TW200411946A - Optoelectronic transmitter - Google Patents

Optoelectronic transmitter Download PDF

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TW200411946A
TW200411946A TW91138014A TW91138014A TW200411946A TW 200411946 A TW200411946 A TW 200411946A TW 91138014 A TW91138014 A TW 91138014A TW 91138014 A TW91138014 A TW 91138014A TW 200411946 A TW200411946 A TW 200411946A
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photovoltaic system
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TW91138014A
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TW586240B (en
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Chi-Kuang Sun
Jin-Wei Shi
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Univ Nat Taiwan
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Abstract

An optoelectronics transmitter is disclosed, which comprises a semi-insulating substrate and side-illuminated traveling wave photodetector disposed on the substrate. The traveling wave photodetector comprises: an active layer disposed on the semi-insulating substrate, which is made by III-V material grown at room temperature and implanted with dopants, so as to absorb the photons in the light incident from the exterior, and to increase the electrical bandwidth; and an electrode structure formed on the active layer comprising three metal stripes to generate and transmit electromagnetic wave; and a planar antenna connected to the electrode structure of the photodetector to radiate the electromagnetic wave.

Description

200411946 五、發明說明(1) 發明所屬之技術領域 本發明係有關於一種光電發射器(photonic T r* a n s ni i 11 e r ),特別是有關於一種由側照式光偵測器及 印7電路板式電線所組成的高效率光電發射器,其具有平 面結構、高光電轉換效率、頻率可調性及可積體化。 先前技術 k著科技的進步及微波應用的快速增加,在微波範圍 内=¾磁波在應用上常會遇到干擾的困擾,因此電磁波頻 =中的毫米波或次毫米波範圍在近年來逐漸為商業及軍事 ^戶:重才見,其優點不僅在於其範圍中的應用是頻段較不 二時也在於其使用較高的頻率,&能提供較高的 ^ 斤又再者,其可以使用較低的功率及較小尺寸的 衣置,亚且能增加資料傳輸的量及速度。 (上’光電發射器—般包含有-個光偵測器 射#棄。' ,用以接受自雷射光源照射出來的雷 妳由天续值、、二:成南頻的電磁波,此匕電磁波則 、:由天線傳达出去,以做各種的應用,如分子成像 (Molecular Imaging) 、士 a 丨 /200411946 V. Description of the invention (1) The technical field to which the invention belongs The present invention relates to a photonic transmitter (photonic T r * ans ni i 11 er), in particular to a side-illuminated photodetector and a printing device 7 A high-efficiency photoelectric transmitter composed of a circuit board-type wire has a planar structure, high photoelectric conversion efficiency, frequency tunability, and integrability. The previous technology has been accompanied by technological advances and the rapid increase in microwave applications. In the microwave range, magnetic waves often encounter interference problems in their applications. Therefore, the millimeter wave or sub-millimeter wave range of electromagnetic wave frequency = has gradually become commercial in recent years And military users: see it again, its advantage is not only that the application in its range is the second frequency band, but also that it uses a higher frequency, & can provide a higher level, and it can be used more Low power and smaller size clothes can increase the amount and speed of data transmission. (On the 'photoelectric transmitter-generally contains-a light detector shot # discarded.', Used to receive the lightning from the laser light source, you continue to the value of the day, two: the electromagnetic wave into the south frequency, this dagger The electromagnetic wave is transmitted by the antenna for various applications, such as Molecular Imaging, Shia 丨 /

Momtoring)、太空研介十 g ; A玉研究或測距等。 習用的光電發射器中的抑 之類的三五族半導體材料先偵測裔疋由砷化鎵(GaAS ) 係自上方垂直=材;…的謝 效率會受到RC時間常數、 吻的垂直妝射式,其頻寬及 戰子生命期及載子合併時間等因 200411946 五、發明說明(2) " ' ~" '一· 素的影響。為能提升頻寬,習用有採用低溫成長砷化鎵 (Low^Tempeirature Gr〇wn GaA〇 ,簡稱LTG — GaAs,來縮 短其載子生命期及載子合併時間,此技術可參見美國專利 第4 9 5 2 5 2 7唬。此方法固能增加頻寬,但其轉換效率則不 甚理想。此外此方法必須使用電子束刻印技術(e_Beam Lithography),而此種製程是相當複雜而昂貴。 為解決上述的問題,在美國專利第64 1 8248號及第 5 5 7 2 0 1 4號中知路出使用側照式(e d g e - C 〇 u p 1 e d )光偵測 器的木構’如行波光貞測器(T r a v e 1 i n g W a v e Photodetector ’簡稱TWPD )或波導管光偵測器 (Waveguide Photodetector,簡稱WGPD )之類者。習用 技藝中,有些LTG-GaAs式的行波光偵測器,例如具有p-i 一 η結構者,可以提供520 GHz的頻寬,並具有8%的量子效 率。然而,在拉長此種TWPD,以提供較高之飽和輸出電流 時’其頻寬會因微波損耗等因素而嚴重減低。 再者,在光偵測器中使用LTG-GaAs材料係要利用低溫 長成之三五族材料内的缺陷(Defects)來產生高速的光 一電轉換效應,此等缺陷在正常溫度成長之三五族並不足 以達成所需的高速光一電轉換效果。然而低溫成長卻也使 得此三五族材料層無法利用單一晶體成長而於同一平面上 與其他常溫成長的半導體材料整合積體化。 發明内容 因此本發明之主要目的在於提供一種光電發射器,其Momtoring), space research and introduction ten g; A jade research or ranging. In the conventional optoelectronic emitters, the three or five semiconductor materials such as ytterbium are first detected by GaAs, which is vertical from the top; the efficiency of Xie will be subject to the vertical makeup of the RC time constant and the kiss. Expression, its bandwidth and lifetime of carriers and carrier merger time are affected by 200411946 V. Invention Description (2) " '~ "' In order to increase the bandwidth, it is customary to use low-temperature growth gallium arsenide (Low ^ Tempeirature GrOwn GaA0, referred to as LTG-GaAs) to shorten its carrier lifetime and carrier merger time. This technology can be found in US Patent No. 4 9 5 2 5 2 7. This method can increase the bandwidth, but its conversion efficiency is not ideal. In addition, this method must use e-Beam Lithography, which is quite complicated and expensive. To solve the above problems, it is known in U.S. Patent Nos. 64 1 8248 and 5 5 7 2 0 1 4 that the wooden structure using an edge-illumination type (edge-Coup 1 ed) photodetector is known as such. Wave light detector (Travave 1 ing Wave Photodetector 'TWPD' for short) or Waveguide Photodetector (WGPD), etc. In conventional technology, some LTG-GaAs type traveling wave light detectors, For example, those with a pi-η structure can provide a bandwidth of 520 GHz and have a quantum efficiency of 8%. However, when this TWPD is stretched to provide a higher saturated output current, its bandwidth will be lost due to microwave loss Severely reduced Furthermore, the use of LTG-GaAs materials in photodetectors requires the use of defects (Groups 5 and 5) grown at low temperatures to generate high-speed optical-electric conversion effects. These defects grow at three times the normal temperature. The fifth group is not enough to achieve the required high-speed optical-electric conversion effect. However, the low temperature growth also makes it impossible for this three or five group material layer to use single crystal growth and integrate with other semiconductor materials grown at normal temperature on the same plane. The main object of the present invention is therefore to provide a photoelectric transmitter which

