TW200412474A - Exposure device and its method for manufacturing color filters - Google Patents

Abstract

The present invention provides a photoresist coating and exposure method, which includes the steps of: first providing a substrate; then providing a photoresist coating device for coating plural strip photoresist regions on the substrate; next, providing an exposure device including a light source to generate light for exposure and a mask having a predetermined pattern and disposed between light source and the substrate; and performing an exposure procedure on the plural strip photoresist regions. The predetermined pattern on the mask is transferred to be a strip exposure pattern on the substrate by a relative movement between the substrate and the mask.

Description

200412474 V. Description of the invention α)-[Technical field to which the invention belongs] The present invention relates to an exposure device and a photoresist coating and exposure method, and more particularly to a color filter used in the manufacture of a liquid crystal display panel. Mirror (color filter) exposure device and method. [Previous technology] Thin-film transistor flat-panel displays, especially thin-film transistor liquid crystal displays (hereinafter referred to as TFT-LCD), are mainly driven by thin-film transistors arranged in a matrix, with appropriate capacitors, transfer pads and other electronic components to drive LCD pixels to produce rich and bright graphics. TFT-LCD is widely used in portable information products such as notebooks and personal digital assistants (PDAs) due to its thin and light appearance, low power consumption, and no radiation pollution. The trend to replace traditional desktop computer CRT monitors. A conventional TFT-LCD basically includes a lower substrate having a plurality of thin film transistors arranged in an array, pixel electrodes (pi xe 1 electrodes), scan lines or scan lines that are orthogonal to each other (scan or gate lines), and A signal line (data or signal line), an upper substrate with a color filter (color fi 1 ter), and a liquid crystal material filled between the lower substrate and the upper substrate, wherein the upper substrate and the lower substrate may be transparent Glass base board. Among the materials used in TFT-LCDs, the cost of color filters is about one-third. Generally, color filters are manufactured by coating a negative photoresist material on the lower substrate and then passing The exposure and development process is formed. Because the size of the photomask currently used is too large, it must be expensive

200412474 V. Description of the invention (2) The cost of the pen is to make a photomask. At present, the competition of TFT-LCD manufacturers in the market is trying their best to reduce the production cost and lower the selling price to attract flat users. Therefore, how to reduce the size of the mask has become one of the ways to reduce costs. Please refer to FIG. 1 and FIG. 2. [FIG. 2 and FIG. 2 are schematic diagrams of an exposure device for a conventional panel. Generally speaking, the first picture is a conventional exposure device for a color filter in a liquid crystal display panel, and the second is known as the exposure device for a thin-film transistor substrate in a liquid crystal display panel. The exposure device 10 includes a fixed light source 2, a photomask 14 located below the light source 12, and a substrate 16 located below the photomask 14. The light: 14 is equivalent to the size of the substrate 16. The substrate 16 can be-glass: reverse, without black matrix (BM) (not shown) using η Γ to improve LCD contrast and prevent TFT elements from generating light leakage current. Oblique light leakage. In addition, a resist layer is coated on the substrate 16 to cover the black stripes. The negative resist layer is used for the R / G / B color layer on the color filter.… Then an exposure process is performed. To transfer the negative photoresist layer on the predetermined image on the photomask 14. Then carry out a development process, ff = negative photoresist layer. Repeat the aforementioned exposure and development process number-person, on the shirt color filter The R / G / B color layer can be formed on the substrate 16. The light; 2 is to simultaneously fix the photomask 14 and the substrate 16 at the same time, so that the source 12 is longer & Then, the predetermined pattern on the photomask 14 is completely transferred to the negative photoresistance sound on the substrate 16: The exposure procedure is based on -proximity exposure technology, which is:

