invention belongs] The present invention relates to a hoe-shaped plant method, and in particular, to a private-type wrapper package) and its manufacturer rf 1. U relates to a medium The electro-hydraulic is a flip chip of the loose medium (flip chip), the package is made of +7, and the method of flip-chip type 7 is a method and its manufacturing method. [Previous technology] In the science and technology of the new moon electronics, Has become a relatively lightweight electronic product and developed a crystal-like package. In order to design a different generation, it is important to use modern and high-density semiconductors in the daily life of high-density semiconductors. Flip-chip package ring. An indispensable tool for the body circuit components. With the flow of the semiconductor packaging technology packaging, such as the good operation of the cover, its heat dissipation

凊 Refer to FIG. 1, which shows a cross-sectional view of a conventional flip-chip package. In FIG. 1, the flip-chip package i 〇 〇 includes a substrate i 〇 2, a wafer 〇 4, a heat sink 106, a support 112, and a plurality of solder balls 114. Among them, the substrate

The upper surface 02 has an upper surface of the substrate 102a and the lower surface 1021 of the substrate, and the wafer 104 has an opposite active surface of the wafer 104a and a back surface 104b of the wafer. The wafer 104 is bonded to the upper surface 102a 'of the substrate with the active surface 104a of the wafer and is electrically connected to the substrate 102. The solder balls 114 are arranged on the lower surface 102b of the substrate for the package 100 to be electrically connected to external circuits. In addition, the support 1 1 2 is a ring structure, which is fixed around the substrate upper surface 1 02a outside the side surface of the wafer: 04 to support the heat sink 106 so that the heat sink 106 and the back of the wafer i. 4b Thermally conductive connection. Of course, the heat sink 106 can be attached to the back of the chip 104b with an adhesive and

TW 325F (Sun and Moonlight) .ptd Page 6 200425430

V. Description of the invention (2) The upper surface of the support portion 112 and the upper surface of the surface. Heat dissipation The heat generated by the hearing is dissipated to the outside world and works well. The function of the sheet 106 is to maintain the wafer i 〇4 to maintain the need to cover the crystal package 100. When the idea of the county is good, the heat sink 106 and the wafer sheet are hot back sheet / 〇6 and the back of the wafer. The 10 = b gap generated by contact with the wafer does not cause a significant decrease of 4 外界 in the outside world; it is effectively dissipated through the heat sink 106 to operate its giant. ....... 'Affects [Fundamental Content of Chip-on-Package Package 1 0 0] In view of this, Ben Suming and its manufacturer *, i use is not in place; for a kind of chip-on-package The heat transfer phase changes to dissipate the Γ sheet: Πί, the number of dielectric fluids in the rails is strict :: The heat generated by the outside to the outside, and -Metal 7V in turn through the clothing path as the clothing, clothing The circulation flow of the heat transfer phase of the electro-hydraulic changes makes the flip-chip package of the present invention achieve a good heat dissipation effect and operating performance. According to the purpose of the present invention, a substrate, a wafer, a metal shell, an upper surface and a lower surface of a substrate, and a crystal and a back surface of a wafer are included. The chip has a crystal surface and is electrically connected to the substrate. The opening of the cavity faces the upper surface sheet of the substrate, and the substrate is an opening cavity card that seals the cavity, and a flip-chip package is formed with a part of the substrate, at least an electro-hydraulic package. The substrate has one opposite substrate. The wafer has one opposite active surface of the wafer. The active surface of the wafer is bonded to the substrate. The metal shell has a cavity. The metal shell is bonded to the substrate. The cavity is incorporated into the crystal port. The dielectric liquid is filled on the surface of the metal shell, the back of the wafer and the side of the wafer