200411946 電發射器包含有一 行波光摘測器。此 在該半絕緣基板上 雜質之三五族材料 的光子,並可提高 層之上,包含有三 一平面式天線,係 以供將該電磁波輻 效率。 的則在於提供一種 i係一種常溫長成 此光電發射器具有 重新晶而積體化在 的名於提供一種平 五、發明說明(3) 具有高頻寬及高轉換 本發明之另一目 p - i - η結構,其中的π 族材料層,因之可使 置在同一平面上不須 本發明的再一目 米波產生裝置。 因此本發明的光 於該基板上的側照式 含有一活性層,設置 或常溫成長而植入以 由外界入射的光線中 極結構,形成在活性 並傳送電磁波,以及 極結構聯結在一起, 光電發射器,具有 而植入雜質的三五 可與其它半導體裝 一起的結構。 面化的毫米或次毫 半絕緣基板及設置 側照式光γ貞測器包 ,其係由低溫成長 所製成,用以吸收 電寬頻,以及一電 金屬條,用以產生 與該光偵測器的電 射出去。 實施方式 下文將配合圖式,#灿1 。 ^ 細解釋本發明之光電發射器本如明的-個較佳實施例來詳 首先清參閱第一圖 '廿丄 10 ’其包含有-個光谓;;中::出本::的光電發射器 式天線1 6。藉由光情例1及—個印刷包路板式或平面 源)的光線(以箭號A/接收來自外部先源(如雷射光 電磁波,而經由天線偉不亚將其接收到的光轉換成 、、6傳迗出去。此光偵測器J 4可以是一 200411946200411946 The electric transmitter contains a traveling wave optical pick-up. The impurities of the three or five group of materials on the semi-insulating substrate can enhance the photon of the layer and include a trinity planar antenna for the efficiency of the electromagnetic wave radiation. The purpose is to provide an i-series one at room temperature. This phototransmitter has recrystallized and integrated. The name is to provide a flat five. Description of the invention (3) has a high bandwidth and high conversion. Another object of the present invention p-i- The η structure, of which the π group material layer, can be placed on the same plane without the need of the another mesh wave generating device of the present invention. Therefore, the side-illumination type of the light on the substrate of the present invention contains an active layer, which is set or grown at normal temperature and is implanted with the polar structure of light incident from the outside, formed in the active and transmitting electromagnetic waves, and the polar structures are connected together. The emitter has a structure in which three or five implanted impurities can be packaged with other semiconductors. Faceted millimeter or sub-millimeter semi-insulating substrate and side-illuminated light gamma sensor package, which is made by low temperature growth to absorb electrical broadband, and an electric metal strip to generate and detect the light The detector's electricity is emitted. Implementation mode The following diagram will be used in conjunction with the diagram, # 灿 1. ^ Explain in detail the photo-electric emitter of the present invention as a preferred embodiment. For details, please refer to the first picture '廿 丄 10', which contains an optical predicate; Transmitter antenna 1 6. With the light case 1 and a printed circuit board or plane source, the light (received from an external source (such as laser light electromagnetic waves with an arrow A /), and the light received by the antenna is converted into ,, 6 pass out. The light detector J 4 can be a 200411946.

種行波式光偵測器,例如具有MSM (Metal -Semiconductor-Metal )架構者(如第三圖),或是具有 0-卜11(13+-1115士1^1^卜11+)架構者(如第四圖):疋/、 請配合第二圖,其中顯示出本發明光偵測器丨4 圖丄此光偵測器14包含有一光吸收部15,其側視圖係顯示 在第二圖(MSM架構)或第四圖(p — i—n架構)中。自第二 圖由下往上視之,光偵測器14的光吸收部15包含有一層i 絕緣(Semi-Insulating)基板14〇,係由三五族半導^材 料構成,如GaAs、GaSb或InP。在基板140上設有光隔離声 141及包覆層142,在其上則設有一層三五族材料活性層曰 1 43g,例如LTG GaAs或是其它的三五族半導體材料,其曰可 以是低溫長成者,如LTG InGaAs、LTG GaAsSb、UG、 hAs、LTG InGaAsN,或者是常溫長成而其内植入以質子 或正離子之類的雜質者,如〇+、Ni+、as4+、as+、n、 Η、F、Ar、p、b、Nl、Mn、c〇、Nd等,以縮短其載子生务 期。在活性層143與包覆層142之間則設有一層由AUsM P 的防止擴散層144。 、隔離層141及包覆層142二者均係由AiGaAs材質所構 成基本成份為A1xGal-xAs ’然而二者具有不同的成份比 ,,如隔離層141是由A1G JauAs所組成,而包覆層142則 是由AlG.35GaG mAs所組成。在此實施例中,隔離層的厚 度為3 #πι,其主要目的在於將基板14〇與活性層143隔離 開,而包覆層142的厚度則為1 ,其主要目的在於做為 光波導(Optical Wavegui ding )。活性層143的功用在於A type of traveling wave light detector, such as those with a MSM (Metal-Semiconductor-Metal) architecture (as shown in the third figure), or a 0-Bu11 (13 + -1115 ± 1 ^ 1 ^ Bu11 +) architecture (See the fourth picture): 疋 /, Please cooperate with the second picture, which shows the light detector of the present invention. 4 The light detector 14 includes a light absorbing portion 15, and its side view is shown at the first. In the second diagram (MSM architecture) or the fourth diagram (p-i-n architecture). Seen from the second figure from the bottom to the top, the light absorbing portion 15 of the photodetector 14 includes a layer of semi-insulating substrate 14, which is composed of three or five group semiconductor materials, such as GaAs, GaSb Or InP. The substrate 140 is provided with an optical isolation sound 141 and a cladding layer 142, and an active layer of a group III or 5 material, such as LTG GaAs or other group III or semiconductor materials, is provided on the substrate 140, which may be Low temperature growers, such as LTG InGaAs, LTG GaAsSb, UG, hAs, LTG InGaAsN, or those grown at room temperature and implanted with impurities such as protons or positive ions, such as 0+, Ni +, as4 +, as +, n, ytterbium, F, Ar, p, b, Nl, Mn, co, Nd, etc. to shorten their carrier lifetime. Between the active layer 143 and the cladding layer 142, a diffusion preventing layer 144 made of AUsM P is provided. The isolation layer 141 and the cladding layer 142 are both made of AiGaAs material. The basic composition is A1xGal-xAs'. However, the two have different composition ratios. For example, the isolation layer 141 is composed of A1G JauAs and the cladding layer. 142 is composed of AlG.35GaG mAs. In this embodiment, the thickness of the isolation layer is 3 # πι, the main purpose of which is to isolate the substrate 14 from the active layer 143, and the thickness of the cladding layer 142 is 1, which is mainly used as an optical waveguide ( Optical Wavegui ding). The function of the active layer 143 is

200411946200411946

吸收外部光源所射入的光子,以供轉換成毫米或次毫米的 電磁波。A1 As層144的厚度約為1〇〇1,其目的在於防止石申' 原子在退火過程中向外擴散。 在活性層143的頂面上則設有共平面波導(c〇 —pianapAbsorbs photons incident from an external light source for conversion into electromagnetic waves of millimeters or sub-millimeters. The thickness of the A1 As layer 144 is about 001, and its purpose is to prevent Shi Shen 'atoms from diffusing outward during the annealing process. A coplanar waveguide (c0-pianap) is provided on the top surface of the active layer 143.

