TW200420198A - Processing device - Google Patents

Processing device

Info

Publication number
TW200420198A
TW200420198A TW92107023A TW92107023A TW200420198A TW 200420198 A TW200420198 A TW 200420198A TW 92107023 A TW92107023 A TW 92107023A TW 92107023 A TW92107023 A TW 92107023A TW 200420198 A TW200420198 A TW 200420198A
Authority
TW
Taiwan
Prior art keywords
environmental gas
processing device
container
density
ultraviolet light
Prior art date
Application number
TW92107023A
Other languages
Chinese (zh)
Other versions
TWI243631B (en
Inventor
Toshio Goto
Masaru Hori
Nobuo Ishii
Original Assignee
Toshio Goto
Masaru Hori
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshio Goto, Masaru Hori, Tokyo Electron Ltd filed Critical Toshio Goto
Priority to TW92107023A priority Critical patent/TWI243631B/en
Publication of TW200420198A publication Critical patent/TW200420198A/en
Application granted granted Critical
Publication of TWI243631B publication Critical patent/TWI243631B/en

Links

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  • Plasma Technology (AREA)
  • Treatment Of Fiber Materials (AREA)

Abstract

The processing device of the present invention comprises: a container (1) containing the processed object (W); an ultraviolet light generation means (41) to output ultraviolet light (UV) toward the environmental gas (P) containing the chemical base in the container (1); a UV ray absorbing means (42) to absorb the UV ray passing the environmental gas (P); an analyzing control means (43, 44) to calculate the density of the chemical base in the environmental gas (P) according to the output signal of the UV ray absorbing means (42), so as to control the processing parameters. Accordingly, the density of the base can be kept constant, and the repeating property of the process can be enhanced.
TW92107023A 2003-03-26 2003-03-26 Processing device TWI243631B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92107023A TWI243631B (en) 2003-03-26 2003-03-26 Processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92107023A TWI243631B (en) 2003-03-26 2003-03-26 Processing device

Publications (2)

Publication Number Publication Date
TW200420198A true TW200420198A (en) 2004-10-01
TWI243631B TWI243631B (en) 2005-11-11

Family

ID=37025435

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92107023A TWI243631B (en) 2003-03-26 2003-03-26 Processing device

Country Status (1)

Country Link
TW (1) TWI243631B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI602226B (en) * 2016-08-30 2017-10-11 上海新昇半導體科技有限公司 Etching apparatus and method for dividing a semiconductor wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI602226B (en) * 2016-08-30 2017-10-11 上海新昇半導體科技有限公司 Etching apparatus and method for dividing a semiconductor wafer

Also Published As

Publication number Publication date
TWI243631B (en) 2005-11-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees