TW200420694A - Photo-curable thermosetting conductive composition, conductive circuit using the conductive composition, and forming method thereof - Google Patents

Photo-curable thermosetting conductive composition, conductive circuit using the conductive composition, and forming method thereof

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Publication number
TW200420694A
TW200420694A TW92108696A TW92108696A TW200420694A TW 200420694 A TW200420694 A TW 200420694A TW 92108696 A TW92108696 A TW 92108696A TW 92108696 A TW92108696 A TW 92108696A TW 200420694 A TW200420694 A TW 200420694A
Authority
TW
Taiwan
Prior art keywords
conductive
photo
composition
conductive composition
forming method
Prior art date
Application number
TW92108696A
Other languages
English (en)
Chinese (zh)
Other versions
TWI305222B (enExample
Inventor
Kazunobu Fukushima
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Priority to TW92108696A priority Critical patent/TW200420694A/zh
Publication of TW200420694A publication Critical patent/TW200420694A/zh
Application granted granted Critical
Publication of TWI305222B publication Critical patent/TWI305222B/zh

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  • Conductive Materials (AREA)
TW92108696A 2003-04-15 2003-04-15 Photo-curable thermosetting conductive composition, conductive circuit using the conductive composition, and forming method thereof TW200420694A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92108696A TW200420694A (en) 2003-04-15 2003-04-15 Photo-curable thermosetting conductive composition, conductive circuit using the conductive composition, and forming method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92108696A TW200420694A (en) 2003-04-15 2003-04-15 Photo-curable thermosetting conductive composition, conductive circuit using the conductive composition, and forming method thereof

Publications (2)

Publication Number Publication Date
TW200420694A true TW200420694A (en) 2004-10-16
TWI305222B TWI305222B (enExample) 2009-01-11

Family

ID=45071105

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92108696A TW200420694A (en) 2003-04-15 2003-04-15 Photo-curable thermosetting conductive composition, conductive circuit using the conductive composition, and forming method thereof

Country Status (1)

Country Link
TW (1) TW200420694A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI704417B (zh) * 2016-03-17 2020-09-11 日商東麗股份有限公司 感光性導電糊及附有導電圖案之基板的製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI704417B (zh) * 2016-03-17 2020-09-11 日商東麗股份有限公司 感光性導電糊及附有導電圖案之基板的製造方法

Also Published As

Publication number Publication date
TWI305222B (enExample) 2009-01-11

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