Waveguide,簡稱CpW),用以波導造成光激發微波 Γ (Photo-Excited Micr©wave Guiding Mode),其包含有 一電極結構,係由三金屬條所構成,包括中央條1 4 5及二 側邊條146,其中側邊條丨46係做為地線之用,與中央條 1 4 5分隔開。在此藉由金屬條丨4 5、} 4 6與活性層〗4 3的msm 架構,可將入射光波轉換成電磁波。 此共平面波導係利用合適的半導體製程所製成的,例 如自對準式製程(Self-Aligned Process ),其可在製程 中在中央條145下方的活性層143上形成内切 壬 (Undercut),而將側邊條146條145分隔開,其間的間隙 可以縮小至2 0 0-3 0 0 nm,而不需要使用習用光偵測器中所 應用的電子束刻印技術,然而可以理解的,其亦可使用電 子束刻印技術來製做出相同或類似的結構。金屬條間的二 小間隙可以消除寄生電容及電阻、縮減載子生命期、增強 電場強度,並提升内部的量子效率。此外,在超高頻的應 用上’較小的間隙亦可減少微波輻射的損耗。 本發明的光偵測器14内的活性層143及包覆層142係分 別由GaAs及AlGaAs所構成,其等可利用半導體製程製做 之,且此二者所造成的微波傳導模式是,,Quasi_TEM Mode” ,不同於習用TWPD中的” Slow Wave M〇de” ,因此相Waveguide (referred to as CpW) is used for waveguide-induced light-excited microwave Γ (Photo-Excited Micr © wave Guiding Mode). It includes an electrode structure, which is composed of three metal strips, including a central strip 1 4 5 and two side strips. 146, in which the side bars 丨 46 are used as ground wires and are separated from the center bar 1 4 5. Here, with the msm structure of metal strips 4 5,} 4 6 and active layer 4 3, incident light waves can be converted into electromagnetic waves. This coplanar waveguide is made using a suitable semiconductor process, such as a self-aligned process, which can form an undercut on the active layer 143 below the center bar 145 during the process. , And the side bars 146 and 145 are separated, the gap between them can be reduced to 2 0-3 0 0 nm, without using the electron beam engraving technology applied in the conventional light detector, but it is understandable It can also use electron beam engraving technology to make the same or similar structure. The two small gaps between the metal bars can eliminate parasitic capacitance and resistance, reduce the carrier lifetime, enhance the electric field strength, and increase the internal quantum efficiency. In addition, the 'smaller gap' in UHF applications can also reduce the loss of microwave radiation. The active layer 143 and the cladding layer 142 in the photodetector 14 of the present invention are composed of GaAs and AlGaAs, respectively, and they can be made by using a semiconductor process, and the microwave conduction mode caused by the two is, Quasi_TEM Mode "is different from the" Slow Wave Mode "in the conventional TWPD, so

200411946 五、發明說明(6) 杈於I用技術會具有低損耗及高速的特性,故在岸 長長度的微波產μ置上時可以心呆具有較低的頻寬劣= 效果。在本發明的一個較佳實施例中,其在8〇〇㈣光 犯圍内’具有5 70 GHz的頻寬,同時也具有〇. 8 、 響應FWHM。 p们脈渡 再參閱第二圖,除-了第三圖中所示的光吸收部15 光偵測為14另包含有共平面波導的導線151、152、丨53, 分別與光吸收部丨5中的共平面波導内的金屬條146、145相 連接’用以傳送毫米及次毫米電磁波。 再明芩閱弟- ® ’在本發明中,該印刷電路板式天線 或平面天線16是一種CPW饋入槽式天線(cpw Fed si〇t200411946 V. Description of the invention (6) The technology used in I will have the characteristics of low loss and high speed, so when the microwave length μ of the shore length is set, it can be restless and has a lower bandwidth. In a preferred embodiment of the present invention, it has a bandwidth of 5 70 GHz within the range of 800nm, and also has a response of 0.8 to FWHM. Refer to the second figure again, except for the light absorbing part 15 shown in the third figure. The light detection is 14 and the wires 151, 152, and 53 which include a coplanar waveguide are respectively connected to the light absorbing part. The metal bars 146 and 145 in the coplanar waveguide in 5 are connected to each other to transmit millimeter and sub-millimeter electromagnetic waves. Rebirth-® ′ In the present invention, the printed circuit board antenna or planar antenna 16 is a CPW feed slot antenna (cpw Fed si〇t

Antenna ),其經由一阻抗匹配部18連接至光偵測器μ, .亥阻杬匹配。卩1 8可提供天線丨6與光偵測器丨4間的阻抗匹 =,這對於功率之傳送至天線16上,以及光债測器“在頻 tit的14⑸均相Ϊ重要。天線1 6内另包含有射頻隔離偏壓 端,用以阻擋高頻交流信號(與天線共振者)進入用以 提,偏壓,DC探針端17。在此可以瞭解到,此阻抗匹配部 1 8最好亦疋成平面狀的結構,並以半導體製程與光偵測器 1 4及天線1 6積體化結合在一起。 在第四圖中所顯示的p一 i-n架構中,其係於半絕緣基 板140上,依序以常溫長出?層241、][層242及卩層243,其 中P層及η層分別由p型及_A1GaAs材料所構成,而^242 則是GaAs材料,這些ρ層及η層亦可是其它的三五族材料, 如InAlAs、InP、InGaAsP等,而i層的材料除了 GaAs外,Antenna), which is connected to the photodetector μ through an impedance matching section 18, and the impedance is matched.卩 18 can provide impedance matching between antenna 6 and photodetector 4, which is important for the transmission of power to antenna 16 and the optical debt tester "at 14 frequencies of frequency tit. Both are important. Antenna 1 6 It also contains a radio frequency isolation bias terminal, which is used to block high-frequency AC signals (resonant with the antenna) from entering, to bias, DC probe terminal 17. It can be understood here that this impedance matching section 18 It is also a flat structure, and is integrated with the photodetector 14 and the antenna 16 by a semiconductor process. In the p-in architecture shown in the fourth figure, it is semi-insulated. Layer 241,] [layer 242, and rhenium layer 243 are sequentially grown at normal temperature on the substrate 140. The P layer and the η layer are respectively composed of p-type and _A1GaAs materials, and ^ 242 is GaAs material. The layer and the η layer may also be other materials of the three or five groups, such as InAlAs, InP, InGaAsP, etc., and the material of the i layer is other than GaAs.

第9頁 200411946 五、發明說明(7) :- 亦可以是InGaAs,在i層242内並利用雜質植入的方式在其 内形成缺陷,以便和其上方和下方的p層241和11層243共同 作用,有效率志將入射光線轉換成高頻電磁波。在1)層241 和1!層243上亦設有金屬條146、145,以將電磁波傳送出 去。在此要強調的是,藉由常溫長成以^材料可使得此p — i-η架構能與光偵測器U以外的半導體裝置在同一平面上 不須重新長晶而積體化整合在一起。 第五圖中顯不出本發明之光電發射器丨〇在四個不同作 業頻率下所傳送之功率的相對變化,其中可以看到,在 1 · 6 THz時,本發明的光電發射器丨〇可以有最大的功率輸 出。 如前所述,藉由常温長成光偵測器14内的各部位,並 藉由採用CPW饋入槽式天線做為天線16的架構,本發明的 另一特徵即在於其可將天線1 6與光偵測器丨4以單晶積 成單一元件而互相聯結在一起。 ' 此外,本發明之光偵測器14中的光吸收部15的基板 1 4 0,可以一種低介電常數基板上取代之,該低介電常數 基板的材質可以是玻璃、石英、塑膠聚合物或碳化石夕 (S:iC)等,可供毫米波或次毫米波穿過而不會造成強列 的干擾,因此可更進一步提升電磁波傳送至空中的能力、'。 再者,本發明亦可如第六圖中所示,提供一種整體式 的結構,將天線16及光偵測器14整合成單一元件,其中係 將天,16直接形成於一層低介電常數基板12上,再將其設 置在W述光偵測器1 4半絕緣基板丨4 〇上,而形成為單一/個Page 9 200411946 V. Description of the invention (7):-It can also be InGaAs, and defects are formed in the i-layer 242 and by means of impurity implantation so as to form p-layers 241 and 11-layer 243 above and below it Together, they effectively convert incident light into high-frequency electromagnetic waves. Metal strips 146, 145 are also provided on 1) layer 241 and 1! Layer 243 to transmit electromagnetic waves out. It should be emphasized that the p-i-η structure can be integrated with semiconductor devices other than the photodetector U on the same plane by growing into a material at room temperature. together. The fifth figure does not show the relative change of the power transmitted by the photoelectric transmitter of the present invention at four different operating frequencies. It can be seen that the photoelectric transmitter of the present invention at 1.6 THz Can have maximum power output. As mentioned above, by growing the various parts in the photodetector 14 at room temperature, and using a CPW feed slot antenna as the structure of the antenna 16, another feature of the present invention is that it can use the antenna 1 6 and photodetector 丨 4 are integrated into a single element by a single crystal and are connected to each other. '' In addition, the substrate 1 40 of the light absorbing part 15 in the light detector 14 of the present invention may be replaced by a low dielectric constant substrate, and the material of the low dielectric constant substrate may be glass, quartz, or plastic. It can pass through millimeter or sub-millimeter waves without causing strong interference, so it can further enhance the ability of electromagnetic waves to be transmitted to the air. Furthermore, as shown in the sixth figure, the present invention can also provide an integrated structure, which integrates the antenna 16 and the photodetector 14 into a single component, wherein the sky and the sky 16 are directly formed on a layer with a low dielectric constant. The substrate 12 is arranged on a semi-insulating substrate 14 of the photodetector 14 and formed into a single unit.

200411946 五、發明說明(8) 整體式裝置。藉由半導體製程的技術,本發明的光偵測器 14及天線16可以形成為一個單一積體電路式 箭號A代表入射光線或光源。 ’直ΰ中的 藉由常溫長成並植入雜質的三五族材料所製成之光偵 測器14,其將可此光偵測器14與其它的半導體裝置做成積 體化的結構,如在第七·圖中顯示出本發明的另一實施例, 其中在低介電常數基板1 2上設有本發明之光電發射器1 〇及 一個半導體光放大器(Sem:[c〇nduct:〇r Qpticai Amplifier,簡稱SOA) 2〇,其等亦係利用半導體技術 成的,因此亦為一種積體元件。光放大器2〇的功用在扒= 大入射光線,以提供適當的信號至光電發射器〗〇。藉" 放大器20之設置,本發明的光電發射器丨〇可以應用在* f 較高靈敏度的情形中。 %要 第八圖中顯示出本發明之光電發射器丨〇的另一種 用,其中在低介電常數基板12上設有一層被動式光波^ (Passive 〇ptlCal Wavegulde)3〇,並在該被動式光V 導層30上設置多對的光放大器2〇及光電發射器ι〇 波 線A可經由被動式光波導層3〇傳送至各光放大 ,射光 送光電發射器1 0上。 外傳 第九圖中顯示出本發明之光電發射器10的再一種痛 用,其中,低介電常數基祀2上設有多個光電發射^ 以及一個夕模干擾式分光器(0ptical Multi_MQde ,200411946 V. Description of the invention (8) Integral device. Through the technology of semiconductor manufacturing, the light detector 14 and the antenna 16 of the present invention can be formed into a single integrated circuit type. The arrow A represents the incident light or light source. 'A photodetector 14 made of a group of three or five materials grown at room temperature and implanted with impurities in a straight line. The photodetector 14 and other semiconductor devices can be integrated into a structure. As shown in FIG. 7 and FIG. 7, another embodiment of the present invention is shown, in which a photodiode 10 and a semiconductor optical amplifier (Sem: [c〇nduct) of the present invention are provided on a low dielectric constant substrate 12. : 〇r Qpticai Amplifier (referred to as SOA) 2〇, which is also made by using semiconductor technology, so it is also an integrated component. The function of the optical amplifier 20 is to provide a proper signal to the phototransmitter. With the "amplifier 20" arrangement, the photoelectric transmitter of the present invention can be applied in the case of higher sensitivity * f. The eighth figure shows another use of the phototransmitter of the present invention, in which a layer of passive light wave ^ (Passive 〇ptlCal Wavegulde) 30 is provided on the low dielectric constant substrate 12 and the passive light The V guide layer 30 is provided with a plurality of pairs of the optical amplifier 20 and the phototransmitter wave line A, which can be transmitted to each optical amplifier through the passive optical waveguide layer 30, and the emitted light is sent to the phototransmitter 10. The ninth figure shows another painful use of the photoelectric emitter 10 of the present invention, in which the low dielectric constant base 2 is provided with multiple photoelectric emitters ^ and an evening mode interference beam splitter (0ptical Multi_MQde,