Page 6 200412474 V. Description of the invention (3) The distance g between the cover 14 and the substrate 16 is about 100 to 200 microns (// m) in winter. The size of the photomask 14 is approximately the same as the size of the substrate 16. As shown in FIG. 2, an exposure device 20 includes a stationary light source 22, a photomask 24 under the light source 22, and a substrate 26 under the photomask 24. The size of the photomask 24 is about four times that of the substrate 26. One, and an optical system 2 8 is disposed between the mask 24 and the substrate 26 to transmit the light passing through the mask 24 to the substrate 26. As described above, the substrate 26 is a glass substrate, and a negative photoresist layer or a positive photoresist layer may be coated thereon as required. The substrate 26 includes a glass substrate with four liquid crystal display panels. First, an exposure process is performed. After the photomask 24 is aligned with the area 26a on the substrate 26, the photomask 24 and the substrate 26 are simultaneously moved at the same speed, so that the predetermined pattern on the photomask 24 is transferred to the substrate 26. Area 26a. After the exposure process of the area 26a is completed, the substrate 26 is moved to align the photomask 24 with the area 26b on the substrate 26, and the aforementioned exposure process is repeated. After sequentially exposing each area on the substrate 26, a development process is performed to remove the negative photoresist layer that is not illuminated by the light source. Among them, the size of the photomask 24 is approximately equal to the size of one area 26a, so taking the second figure as an example, the size of the photomask 24 is approximately 1/4 of the substrate 26. Since the resolution requirement of the predetermined pattern transfer is not as high as in the semiconductor process in the process of manufacturing a TFT-LCD, the two aforementioned driving techniques may be widely used in the production of color substrates 16 and substrates. The size of 26 is about 62〇mm χ 2: Production cost

Light = very expensive ... If it can effectively = the size of the cover, it will definitely reduce the TFT-LCD

200412474

In addition, the substrate is covered with a negative photoresist layer or a positive spin-gut coating (spin CGuting) to advance: Put two, and set the wide rotation:… the axis below the turntable can bring === and the axis Provide an appropriate degree of vacuum to attract the substrate, and J board die: Sprinkle, use the substrate to rotate the centrifugal ☆, and move to the substrate: move around, and form a photoresist layer with uniform thickness after removal. However, it is more and more necessary to rotate the substrate in two inches ... Therefore, the traditional ^ -type coating has been unable to make the thickness of the photoresist layer completely uniform. [Summary of the invention] In view of this, the object of the present invention is to provide an exposure device and a photoresist coating and exposure method, which can not only reduce the size of the photomask, but also make the liquid crystal display panel made easy to divide. This reduces production costs. According to the purpose of the present invention, a photoresist coating and exposure method is provided, which includes the following steps. First, a substrate is provided. After that, a resist coating device is provided to coat a plurality of strip-shaped photoresist regions on the substrate. Next, a light source is provided for generating an exposure light. After that, a photomask having a predetermined pattern is provided and placed between the light source and the substrate. Then, an exposure process is performed on the plurality of strip-shaped photoresistive regions, so that a predetermined pattern on the mask is transferred to a strip-shaped exposure pattern on the substrate by the relative movement of the substrate and the mask. Another object of the present invention is to provide a photoresist coating device for uniformly coating a photoresist liquid on a substrate. The coating device includes a photoresist applicator, a photoresist supplier, and a base. Photoresist applicator

200412474

A plurality of grid-like openings are used to supply the photoresist, and the base is used to generate a relative movement on the photoresist applicator to apply a plurality of strip-shaped photoresist zones to supply photoresist to Photoresist coated this substrate. Among them, the substrate can be used to make the photoresist coater on the substrate. According to still another object of the present invention, an exposure device is proposed for exposing a photoresist layer on a substrate. The exposure device includes a light source, a photomask, and a base. The light source is used to generate an exposure line. The photomask is placed between the light source and the substrate, and has a predetermined pattern. The base is used to carry the substrate. Among them, when the exposure process is performed on the photoresist, the predetermined pattern on the photomask is transferred to a stripe exposure pattern on the substrate by moving the substrate relative to one of the photomasks. The invention is to reduce the size of the photomask to a size equivalent to that on the photomask, and simultaneously fix the photomask and the light source, and move the base of the carrier plate to transfer the pattern on the photomask to the substrate. Therefore, the size of the & small mask can be achieved, thereby reducing the production cost. In addition, the present invention / another invention provides an air-floating system for stably carrying a substrate. The air-floating system can be applied to a base of an exposure device and a photoresist coating device, respectively. [Embodiment] The present invention is to provide an exposure device, which can make a predetermined pattern on the photomask be transformed into a stripe exposure pattern by relatively moving the substrate and light. In this way, the size of the mask can be reduced. The moxibustion is only about one tenth of the substrate. In addition, this exposure 7 /,] hip hip dressing

200412474 V. Description of the invention (6) 7 The Western-style system stably drives the substrate, causing the substrate to move relative to the photomask. Furthermore, the present invention may preferably further include a photoresist applicator for uniformly coating a plurality of strip-shaped photoresist regions on the substrate, so that the present invention can also simplify the process of manufacturing a liquid crystal display panel. Please refer to FIG. 3, which illustrates a schematic diagram of an exposure apparatus according to a preferred embodiment of the present invention. The exposure device 30 is used to expose a photoresist layer on a substrate 36. The exposure device 30 includes a light source 31, a photomask 32, and a base 35. The light source 31 is used for generating an exposure light. The photomask 32 is disposed between the light source 31 and the substrate 36 and has a predetermined pattern. The base 35 is used to carry the substrate 36. An arc-shaped light receiving area 33 is formed on the photomask 32. Among them, the reticle 32 has a plurality of regularly arranged openings (s 1 丨 7) 32a. When the photoresist layer is subjected to an exposure process, a predetermined pattern on the photomask 32 is transferred to a stripe-shaped exposure pattern on the substrate 36 by relative movement of one of the substrate 36 and the photomask 32. The base 35 further includes an air-fUat system 38 (shown in FIGS. 7A and 7B) and a transmission 37 (shown in FIG. 4a). Please refer to Fig. 4A, which shows the sound diagram of the air-floating system in Fig. 3. As shown in FIG. 4A, the base 35 further has a fixing portion 34a coupled to the transmission portion, and the fixing portion 34a is used to drive the substrate 36. The transmission portion "is used to drive the substrate 36 through the fixing portion 34a. The air-floating system 38 is used to carry the substrate 3 6 'to suspend the substrate 36 above the base 35 and maintain a certain distance, and the transmission portion 37 is connected to the air-floating system 38 to carry and drive A certain plate 36 allows the substrate 36 to move back and forth stably above the base 35. In addition, a light ancestor applicator 34b may be set above the base 35. About the base 35

200412474

The air-floating system 38 connected to the lower transmission section 37 will be described in conjunction with FIGS. 7A and 7B. Dry sound: Same as: 5th photo, which is the enlarged view of the photoresist coater in the figure. First, the coater 341) is connected to a line 34g, and 34c sends the photoresist liquid 34d to the photoresist. The applicator ⑽, and then the photoresist liquid is evenly applied to the substrate ⑽ and the substrate 36 through the second force opening of the pump port (lip) 34e. Uniform openings can form a photoresist layer 34f with a uniform thickness on the substrate 36. In addition, a light forming optical system may be included between the light source 31 and the photomask 32 in FIG. 3 (Not shown), which is used to convert the light emitted from the light source 31 into an arc beam beani 33a, and then project it onto the photomask 32 to form a light receiving area 33. In another embodiment of the present invention, the plastic The light optical system (not shown) can also convert the light projected by the light source 31 into a rectangular beam (recta called Μ π beam). When the exposure process is performed, the light source 31 and the mask 32 are fixed, and the base 35 is used. The transmission part 37 on the moving substrate 37 is moved to gradually move the The pattern is transferred onto the substrate 36 to form a stripe-shaped exposure pattern. The detailed exposure procedure will be described below. Please refer to FIG. 5, which illustrates a simplified enlarged schematic diagram of the exposure device of FIG. 3. As shown in FIG. 5 'a substrate 36 in the exposure device includes four glass substrates 36a, 36b, 36c, and 36d with four liquid crystal display panels provided with black stripes (not shown)' and coated with a negative photoresist Floor. First, an exposure process is performed. First, the substrate 36 is moved by using the base 35 so that