200425430 V. Description of the invention (3) Contact, the dielectric fluid is in a metal shell. A method according to still another object of the present invention. First, a substrate surface and a substrate lower surface are provided. Next, the surface and a wafer on the back of the wafer are bonded to the upper surface of the substrate, so that the crystal is provided with a metal shell after the flip, with the metal facing up. Next, the substrate and wafer filled with a dielectric liquid and the gold package 'wafer after the flip are incorporated into the recess α. Then, the upper surface of the flip-chip substrate, the back surface of the wafer, and the metal shell are inverted for heat transfer phase change. According to another object of the present invention, the substrate, the wafer, the metal shell, the upper surface and the lower surface of the substrate The back of a wafer and a wafer. The wafer is on the surface of the wafer and is electrically connected to the substrate. The opening of the cavity faces the surface wafer on the substrate, and the substrate is a plate that seals the cavity, several side plates, and a hollow tube to form a cavity, and is bonded to the opposite side plates of the substrate, and separates the cavity and There are several upright channels, and the inclined upper part is the cyclic flow of heat transfer phase change. ‘Propose a flip-chip package manufacturing method’ The substrate has an opposite substrate on the surface. Provide a wafer with an opposite substrate active and electrically connect the wafer to the substrate with the active surface of the wafer. The & shell then has a cavity: the opening of the cavity is tied into the cavity. Then "fix the flip shell" to form an inverted flip-chip cavity, and the substrate is an open package that seals the cavity so that the dielectric liquid is in contact with part of the side of the wafer. The dielectric liquid flows in a ring. '' Propose a flip-chip closure, including electro-hydraulic. The substrate has the opposite-the Jisi film has the opposite one. The active surface of the wafer is flip-chip bonded to the substrate. The metal shell has a cavity, and the metal shell system is bonded to the substrate 'so that the cavity is incorporated into the opening. The metal shell includes a slanted roof. These side panels are connected to the slanted roof. The hollow tube system runs through these side plates as an inclined upper channel and an accommodation chamber. The channel system is located on the inclined top plate and the hollow tube.

200425430 V. Description of Invention (4). The accommodating chamber is located at 1 'on the upper surface of the hollow tube, these side plates, and the substrate, and is used to accommodate the wafer. These upright channels are located between the side plates of the part and the. Hollow tubes, and are used to communicate with the inclined upper channels and the accommodation chamber. Among them, the inclined upper passage, the accommodation chamber, and these upright passages form a circulation passage. Each electro-hydraulic system is filled in the cavity of the metal shell, and is in contact with a part of the surface on the substrate, the back of the wafer, and the side of the wafer. The dielectric fluid can circulate in this circulation path for heat transfer phase change. In order to make the above-mentioned objects, features, and advantages of the present invention more obvious, a preferred embodiment is given below, and in accordance with the accompanying drawings, the detailed description and explanation are as follows: [Embodiment] Please refer to the first embodiment FIG. 2 is a cross-sectional view of a flip chip package according to the first embodiment of the present invention. In FIG. 2, the flip-chip package 200 includes at least a substrate 202, a wafer 204, a plurality of solder balls 214, a metal shell 230, and a dielectric liquid 240. The substrate 202 has a substrate upper surface 202a, a substrate lower surface 202b, and a plurality of substrate side surfaces 202c. The substrate side surface 202c connects the substrate upper surface 202a and the substrate non-surface 202b. The wafer Y2 04 has the opposite active surface of the wafer 204a, the back surface of the wafer 204b, and several wafer side surfaces 204c. The wafer side 204c is connected to the wafer active surface 204a and the f-back surface 204b. Among them, the wafer 204 is bonded to the upper surface of the substrate 202a with the wafer active surface 204a and is electrically connected to the substrate 202. The solder ball 2:14 is arranged on the lower surface of the substrate (2021) for the chip-on-chip package 20 ()

200425430 V. Description of the invention (5) Electrical connection of the external circuit. The metal shell 2 3 0 has an inclined top plate 232, several side plates 2 34, and a hollow tube 236. These side plates 2 34 are connected to the inclined top plate 232 to form a cavity 238 ° the cavity 23 8 opening system and the inclined top plate 2 32 is opposite, and the hollow tube 236 (is the two opposite sides of these side plates 2 3 4, as shown in Figure 3. Among them, 'Figure 3 shows a perspective view of the metal shell of Figure 2, and the hollow The cross section of the tube 236 is, for example, square, and the through hole 237 of the hollow tube 236 can communicate with the outside world, so that outside air can circulate in the through hole 2 37. It should be noted that

It is “as long as the cross-sectional movement of the metal shell 23 0 in FIG. 3 is performed along the yz plane” and viewed from the opposite direction of X, the appearance of the metal shell 2 30 in FIG. 2 can be presented. In Figs. 2 and 3, the hollow tube 236 is a partitionable cavity 238, which is an inclined upper passage 242, an accommodation chamber 244, and a plurality of upright passages 246. Tilt up

The 4 channel 2 4 2 is located between the inclined roof 2 3 2 and the hollow tube 2 3 6. The accommodating chamber 44 is located between the hollow tube 236 and the opening of the cavity 2 38. The upright channel 246 is located in part. The side plate 2 34 and the hollow tube 2 3 6 are used to communicate with the inclined upper channel 242 and the accommodation chamber 244. Among them, the inclined upper passage 242, the accommodation chamber 244, and the upright passage 246 form a circulation passage. Since the area of the upper surface 202a of the substrate 202 is smaller than or equal to the opening size of the recesses 238 of the metal shell 230, 'these side plates 234 will correspondingly adhere to the side surfaces 202c of these substrates', so that the metal shell 230 is recessed. The opening of the cavity 238 faces the upper surface of the substrate: 〇2a and is adhered to the substrate 202. Therefore, the substrate 200 and the wafer 204 are included in the accommodating chamber 244, and the substrate 200 is sealed to the recess 2 38. The side plates 234 can be correspondingly protected by a waterproof adhesive. versus

TW] 25F (Yueguang) .ptd 07Q Page 10 200425430 Jade and invention description (6) = 2G2c bonding on the side of some substrates, and the waterproof adhesive is, for example, a waterproof tree. In 244, the dielectric fluid-system and part: the upper surface 202a, the back surface 204b, and the side surface 204c of the wafer are connected; the electro-hydraulic 240 is connected to the metal shell 2 30 to tilt the upper channel 242. , Rong Er 2: 2: ·, the circulation path formed by the upright channel 246 is used to change the phase of the heat transfer phase ~ moving. At this time, the liquid level of the dielectric liquid 240 is higher than the back surface of the wafer. Dielectric: The characteristic of liquid 240 is that it is non-conductive, which can avoid the phenomenon of short circuit. When the temperature of wafer 204 is higher than the temperature of dielectric liquid 240, some dielectric liquid 240 will absorb the generated by wafer 202. Heat and night vapor. Therefore, the heat generated by the wafer 202 can be taken away, and the temperature of the wafer 204 can be reduced. When the dielectric liquid vapor rises through the upright channel 246 into the inclined upper channel 242 and touches the inclined top plate 23 2 and the hollow tube 2 36, the temperature ratio of the air in the outside of the inclined top plate 2 32 and the through hole 2 37 The temperature of the dielectric fluid is still low, and some of the dielectric fluid vapor will release heat to the outside air and condense into a dielectric fluid. Due to the inclined relationship of the inclined upper channel 242, the condensed dielectric liquid will flow back to the containing chamber 244 along the inclined upper channel 142 and the upright channel 246 due to the relationship of gravity, completing the thermal phase change of the dielectric liquid 24. Cycle. Therefore, the dielectric fluid 24 can pass through the circulation path formed by the inclined upper channel B42, the valley chamber 244, and the upright channel 246 under the circulation of the heat transfer phase change of the dielectric liquid 240. The heat transfer effect is still lower than that of the conventional heat sink i 〇6, which makes the wafer 2 〇 4