Interference P〇Wer Splitter ) 4〇 ,苴 放大器20,對應於各個光電八 3有夕個光 口亢电嗌射斋1 〇。入射光線A進入分Interference PoWer Splitter) 40, 苴 amplifier 20, corresponding to each of the photocells, and there is a light port, and the radio frequency is 1 〇. The incident light A enters

第11頁 200411946 五、發明說明(9) =器40:,:並由之傳送至各光放大器2〇内,再由光放大器 2 0加以傳送至各光電發射器】〇上。 第十圖顯示本發明的再另一種應用,其中在低介電常 數基板12上认有個分散式布拉格光柵(Distributed Bragg Grating) 50,或是内腔式反射器(intra_cavityPage 11 200411946 V. Description of the invention (9) = device 40 :, and transmits it to each optical amplifier 20, and then transmits it to each photoelectric emitter 20]. The tenth figure shows still another application of the present invention, in which a distributed Bragg Grating 50, or an intra-cavity reflector (intra_cavity) is recognized on the low dielectric constant substrate 12

PefleCt〇r)。在此例中、做為提供增益作用的放大器20 能提供足夠的增益時,整個結構便開始雷射化PefleCtor). In this example, when the amplifier 20, which provides a gain function, can provide sufficient gain, the entire structure starts to laserize.

Lasmg),而分散式布拉格光栅或内腔式反射器5〇可挑 選出連續雷射化(CW Lasing)時的二個模態,使其互擊 Beatlng)或是增進雷射鎖模時的重覆頻率到τΗζ的頻 ϋ *電發2器1 〇和由再成長半導體層所構成的相位器 _〇的^助下,前述的高頻光信號便能轉換成電信號,進而 f去此結構取大的特點是在於不須外加的光信號就 f t兆赫波信號。在此,分散式布拉格光柵或内腔 式反射益是由半導體光柵所構成者,故 1 〇共同積體化,形成單一 f w。π样Μ „^ m m i a s 1 $ 裝置。同樣的,相位控制器6 o是 = 層構成’亦可與光電發射器10在同-平 面積體化在一起。 τ ^土 Ϊ ,ί藝者均可瞭解’雖然、以上戶斤述僅係、本發明的 =广列恶樣而e ’但在不脫離本發明之 可有多種的變化及改良,而凡此種種的變化及=鹿= 為下文申請專利範圍所欲保護之範圍。 =〜? 200411946 圖式簡單說明 第一圖係本發明之光電發射器的平面圖。 第二圖是本發明之光電發射器中的光偵測器的平面圖。 第三圖是本發明之光電發射器中的光偵測器的側視圖。 第四圖是本發明之光電發射器中所採用的另一種光偵測器 的侧視圖。 第五圖是本發明之光電-發射器在不同頻率時所傳送之功率 相對變化的圖式。 第六圖是本發明另一種型態之光電發射器積體化的示意立 體圖。 第七圖是應用本發明光電發射器的光電系統的第一實施 例。 第八圖是應用本發明光電發射器的光電系統的第二實施 例。 第九圖是應用本發明光電發射器的光電系統的第三實施 例。 第十圖是應用本發明光電發射器的光電系統的第四實施 例0 元件編號 10 光電發射器 12 低介電常數基板 14 光偵測器 15 光吸收部 16 平面式天線Lasmg), and the decentralized Bragg grating or internal cavity reflector 50 can select two modes during continuous laserization (CW Lasing) to make them hit each other Beatlng) or increase the weight of laser mode locking. Covering the frequency to τΗζ ϋ * With the help of the electric generator 2 〇 and the phaser _ 0 formed by the re-grown semiconductor layer, the aforementioned high-frequency optical signal can be converted into an electric signal, and f It is characterized by ft megahertz signals without additional optical signals. Here, the decentralized Bragg grating or internal cavity reflection benefit is composed of a semiconductor grating, so 10 is collectively integrated to form a single fw. πsample M „^ mmias 1 $ device. Similarly, the phase controller 6 o is = layer structure 'can also be integrated with the photoelectric transmitter 10 in the same-flat area. τ ^ soil, can be used by artists Understand that 'Although, the above description is only relevant, the present invention = a wide range of evils and e', but there can be many changes and improvements without departing from the present invention, and all such changes and = deer = for the application below The scope of the patent scope to be protected. = ~? 200411946 Schematic illustration of the first diagram is a plan view of the photoelectric transmitter of the present invention. The second diagram is a plan view of the photodetector in the photoelectric transmitter of the present invention. Third The figure is a side view of a photo-detector in the photoelectric transmitter of the present invention. The fourth figure is a side view of another photo-detector used in the photoelectric transmitter of the present invention. The fifth figure is a photoelectric detector of the present invention. -A diagram of the relative change in the power transmitted by the transmitter at different frequencies. The sixth diagram is a schematic perspective view of the integration of another type of photoelectric transmitter of the present invention. The seventh diagram is a photoelectric application of the photoelectric transmitter of the present invention The first embodiment of the system. The figure is a second embodiment of a photovoltaic system to which the photoelectric transmitter of the present invention is applied. The ninth figure is a third embodiment of the photoelectric system to which the photoelectric transmitter of the present invention is applied. The tenth figure is a photovoltaic system to which the photoelectric transmitter of the present invention is applied. Fourth Embodiment 0 Element No. 10 Photoelectric Transmitter 12 Low Dielectric Constant Substrate 14 Light Detector 15 Light Absorber 16 Planar Antenna

第13頁 200411946 圖式簡單說明 17 DC探針 18 阻抗匹配部 19 射頻隔離偏壓端 20 光放大器 30 被動式光波導Page 13 200411946 Brief description of the drawings 17 DC probe 18 Impedance matching 19 RF isolation bias 20 Optical amplifier 30 Passive optical waveguide

40 多模干擾式分光IT 50 布拉格光栅 6 0 相位控制器 1 4 0 半絕緣基板 1 4 1 光隔離層 142包覆層 1 4 3 活性層 1 4 4 防止擴散層 1 4 5 中央條 146 側邊條 151導線 1 5 2 導線 1 5 3導線40 Multi-mode interference beam splitting IT 50 Bragg grating 6 0 Phase controller 1 4 0 Semi-insulating substrate 1 4 1 Optical isolation layer 142 Cladding layer 1 4 3 Active layer 1 4 4 Anti-diffusion layer 1 4 5 Center bar 146 Side 151 wires 1 5 2 wires 1 5 3 wires

第14頁Page 14

Claims (1)