200412474 V. Description of the invention (8) The area 36a is moved to this position and the wide QC; first, the appropriate positions under the cover 32 and the fork light area 33. The receiver's base is 3 billion and 7 billion yuan. The user's side * 2. The substrate 36 is moved along the arrow Hachisuo at a predetermined speed, so that the predetermined pattern on the photomask 32 is gradually transferred to the area. The direction indicated by the eight is moved so that the pre-patterned pattern on the photomask 32 continues to be gradually transferred to the negative photoresist layer on the region 36b. After completing the exposure procedures for = a, 36a and area 36b, the substrate 36 is then moved so that the area 36c on the substrate 36 is moved to a suitable position below the mask 32 and the light receiving area 33. Then, the substrate 36 is moved in the direction indicated by the arrow a so that the predetermined pattern on the photomask 32 is gradually transferred to the negative photoresist layer on the regions 36c and 36d. The arc-shaped light receiving area 3 3 is perpendicular to the left and right ends of the substrate 36 in the moving direction = the pitch is approximately the same as the length of the photomask 32. The arc-shaped light-receiving area is parallel to the movement direction of the substrate 36 before and after the two ends are approximately the same as the width of the photomask 32. Similarly, when a rectangular light-receiving area is used, the rectangular light-receiving area = the field is perpendicular to the substrate 3 6 The distance between the left and right ends of the moving direction is approximately the same as the length of the mask 32. The rectangular light receiving area is parallel to the width of the front and back ends of the substrate 36 and the width of the mask 32 is approximately the same. The exposure order of the regions 36a, 36b, 36c, and 36d can be reversed. The main feature is that the light source 31 and the mask 32 are fixed, and the substrate 36 is moved by the base 35 to complete the exposure procedure. The lengths are W and L, the width, length, and opening width of the light receiving area ^ are W ', [/, and t, respectively, and the visibility and length of any of the glass substrates 36a, 36b, 36c, and 36d are W and L, respectively. In the preferred embodiment of the present invention

TW0991PA (Chimei) .ptd ϋ Page-200412474 In the description of the invention (9), W is slightly smaller than w, L, slightly smaller than L, and t is approximately equal to the width of the strip-shaped color filter, and W is approximately W ', 1/3 to 1/4, L is approximately equal to L, that is, the size of the photomask 32 is only about one-tenth of the substrate 36—about, which is much smaller than that required in the conventional technology. Next, a developing process is performed to remove the negative photoresist layer on the substrate 36 which is not irradiated with light. By repeating the application of the negative photoresist layer, the exposure and the process several times, the iR / G / B color layer of the color filter can be fabricated on the glass substrates 36a, 36b, 36c, and 36d. Among them, as shown in FIG. 5, the peripheral area 36 e on the substrate 36 is used to separate the liquid crystal display panels 36 a, 36 b, and 36 d. Therefore, it is an area that is not expected to receive light. The layers were washed away. In order to divide the LCD panel 36a, Mb, 36c and 36d smoothly, the following methods can be used: (1) During the exposure process, a dynamic mask (Dynamic mask b 1 ade) is used in the day of Shida. The guard point is inserted above the substrate to block light, so that the negative photoresist layer on the peripheral region 36e is not exposed to light. (2) During the exposure process, a shieid frame is added, such as a frame-shaped photomask between the photomask 32 and the substrate 36, so that the negative photoresist layer on the peripheral area 36e will not be illuminated by light. . (3) The non-rotary coating is used to cover the substrate with the negative photoresistive layer spaced to form a plurality of stripe photoresistive areas, and then exposure is performed. (4) Use an active mask, such as a liquid crystal type mask, and use voltage to let the liquid crystal > sub-shaft to hold the light. "Ge is to let light pass. (5) RGB uses a positive type resist (positive type resist ), And expose the surrounding area 36e separately.

Page 13 200412474 V. Description of the invention (ίο) In the above method, the third method is the most simple, but simple, time-saving, and best segmentation effect. The following is a description of the method of increasing profits without blocking layers. The present invention uses a photoresist coating device to accomplish the above-mentioned first mode. The photoresist coating device is used to uniformly coat the substrate 76 (resistance: it includes a photoresist coater 71, a photoresist supplier, and a base 35. The photoresist coating Is 7 1 series has a plurality of Grid-like opening. As shown in Figure 4A, the photoresist supply can be composed of pipelines and pressure pumps to supply photoresist liquid to the photoresist applicator 71. The base 35 is as described above. To carry the substrate ". Among them, the substrate 76 and the photoresist coater 71 can move relative to each other to make the photoresist liquid form a plurality of strip-shaped photoresist areas on the substrate 76. The present invention uses photoresist The method of forming a photoresist layer using a coating device is summarized as follows. First, as shown in FIG. 6A, a photoresist coating is performed on the substrate 76 along the γ direction using a photoresist applicator 7 丨, wherein The resist coater 7 丨 has three grid-like openings, and the grid-like openings are separated by a gap, so three strip-shaped photoresist areas 72a, 72b, and 72c are coated. Then, as shown in FIG. 6B, The substrate 76 is subjected to stripe exposure along the X direction. The direction of movement of the substrate during the exposure and the application method of the photoresist applicator 7i are performed. It is vertical, and the exposure area and exposure direction are shown by arrows El, E2, E3. Since the part of the negative photoresist light will be left after development, and there is a gap between the stripe negative photoresist, the exposure and development After that, areas 78a, 78b, 78c, 78d, 78e, 78f, 78g, 78h, 78i will be generated, and each area corresponds to a liquid crystal display panel. In other words, 'the substrate 76 will