025F (Yueyue) .ptd m

Page 11 200425430 V. Description of the invention (7) The heat generated will quickly pass through 5 祜 浼 捋 k fields ^ β fields; the heat transfer phase of the electro-hydraulic 240 is changed to the outside world, so that Flip-Chip Sealing ^ Damp effect to maintain high quality operation. 1 A good embodiment 2 h ΐ Ϊ According to FIG. 4, L shows a cross-sectional view of a frosted package of 75 according to the second embodiment of the present invention. In FIG. 4, the example of the cover-type sealing and sealing member 20 0 and the cover-type package 400 is different from the implementation and can be expressed as 仵 ζ υ ϋ. The frost 彳 f has a substrate of ㈣. The area of the upper surface 40 2a of the it board is larger than the recess 238 of the metal shell 2 30. When the odor board and the metal shell 230 are combined, the bottom end of the side board 234 is connected to ί odor board #, so that The metal shell 2 30 is adhered to the substrate 402 with the opening m 2a of the recess 238. Therefore, the opening of the wafer cavity 2 38 is up to 2: 4: the upper surface of the two substrates 402 "seals the recess β h # Μ. The bottom ends of these side plates 2 34 can be correspondingly backed by the 7η person" substrate. The surface 40 2a is adhered, and a water-resistant adhesive such as a water-resistant resin. >: Referring to FIG. 5 ', the drawing is a flow chart of a method for manufacturing a package in accordance with the first embodiment and the fifth embodiment of the present invention. Yan Qing refers to 2 to 4 pictures / first σ first 'at step 502. First, a substrate 202 or '02 is provided. Next, a wafer 204 is provided, and the wafer 204 is set on the substrate 202 or 402. The day-to-day chip m is bonded to the substrate 2G or 4C with the active surface 2 () 4 & flip chip of the wafer and is electrically connected to the substrate 2G2 or 402. 200425430 V. Description of the invention (8) Then, step 506 is provided to provide a metal case 230 after being turned over. The metal case 230 has a recess 238, and the opening of the recess 238 faces upward. The structure of the metal shell 230 is as shown in FIG. 2 and FIG. 3, and is not repeated here. Then, the method proceeds to step 508, and the dielectric liquid 240 is filled in the recess 238 of the metal case :: 30 after the inversion. Then, in step 510, the flipped substrate 202 and the wafer 204 and the flipped metal shell 230 are fixed, and an inverted flip-chip package 200 or 400 is formed. For example, the side surface of the substrate 20 2 c and the side plate 234 or the top surface of the substrate 402 c and the side plate 2 34 are adhered with a waterproof adhesive, so that the metal case 230 is adhered to the substrate 20 2 or 40 2. Among them, when the upper surface of the substrate: 0 2 a is less than or equal to the opening size of the notch 2 3 8 of the metal shell 2 3 0, the substrate 2 0 2 and the wafer 2 0 4 are included in the cavity 2 3 8. The substrate 2 0 2 seals the opening of the cavity 38. When the upper surface 40 2 a of the substrate is larger than the opening size of the notch 238 of the metal shell 230, the wafer 2 0 4 is included in the cavity 2 3 8. The surface 402c seals the opening of the recess 238. Next, in step 512, the inverted flip-chip package 2000 or 400 is inverted, so that the dielectric liquid 240 is on the back surface 204b of the wafer, the side surface 204c of the wafer, and the upper surface 2 of the substrate 2 〇2a or △: 0 2a. The inclined upper channel 242, the accommodating chamber 244, and the upright channel 246 form a circulation path, and the dielectric fluid 240 can perform a cyclic flow in which the heat transfer phase changes. However, those skilled in the art can also understand that the technology of the present invention is not limited to this. For example, the inclined top plate 232, a number of side plates 234, and the hollow tube 23 6 can be integrally formed. The material of the metal shell 230 is copper, Iron and other highly thermally conductive substances. In addition, based on the premise that the hollow tube 23 6 and the top plate 23 2 form the same Zou channel 242, the cross section of the hollow tube 236 may be any shape.

200425430 V. Description of the invention (9) J electro-hydraulic 240 is, for example, a low-dielectric constant liquid and a cooling liquid pc — 72, and the boiling point of the cooling night F C-7 2 is approximately 5 6 · 6 C. Of course, the present invention can also save the design of the hollow tube 246, and still allow the flip-chip packages 2000 and 400 to achieve the effect of heat dissipation. The flip-chip package and its manufacturing method disclosed in the above embodiments of the present invention ^ # ^ use the heat transfer phase change of the non-conductive and low dielectric constant dielectric fluid ^ generated heat to the outside 'and the metal shell The internal circulation path = is; 丨 The circulating flow of the heat transfer phase of the electro-hydraulic changes, so that the part can achieve a good heat dissipation effect and operating performance. & m 妙 νϋ: described 'Although the present invention has been disclosed as above with a preferred embodiment, to invent, anyone skilled in this art will not depart from this: Day = 2, when various changes and retouching can be made, Therefore, the scope of 'and compliance' shall be regarded as flat as defined by the scope of the attached patent application.