200411946 六、申請專利範圍 1. 一種光電發射器,包含有: 一基板; 一侧照式行波光偵測器,包含有一活性層,設置在該基 板上’其係由二五族材料所製成,用以吸收由外界 入射的光線中的光子,並可提高電寬頻,以及一電 極結構’形成在·活性層之上,包含有三金屬條,用 以產生並傳送電磁波; 一平面式天線,係舆該光偵測器的電極結構聯結在一 起’以供將該電磁波輻射出去。 2 ·如申請專利範圍第1項所述之光電發射器,其中該平面 化天線係以單晶積體化的方式與該光偵測器結合在一 起。 3·如申請專利範圍第1項所述之光電發射器,其中該基板 係由二五族半導體材料製成的半絕緣基板。 4· t Ϊ ΐ專利範圍第3項所述之光電發射器,其中該三五 2 “ ‘版材料係自包含有GaAs、GaSb和ία的族群中選 fri 〇 * 5 ·如申請專利範圍笛 制 粑固弟1項所述之光電發射器, 、InGaAs 、 其係低溫長 其中該活性 〇 其中該植入 衣成/性層的半導體材料係自 “Α_、ΙηΑ3、Ιη_Ν 有 成,以縮短其载子生命期。中t出者 6 . ί ί利範圍第1項所述之光電發射器, 層内係植入以雜斯 7如φ古主直 ,、貝,以細短其載子生命期 • ^ , 1已圍第6項所述之光電發射器,200411946 VI. Application for patent scope 1. A photoelectric transmitter, comprising: a substrate; a side-illuminated traveling wave light detector, comprising an active layer, disposed on the substrate, which is made of materials of group two or five To absorb photons in the light incident from the outside, and to increase the electrical bandwidth, and an electrode structure is formed on the active layer and contains three metal strips for generating and transmitting electromagnetic waves; a planar antenna, The electrode structures of the photodetector are connected together to radiate the electromagnetic wave. 2 · The photoelectric transmitter according to item 1 of the scope of patent application, wherein the planarized antenna is integrated with the photodetector in a monocrystalline integrated manner. 3. The optoelectronic transmitter according to item 1 of the scope of patent application, wherein the substrate is a semi-insulating substrate made of a group of two or five semiconductor materials. 4 · t Ϊ 之 The optoelectronic emitter described in item 3 of the patent scope, in which the three-five 2 "'version material is selected from the group containing GaAs, GaSb and ία 〇 * 5 The photo-electric emitter described in item 1 of the article, InGaAs, which has a low temperature and long activity, wherein the semiconductor material of the implanted garment / sexual layer is made from "Α_, ΙηΑ3, Ιη_Ν, to shorten its load. Child life.中 出 出 者 6. The photoelectric transmitter described in Item 1 of the 范围 Li scope, the layer is implanted with zest 7 such as φ ancient main straight, shell, to shorten its carrier lifetime • ^, 1 Has covered the photoelectric transmitter described in item 6, 第15頁 200411946 六 1〇 11 12 13 14 15 Η 、中請專利範圍 之雜質係選自包含右 An.Ni、Μη 有、Nl+、As4+、As 如申請專利範圍第j項的族群。抑 係為由低介電常數材、A之A電發射器 如申請㈣範圍成的基板。 化矽在内之族群中之璃、石英、塑膠聚合物或碳 “ 中所選出者加以製成的。 包含右一所述之光電發射器,其中該天線 3有一共+面波導饋入槽式天線。 ’:申請專利範圍第i項所述之光電發射器,4 一步 一阻段匹配部,設置在光偵測器與天線之間。 ’二申利範圍扪項所述之光電發射器,其中該側照 ς =波偵測态包含有MSM結構,且其電極結構係以自對 平衣程製成而形成該MSM結構之一部份。 •如申請專利範圍第1項所述之光電發射器,其中該側照 式行波偵測器包含有MSM結構,且其電極結構係以電子 束刻印技術製成而形成該MSM結構之一部份。 •如申請專利範圍第1項所述之光電發射器,其中該電極 結構包含有三金屬條,其中至少一個接地,且其間之 間隙為 2 0 0-30 0 nm。 •如申請專利範圍第1 2項所述之光電發射器,進一步包 含有一光隔離層,位在該基板與該活性層之間,該隔 離層分隔開該基板與該活性層。 .如申請專利範圍第1 5項所述之光電發射器,進一步包 N 其中該基板 其中該低介Page 15 200411946 6 10 11 12 13 14 15 中 The impurities in the scope of the patent claim are selected from the group consisting of right An.Ni, Mn, Nl +, As4 +, As such as item j in the scope of patent application. It is a substrate made of a low dielectric constant material and an A-electro-transmitter such as an application of a tritium. It is made of glass, quartz, plastic polymer or carbon in the group including silicon silicon. It includes the photoelectric transmitter described in the first one, wherein the antenna 3 has a total + planar waveguide feeding slot type. Antenna. ': Photoelectric transmitter described in item i of the scope of patent application, 4 step-by-step resistance segment matching section, placed between the photodetector and the antenna. The side-illumination = wave detection state contains the MSM structure, and the electrode structure is made of a self-aligning process to form a part of the MSM structure. • The optoelectronic transmitter described in item 1 of the scope of patent application Among them, the side-illuminated traveling wave detector includes an MSM structure, and the electrode structure is made of electron beam engraving technology to form a part of the MSM structure. • Optoelectronics as described in item 1 of the scope of patent applications A transmitter in which the electrode structure includes a tri-metal strip, at least one of which is grounded, and the gap therebetween is 200-300 nm. • The photoelectric transmitter described in item 12 of the patent application scope further includes a light Isolation layer on the substrate Between the active layer, the spacer layer spaced from the substrate and the active layer. The application of the first photo emitter 15 patent range, further wherein the packet N wherein the low dielectric substrate 200411946 六、申請專利範圍 含有一包覆層,位在該隔離層與該活性層之間,用以 做為光波導。 1 7 ·如申請專利範圍第1 2項戶斤述之光電發射器,進一步包 含有一層用以防止坤原孑擴散的層’位於該基板與該 其中該隔 活性層之間^ 1 8 ·如申請專利範圍第y7項所述之光電發射器 離層係由AlxGal_xAs所製成的。 其中該包 其中該用 ) 其中該側照 其中該P-層形成於該 其中該ρ層 1 9 ·如申請專利範圍第1 6項所述之光電發射器 覆層係由AlxGal_xAs所製成的。 {· 20·如申請專利範圍第1 7項所述之光電發射器 以防止砷原子擴散的層係由A1 A s所製成的 21 ·如申請專利範圍第1項所述之光電發射器 式行波彳貞測器的活性層包含有P i η結構 2 2 ·如申請專利範圍第2 1項所述之光電發射器 i- η結構包含有一 ρ層,形成於基板上’ 一 ρ層上,以及一層η層,形成於該i層上。 2 3 ·如申請專利範圍第2 2項所述之光電發射器 π、,^ 係由自包含有AlGaAs、InAlAs,InP、inGaAsP在内之ρ 型材料内選出者所製成的。 籲 24·如申請專利範圍第22項所述之光電發射器,其中該η層 係由自包含有AlGaAs、InAlAs ’InP、inGaAsP在内之η 型材料内選出者所製成的。 2 5 ·如申請專利範圍第2 2項所述之光電發射器,其中該i層 係由自包含有GaAs和InGaAs在内之族群中所選出之常200411946 VI. Scope of patent application Contains a cladding layer between the isolation layer and the active layer, which is used as an optical waveguide. 