TW0991PA (Chimei) .ptd Page 14 200412474 V. Description of the invention (11). Naturally form the photoresist distribution area of 9 LCD panels without the need for other expensive methods (such as (1), (2) , (4), (5), etc.) to block the peripheral areas on the substrate 76 that do not want to receive light, and the effect of smooth separation of the liquid crystal panel can be achieved. Wherein, 'when exposing these three strip-shaped photoresistive regions on the substrate 76', assuming that the order of exposure is the regions 78a, 78 (i, 78g, 78b, 78e, 78h 'and 78c, 78f, 78i, the present invention The exposure procedure is as follows. First, step (a) is performed, and the substrate 76 is moved so that the photomask 32 is positioned above the area 78a. Next, step (b) is performed, and the substrate 76 is moved in the X direction so that the photomask 32 and the substrate are moved. 76 generates relative movement to complete the exposure action of the photoresist of the area 78a 'makes a predetermined pattern formed by a plurality of regularly arranged openings on the photomask 32' into a stripe exposure pattern in the area 7 (that is, color

Color, light stripe pattern). Then, in step (c), the substrate 76 is further shifted X in the direction 'so that the photomask 32 is positioned above the area 78d. Next, step (d) is performed to move the substrate 76 along the X direction to cause the photomask 32 and the substrate 76 to move relative to complete the exposure operation of the photoresist in the area 78 (1 to form a stripe exposure pattern in the area 78d. Then, step (e) is performed to translate the substrate 76 in the X direction so that the photomask 32 is positioned above the area 78g 'and continue to cause the photomask 32 and the base > anti-76 to move relative to each other to form area 7 The stripe exposure pattern in 8g. Through the first stripe exposure process composed of steps (a) to (e), the exposure operations of the areas 78a, 78d, and 78g will be completed. Similarly, 'the light will then be The cover 32 is placed above the area 78b, and a second stripe exposure process is performed to complete the areas 78b, 78e, and 78h.

Page 15 200412474

Exposure action. Thereafter, the photomask 32 is placed over the area 78c, and a second stripe exposure process is performed to complete the area 78. , 7 8 f, and '7 8 i. There is a non-exposed area between the two rows of areas (light can be blocked by the non-opening area of the mask so that light cannot penetrate into this non-exposed area) 'to isolate two areas adjacent to each other along the γ direction. Among them, the extension direction of the three stripe photoresistive regions is the Y direction, and the extension direction of the stripe exposure pattern is along the X direction, and the two are perpendicular to each other. Also, ‘the base of the present invention? The air-floating system 3 on 5 can be divided into PA-type base and PV-type base according to the air-floating principle. Fig. 7A is a schematic view of a PA-type base. In the PA-type base 35, the gas flows out from the injection holes as shown by arrows al, a2, a3, a4, and a5, and then is released from adjacent holes to the atmospheric pressure (reUase tοatmosphere) such as arrows bl, b2, b3, b4, b5. Figure 7B is a schematic diagram of a PV-type base. In the pv-type base 35, the gas is ejected from the nozzle holes as shown by arrows fuCl, c2, c3, c4, and c5, and then the gas is extracted from the adjacent holes by a vacuum method (arrows dl, d2, d3, d4, d5. It can be known from the above that the main difference between PA-type base and pv-type base is: ¥ type base is used to extract gas. Therefore, the substrate 36 placed above the pv-type base is subjected to a stronger suction force and is closer to the base 35. Generally speaking, the distance between the substrate 36 and the base 35 in the PA-type base is about 50 to 200 // m, and in the PV-type base, the distance between the substrate 36 and the base 35 is about 30 to 100. In cross-applications, the 'air-floating system' can combine PA-type and pv-type bases. Please refer to FIG. 7C, which illustrates a schematic diagram of an air-floating system according to a preferred embodiment of the present invention. As shown in Fig. 7C, the base 35 is composed of P A-P V-PA. When the substrate 36 moves from left to right, it passes through the pV region