Face view. Flip-chip package 200425430 Simple illustration of the drawing [Simplified illustration of the drawing]

Fig. 1 shows a conventional flip-chip type seal I. Fig. 2 shows a cross-sectional view of the example of the cattle's cross-section, according to the meeting of the present invention. Figure 3 shows the three-dimensional u of the metal shell in Figure 2. Figure 4 shows the prudent y-graph according to the invention. ~ Beta case cross-sectional view. Figure 5 shows a flowchart of a method for manufacturing a crystal package according to the first embodiment of the present invention. Example Cover

Explanation of reference numerals 100, 2 0, 4 0 0: flip-chip package 102, 2 0 2, 4 0 2 · substrates 102a, 202a, 402a: upper surface of the substrate 102b, 2 0 2b, 40 2b: under the substrate Surfaces 104, 204: wafers 104a, 204a: wafer active surfaces 104b, 204b: wafer back surface 106: heat sink 11 2: support 11 4, 2 1 4: solder balls 2 0 2c: substrate Side 2 0 4c: Side of wafer

200425430 Brief description of drawings 230 Metal shell 232 Top plate 234 Side plate 236 Hollow tube 237 Through hole 238 Recess 240 Dielectric liquid 242 Inclined upper channel 244 Receiving room 246 Upright channel ❿ TW 025F (sunlight) .ptd page 16

Claims (1)