1 7 · As described in Item 12 of the scope of the patent application, the optoelectronic emitter further includes a layer to prevent the diffusion of Kun Yuan 孑 'located between the substrate and the active active layer ^ 1 8 · 如The photo-emitter delamination described in item y7 of the scope of patent application is made of AlxGal_xAs. Wherein the package is used for this purpose) Where the side view is where the P-layer is formed in the where the p-layer is 19 The photo-emitter coating as described in the patent application No. 16 coating layer is made of AlxGal_xAs. {· 20 · The photoelectric emitter as described in item 17 of the patent application to prevent the diffusion of arsenic atoms is made of A1 A s 21 · The photoelectric emitter as described in item 1 of the patent application The active layer of the traveling wave detector includes a P i η structure 2 2 · The photo-emitter i- η structure described in item 21 of the patent application scope includes a ρ layer formed on a substrate ′ -ρ layer And a layer of n are formed on the layer i. 2 3 · The photoelectric emitters π, ^ as described in item 22 of the scope of patent application are made of those selected from p-type materials including AlGaAs, InAlAs, InP, inGaAsP. 24. The optoelectronic emitter according to item 22 of the scope of patent application, wherein the η layer is made of a material selected from η-type materials including AlGaAs, InAlAs ′ InP, and inGaAsP. 2 5 · The optoelectronic emitter described in item 22 of the patent application scope, wherein the i-layer is selected from the group consisting of GaAs and InGaAs 第17頁 200411946Page 17 200411946 六、申請專利範圍 溫長成材料所製成,其中炎植入雜質。 2 6 ·如申請專利範圍第2 5項所述之光電發射器,其中該植 入之雜質係選自包含有〇+、Ni+、As4+、As+、Ν、Η、 F、Ar、P、β、、Mn、c〇、Nd 的族群。 2 7 · —種光電系統,包含有: 一低介電常數基板: 一光電發射器,設置於該低介電常數基板上,其包含 有: 一側照式行波光偵測器’包含有一活性層,係由 三五族材料所製成,以及一電極結構,形成 在活性層之上,包含有三金屬條,用以產生 並傳送電磁波; 一平面式天線,係與該光偵測器的電極結構聯結 在一起,以供將該電磁波輻射出去;以及 一光放大器,用以吸收由外界入射的光信號,並 將之加以放大而傳送至光電發射器上。 28·如申請專利範圍第27項所述之光電系統,其中該平面 化天線係以單晶積體化的方式與該光偵測器結合在一 起。 2 9 · 2申凊專利範圍第2 7項所述之光電系統,其中該用以 製成活性層的半導體材料係自包含有GaAs、InGaAs、 GaAsSb、InAs、InGaAsN的族蛘中選出者,其係低溫長 成’以縮短其載子生命期。 3 〇 ·如申凊專利範圍第2 7項所述之光電系統,其中該活性6. Scope of patent application Made by Wen Changcheng materials, among which inflammation is implanted with impurities. 2 6 · The optoelectronic emitter according to item 25 of the scope of the patent application, wherein the implanted impurities are selected from the group consisting of 0+, Ni +, As4 +, As +, N, Hf, F, Ar, P, β, , Mn, co, and Nd. 2 7 · — An optoelectronic system including: a low-dielectric-constant substrate: a photoelectric transmitter disposed on the low-dielectric-constant substrate, which includes: a side-illuminated traveling-wave light detector including an activity The layer is made of three or five materials and an electrode structure is formed on the active layer and contains three metal strips for generating and transmitting electromagnetic waves. A planar antenna is connected to the electrodes of the photodetector. The structures are connected together to radiate the electromagnetic wave; and an optical amplifier is used to absorb the optical signal incident from the outside, amplify it and transmit it to the photoelectric transmitter. 28. The photovoltaic system according to item 27 of the scope of patent application, wherein the planarized antenna is integrated with the photodetector in a single crystal integrated manner. The photovoltaic system according to item 27 of the 29.2 patent application range, wherein the semiconductor material used to form the active layer is selected from the group consisting of GaAs, InGaAs, GaAsSb, InAs, and InGaAsN. It grows at low temperature to shorten its carrier lifetime. 3 〇 The photovoltaic system as described in claim 27 of the patent scope, wherein the activity 第18頁 200411946 六、申請專利範圍 層内係植入以雜質,以縮短其載子生命期。 3 1.如申請專利範圍第3 0項所述之光電系統,其中該植入 之雜質係選自包含有0+、Ni +、As4+、As+、N、H、 F、Ar、P、B、Ni、Mn、Co、Nd 的族群。 3 2.如申請專利範圍第2 7項所述之光電系統,其中該低介 電常數基板係由自包含有玻璃、石英、塑膠聚合物或 碳化矽在内之族群中所選出者加以製成的。 3 3.如申請專利範圍第2 7項所述之光電系統,其中該天線 包含有一共平面波導饋入槽式天線。 3 4.如申請專利範圍第27項所述之光電系統,進一步包含 有一阻段匹配部,設置在光偵測器與天線之間。 3 5.如申請專利範圍第2 7項所述之光電系統,其中該側照 式行波偵測器包含有MSM結構,且其電極結構係以自對 準製程製成而形成該MSM結構之一部份。 3 6.如申請專利範圍第2 7項所述之光電系統,其中該側照 式行波偵測器包含有MSM結構,且其電極結構係以電子 束刻印技術製成而形成該M S Μ結構之一部份。 3 7.如申請專利範圍第2 7項所述之光電系統,其中該電極 結構包含有三金屬條,其中至少一個接地,且其間之 間隙為 2 0 0-3 0 0 nm。 3 8 ·如申請專利範圍第3 5項所述之光電系統,進一步包含 有一光隔離層及一包覆層,位在該隔離層與該活性層 之間,用以做為光波導。 3 9.如申請專利範圍第3 5項所述之光電系統,進一步包含Page 18 200411946 6. Scope of patent application The layer is implanted with impurities to shorten its carrier lifetime. 3 1. The photovoltaic system according to item 30 of the scope of patent application, wherein the implanted impurities are selected from the group consisting of 0+, Ni +, As4 +, As +, N, H, F, Ar, P, B, Ni, Mn, Co, and Nd groups. 3 2. The photovoltaic system according to item 27 of the scope of patent application, wherein the low dielectric constant substrate is made of a member selected from the group consisting of glass, quartz, plastic polymer or silicon carbide of. 3 3. The photovoltaic system according to item 27 of the scope of patent application, wherein the antenna includes a coplanar waveguide feed-in slot antenna. 3 4. The optoelectronic system according to item 27 of the scope of patent application, further comprising a resistance matching section provided between the photodetector and the antenna. 3 5. The photovoltaic system according to item 27 of the scope of patent application, wherein the side-illuminated traveling wave detector includes an MSM structure, and the electrode structure is made by a self-aligned process to form the MSM structure. a part. 3 6. The photovoltaic system according to item 27 of the scope of the patent application, wherein the side-illuminated traveling wave detector includes an MSM structure, and the electrode structure is made by an electron beam engraving technology to form the MS Μ structure Part of it. 37. The photovoltaic system according to item 27 of the scope of patent application, wherein the electrode structure includes a tri-metal strip, at least one of which is grounded, and a gap therebetween is 2 0-3 0 0 nm. 38. The photovoltaic system according to item 35 of the scope of patent application, further comprising an optical isolation layer and a cladding layer, which are located between the isolation layer and the active layer, and are used as optical waveguides. 