TW0991PA (Chimei) .ptd Page 16 200412474 V. Description of the invention (13) At 4th time, it can move more stably because of a downward suction force. Therefore, it is possible to perform important production procedures for the substrate 36 in the pv-type area. The photoresist applicator 3 4 b performs photoresist coating of the substrate 36. In addition, in addition to the photoresist coater, the base 35 can also be equipped with an ultraviolet light device to irradiate the substrate with ultraviolet light, or a detection device to check the distance between the substrate 36 and the base 35 Whether to maintain a certain value. Compared with the light receiving and movement, the stripe exposure mask size is made by color filter steadily. In summary, it is not the essence of the invention. The invention is narrowed down to the mask in the conventional area to make the light pattern. The number of substrates carried by the multiple times optical mirror is more described, in order to limit the scope of God and Fan guard technology, the size of the mask is known, so the use of light, rather than simple, although within the scope of the present invention, The 'and pre-Λ map's use' has been replaced with a cover that is a rotary type and the panel has been invented. Anything that can be attached is to make the light gradually make the present mask. In addition, the photoresistance separation effect is better to familiarize yourself with the various patented substrates and ground translators. This will be used in the future. You can use the applicator to change the embodiment. Ground air floatation can make the liquid good. According to the disclosure, in the case of non-retouching, one of the definitions used in the lowering system can be crystallized on the panel, but it will deviate from the original and therefore the original shall prevail.

200412474 Brief description of the drawings' [Simplified description of the drawings] w Figures 1 and 2 are schematic views of a conventional exposure system for making a liquid crystal display panel; Figure 3 is a schematic view of an exposure device according to a preferred embodiment of the present invention; Figure 4A shows the schematic diagram of the air-floating system in Figure 3; Figure 4B shows the enlarged schematic diagram of the photoresist coater in Figure 4A; Figure 5 shows the simplified schematic diagram of the exposure device in Figure 3; Figures 6A and 6B are schematic diagrams of making n-type liquid crystal display panels by a non-rotation coating method according to a preferred embodiment of the present invention. Figure 7A is a schematic diagram of a PA-type base; Figure 7B is a schematic diagram of a PV-type base; and Figure 7C is a schematic diagram of an air-floating system according to a preferred embodiment of the present invention. Description of reference numerals 10, 20, 30: Exposure devices 12, 2 2, 31: Light source 1 4, 2 4, 3 2: Mask 16, 2 6: Substrates 26a, 26b, 26c, 26d: Area 2 8: Optical System 3 2a · Opening 3 3: Light receiving area

TW0991PA (Chimei) .ptd Page 18 200412474 Brief description of the diagram 33a Arc beam 34a Fixing part 34b Photoresist applicator 34c Pressure pump 34d Photoresist liquid 34e Open π 34f Photoresist layer 34g Pipes 72a, 72b, 72c: light Resistance area 35: Base 3 6, 7 6 • Substrates 36a, 36b, 36c, and 36d: Area 3 6e: Peripheral area 37: Transmission section 3 8 Air-floating systems 78a, 78b, 78c, 78d, 78e, 78f, 78g, 78h, 78i: Zone

TW0991PA (Chi Mei) .ptd Page 19

Claims (1)