200425430 6. Scope of patent application 1 · A flip-chip package, at least comprising: a substrate having an upper surface of the opposite substrate and a wafer 'having an active surface of the opposite wafer The wafer is bonded with the active surface of the wafer To the substrate electrically connected to the substrate; a metal shell having a cavity, the metal shell is attached to the substrate facing the upper surface of the substrate, the cavity and the substrate seal the opening of the cavity; and The dielectric fluid is filled in the metal shell of the concave upper surface of the substrate, the back of the wafer and the wafer's electro-hydraulic system in the metal shell is a cycle of heat transfer phase change The flip-chip metal shell further includes: an inclined top plate; and a plurality of side plates, all of which are connected to the inclined top plate and are adhered to the substrate, so that the substrate seals the recess 3. If the scope of patent application is the second The metal shell described in the item further has a hollow tube. The hollow tube runs through two opposite plates to separate the cavity into an inclined chamber and a plurality of upright channels. The inclined upper channel Between the hollow tube and the hollow tube, the accommodating chamber is located between the middle and the upper surface of the substrate, and is used for accommodating the wafer between the side plates and the hollow tube, the upper channel and the receiving tube. A cavity, the inclined upper channel, a lower surface of the substrate; and a back surface of the wafer, and the upper surface of the substrate, are incorporated into the wafer cavity with the opening of the cavity, and are in contact with part of the side surface, and the medium flows. Type package, in which the side plates are openings of holes. Type seals, which pass through the upper channels in the side plates, a container located in the inclined headspace tube, the side plates, and the upright channels are used to communicate with the inclined, the accommodation room, the TW1025F (sun and moonlight) .Ptd 6. According to the scope of the patent application, the liquid level of Chengshi Yushi Electro-Hydraulic Electro-Hydraulic is higher than that, and μ, North π, >, f, where the liquid level of the dielectric fluid is higher than Among these crystals, among them, the flip-chip package described in item 1 of the patent application scope of the "Eight-seventh Electronics" is far away; I electro-hydraulic is a liquid with a low dielectric constant. 8 · Flip-chip package as described in item 丨 of the patent application range The dielectric fluid is coolant FC-72, and its boiling point is approximately 56.6 t. 9. The flip-chip package according to item 1 of the patent application scope. The flip-chip package further includes: a plurality of solder balls' arranged on the lower surface of the substrate. 10 · —A method for manufacturing a flip-chip package, including at least: providing a substrate having an upper surface and a lower surface of the opposite substrate; providing a substrate having an active surface and a back surface of the wafer opposite to each other; A wafer, and the wafer is bonded to the upper surface of the substrate with the active surface of the wafer flip-chip, so that the wafer is electrically connected to the substrate; a metal shell is provided after the flip, the metal shell has a cavity, and the cavity TWJ25F (Yueguang) .ptd Page 18 200425430 VI. Patent application: The opening of the cavity is fixed and flipped to fill a medium to form an inverted state. The substrate is turned upside down. The Shen shell further includes: a plurality of sides with an inclined top are adhered to the base plate 12 · If the Shen shell has a middle side plate for a plurality of upright hollow pipes, the sides between the upper surface of the board The channel and the accommodating chamber channel form a cycle of phase-change 13. As mentioned above; electro-hydraulic chip-type sealing of the substrate behind the recess to seal the chip-type recess of the cavity and the wafer back shell The middle is a patented plate for heat transfer; and the plates are all connected, so that the patented empty tube is divided, the middle divides the six recesses, the tilting of the accommodation room is used to contain the board and the hollow, the tilt On the ring road, this flow. Please patent the cavity; and the chip and the metal shell and the component after the flip, the wafer is included in the opening of the cavity; and the package, so that the dielectric liquid and the side of the part and the side of the wafer Contact 'a cyclic flow of this dielectric phase change. The method according to item 10, wherein the metal, the inclined substrate is the eleventh empty tube system, and an inclined upper part is connected to the dielectric liquid top plate of the channel between the receiving tube and the receiving tube to seal the recessed square. The inclined upper channels are located in the hollow tube and the sheet, which are used to connect and the accommodation system can be opened, and the method of opening the hole has its side plate in the middle of the channel ~ — The sloped sides can be connected directly to the The tilting chamber, the circulating side plates are the opposite accommodating chambers and top plates of the metal in D0, and the plates and the base channel are located at the oblique upper part through some upright passages for the heat transfer method described in item 12, Which of these sides TW1025F (Sun and Moonlight) .Ptd Page 19 200425430 The board is tightly adhered to the side of the substrate by a water-resistant chuck, and the wafer and the substrate are incorporated in the accommodating chamber. 14. The method described in item 12 of the scope of patent application, wherein the bottom ends of the side plates are tightly adhered to the upper surface of the substrate by a waterproof adhesive.口 "15. The method according to item 10 of the scope of patent application ', wherein the liquid level of the dielectric liquid is higher than the back surface of the wafer. 16. The method according to item 10 of the scope of patent application, wherein the dielectric liquid is a liquid having a low dielectric constant. 17. The method as described in item 10 of the scope of patent application, wherein the dielectric fluid is a cooling fluid F C _ 72, and its Buddha point is approximately 5 6 · 6 ° C. 18. The method as described in item 10 of the scope of patent application, wherein the flip-chip package further includes a plurality of solder balls arranged on the lower surface of the substrate. 19 · A flip-chip package including at least · A substrate having an opposite upper surface of the substrate and a lower surface of the substrate; a wafer having an opposite active surface of the wafer and a back surface of the wafer; the wafer is bonded to the upper surface of the substrate with the active surface of the wafer flip-chip bonded and electrically A metal shell 'has a cavity, the metal shell is adhered to the substrate with the opening of the cavity facing the upper surface of the substrate, the cavity is incorporated into the wafer, and the substrate is sealed The opening of the cavity, the metal shell further includes: an inclined top plate; a plurality of side plates are connected to the inclined top plate to form the cavity; TW 〇25F (日月光) .ptd Page 20 200425430 VI. Apply for a patent scope cavity and adhere to the substrate; and a hollow officer 'is a two-sided plate that runs through the side plates and separates the cavity into a cavity. Inclined upper channel, an accommodation room and a plurality of upright channels, the inclined upper channel is located between the inclined top plate and the hollow tube, and the accommodation room is located on the hollow tube, the side plates and the upper surface of the base plate The vertical channels are located between the side plates and the hollow tube, and are used to communicate the inclined upper channel and the accommodating chamber, the inclined upper channel, the accommodating chamber. , The upright channels form a circular path; and A dielectric liquid is filled in the cavity of the metal shell, and is in contact with a part of the upper surface of the substrate, the back of the wafer, and the side of the wafer. The dielectric liquid can conduct heat transfer through the broken path. Phase change cycle flow. 20 · The flip-chip package as described in item 19 of the scope of the patent application, wherein the side plates are tightly connected to the side of the substrate by a waterproof adhesive, and the chip and the substrate are included in This accommodation room. 21. The flip-chip package as described in item 19 of the scope of patent application, wherein the bottom ends of the side plates are tightly adhered to the substrate via a waterproof adhesive. ® _ 2 2 · According to the flip-chip package described in item 19 of the scope of patent application, the liquid level of the dielectric fluid is higher than the back of the wafer. 2, 3 · The flip-chip package as described in item 19 of the scope of the patent application, wherein the dielectric fluid is a wave body with a low dielectric constant. A 2 4 · The flip-chip package as described in item 20 of the scope of patent application, the dielectric fluid is a cooling fluid Fc_72, and its boiling point is approximately 56 · 6 t. , 200425430 TW: 025F (Sun Moonlight) .ptd Page 22