200412474 VI. Application Patent Scope 1. A method of photoresist coating and exposure, including the following steps: providing a substrate; providing a photoresist coater for coating a plurality of strip-shaped non-resistance areas on the substrate, providing A light source for generating an exposure light; providing a mask having a predetermined pattern to be placed between the light source and the substrate; and performing an exposure procedure on the plurality of strip-shaped photoresistive regions through the substrate Relative to one of the photomasks, a predetermined pattern on the photomask is transferred to a stripe-shaped exposure pattern on the substrate. 2. The method according to item 1 of the patent application, wherein the plurality of strip-shaped photoresist regions and the strip-shaped exposure pattern are perpendicular to each other. 3. The method of claim 1 in which the substrate is carried by a base, and the base includes: an air-floating system for carrying the substrate so that the substrate is suspended above the base. A distance; and a transmission part connected to the air-floating system for driving the substrate. 4. The method according to item 1 of the patent application scope, wherein the predetermined pattern has a plurality of regularly arranged openings. 5. The method according to item 1 of the patent application range, wherein the light source forms an arc-shaped light receiving area on the photomask, and the distance between the left and right ends of the light receiving area perpendicular to the substrate moving direction is related to the photomask. The length is approximately the same. 6. The method according to item 1 of the patent application scope, wherein the light source will form TW0991PA (Chimei) .ptd Page 20 200412474 6. Scope of patent application ^ --- Where the light receiving area is parallel to the moving direction of the substrate, the distance between the two sides is about the same as the width of the mask. 7 · A method for applying a rectangular light-receiving area between the left and right ends of the substrate on the reticle in the direction of the patent application is the same as 0, wherein the light source will form 'where the light-receiving area is perpendicular to the distance and the distance The length of the photomask is roughly the same as the method of item 1 in the patent application 'where the light source will form a rectangular light receiving area on the photomask' where the light receiving area is parallel to the direction of movement of the substrate It is approximately the same width as the mask. 1 9 · The method according to item 1 of the scope of patent application 'wherein the photoresist applicator has a plurality of grid-shaped openings, and the grid-shaped openings are separated by a gap 0 10. In the method, the photoresist coater applies the plurality of stripe photoresist regions on the substrate in a first direction, and the first direction is perpendicular to a moving direction of the substrate during the exposure process. 11. If the method of patent No. 2 is applied, the air-floating system further includes a detection device to check whether the distance between the substrate and the base is maintained at a certain value. 19 ^ From jealousy, used to uniformly apply light on a substrate 1 2 · —A photoresist coating device I liquid barrier, the coating device includes: μ 收 叫 η · ϋ several tree-like openings' a Photoresist applicator with Fu Huan 200412474 VI. Applicable patent scope Applicator for supplying the photoresist liquid to the photoresist applicator; used to carry the substrate; the substrate can move relative to the photoresist applicator to form a plurality on the substrate Strip-shaped photoresistive area. Please refer to the coating device of item 12 wherein the plurality of grids are separated by a first gap. Please apply the coating device in the range of item 13, wherein the plurality of bars have a second gap, and the size of the second gap is equivalent. An exposure device for exposing a photoresist layer on a substrate, the exposure device includes: ... for generating an exposure light; placed between the light source and the substrate, and having a predetermined photoresist And the base, wherein the photoresist liquid is homogeneous between the 13. Rushin-like openings 14. the Rushin-like photoresistance zone and the first gap 15 · — a light source, a photomask, a case; And a base, wherein when one of the photomasks forms on the substrate 16. The application system includes: for carrying the substrate and performing an exposure process on the photoresist layer, the substrate and the substrate Move so that the predetermined pattern on the reticle is transposed into a stripe-shaped exposure pattern. The exposure device according to item 15 of the patent, wherein the base is an air-floating system for carrying the substrate so that the substrate is suspended at a distance above the base; System connection for driving a transmission part of the substrate mm TW0991PA (Chimei) .ptd Page 22 200412474 6. Scope of patent application 1 17. For the exposure device of scope 15 of the patent application, the predetermined pattern has a plurality of regularly arranged openings. 18. For an exposure device according to item 15 of the patent application scope, wherein the light source forms an arc-shaped light receiving area on the mask, wherein the distance between the left and right ends of the light receiving area perpendicular to the substrate moving direction is related to the The length of the reticle is approximately the same. 19. For an exposure device according to item 15 of the application, wherein the light source forms an arc-shaped light receiving area on the mask, wherein the distance between the light receiving area and the front and back ends parallel to the moving direction of the substrate is related to the The width of the reticle is approximately the same. 20. For an exposure device according to item 15 of the patent application scope, wherein the light source forms a rectangular light receiving area on the photomask, wherein the distance between the left and right ends of the light receiving area perpendicular to the moving direction of the substrate is related to the light. The lengths of the hoods are approximately the same. 21. For an exposure device according to item 15 of the patent application, wherein the light source forms a rectangular light receiving area on the mask, wherein the light receiving area is parallel to the substrate moving direction before and after the vertical distance between the two ends It is approximately the same width as the mask. TW0991PA (Chi Mei) .ptd Page 23