3 9. The photovoltaic system described in item 35 of the scope of patent application, further comprising 第19頁 200411946 六、申請專利範圍 有一層用以防止砷原子擴散的層。 4 〇 ·如申請專利範圍第3 8項所述之光電系統,其中該隔離 層係由A lx Ga l_x As所製成的。 4 1 ·如申請專利範圍第38項所述之光電系統,其中該包覆 層係由AlxGa:LxAs所製成的。 42·如申請專利範圍第33項所述之光電系統,其中該用以 防止砷原子擴散的層係由A 1 As所製成的。 4 3 ·如申請專利範圍第2 7項所述之光電系統,其中該側照 式行波偵測器的活性層包含有P —卜n結構。 籲 44·如申請專利範圍第43項所述之光電系統,其中戎P-1 一η 結構包含有一ρ層、一i層形成於該Ρ層上,以及一層η 層,形成於該i層上。 ^ 4 5 ·如申請專利範圍第4 4項所述之光電系統,其中该P層係 由自包含有AlGaAs、InAlAs,InP、InGaAsP在内之p型 材料内選出者所製成的。 4 6 ·如申請專利範圍第4 4項所述之光電系統,其中該n層係 — 由自包含有AlGaAs、InAlAs ’ InP、InGaAsP在内之^型 材料内選出者所製成的。 4?·如申請專利範圍第44項所述之光電,其中該i層係由 包含有GaAs和InGaAs在内之常溫長成材料所製成,复 · 中並植入雜質。 ’、 4 8 ·如申請專利範圍第4 7項所述之光電系統,其中該植 之雜質係選自包含有0+、Ni +、As4+、As+、N、H、入 F、Ar、P、B、Mi、Μη、⑶、Nd 的族群。。Page 19 200411946 6. Scope of patent application There is a layer to prevent the diffusion of arsenic atoms. 40. The photovoltaic system according to item 38 of the scope of patent application, wherein the isolation layer is made of AlxGal_xAs. 4 1 The photovoltaic system according to item 38 of the scope of patent application, wherein the cladding layer is made of AlxGa: LxAs. 42. The photovoltaic system according to item 33 of the scope of patent application, wherein the layer for preventing the diffusion of arsenic atoms is made of A 1 As. 4 3 · The photovoltaic system according to item 27 of the scope of patent application, wherein the active layer of the side-illumination traveling wave detector includes a P-bu n structure. Call 44. The photovoltaic system according to item 43 of the scope of patent application, wherein the R-1 P-n structure includes a p layer, an i layer formed on the p layer, and a n layer formed on the i layer . ^ 4 5 · The photovoltaic system according to item 44 of the scope of patent application, wherein the P layer is made of a p-type material selected from the group consisting of AlGaAs, InAlAs, InP, and InGaAsP. 46. The photovoltaic system according to item 44 of the scope of patent application, wherein the n-layer system is made of a material selected from among ^ type materials including AlGaAs, InAlAs' InP, and InGaAsP. 4? The optoelectronic device according to item 44 of the scope of patent application, wherein the i-layer is made of a normal-temperature growing material including GaAs and InGaAs, and is compounded and implanted with impurities. ', 4 8 · The photovoltaic system according to item 47 of the scope of the patent application, wherein the plant impurity is selected from the group consisting of 0+, Ni +, As4 +, As +, N, H, F, Ar, P, B, Mi, Mη, CD, Nd groups. . 200411946 六、申請專利範圍 4 9 ·如申請專利範圍第2 7項所述之光電系統,進一步包含 有一層被動光波導層,設在該低介電常數基板上,而 在光偵測器及光放大器下方,用以將入射光傳送至光 放大器上。 5 0.如申請專利範圍第4 9項所述之光電系統,進一步包含 有另一光偵測器及另一光放大器,設置在該被動光波 導層上’該光放大器可自被動光波導層接收入射光。 5 1 ·如申請專利範圍第2 7項所述之光電系統,進一步包含 有一多模干擾式分光器,設在該低介電常數基板上, 用以將入射光傳送至光放大器。 5 2 ·如申請專利範圍第5 1項所述之光電系統,進一步包含 有另一光偵測器及另一光放大器,設置在該低介電常 數基板上,其中該光放大器可自該多模干擾式分光器 中接收入射光。 53·如申請專利範圍第27項所述之光電系統,進一步包含 有一布拉格光柵,設在該低介電常數基板上,而位在 光放大器之前。 54·如申請專利範圍第53項所述之光電系統,其中該布拉 格光栅包含有一半導體光柵。 5 5.如申請專利範圍第53項所述之光電系統,進一步包含 有一相位控制器,設置於該低介電常數基板上,而位 在光偵測器及光放大器之間。 已6 ·如申明專利範圍第5 5項所述之光電系統,其中該相位 控制裔係由再成長的半導體層構成。200411946 6. Patent application scope 4 9 · The photovoltaic system described in item 27 of the patent application scope further includes a passive optical waveguide layer provided on the low dielectric constant substrate, and the photodetector and the light Below the amplifier, it is used to transmit the incident light to the optical amplifier. 50. The optoelectronic system according to item 49 of the scope of the patent application, further comprising another optical detector and another optical amplifier, which are disposed on the passive optical waveguide layer. The optical amplifier may be a passive optical waveguide layer. Receives incident light. 5 1 · The photovoltaic system described in item 27 of the scope of patent application, further comprising a multi-mode interference beam splitter provided on the low dielectric constant substrate for transmitting incident light to the optical amplifier. 5 2 · The optoelectronic system described in item 51 of the scope of patent application, further comprising another photodetector and another optical amplifier, which are arranged on the low dielectric constant substrate, wherein the optical amplifier can be The mode interference beam splitter receives incident light. 53. The photovoltaic system according to item 27 of the scope of patent application, further comprising a Bragg grating provided on the low-dielectric-constant substrate and positioned before the optical amplifier. 54. The photovoltaic system according to item 53 of the patent application, wherein the Bragg grating includes a semiconductor grating. 5 5. The photovoltaic system according to item 53 of the scope of patent application, further comprising a phase controller disposed on the low-dielectric-constant substrate and located between the photodetector and the optical amplifier. 6. The photovoltaic system according to Item 55 of the declared patent scope, wherein the phase control lineage is composed of a regrown semiconductor layer. 200411946 六、申請專利範圍 5 7.如申請專利範圍第2 7項所述之光電系統,進一步包含 有一内腔式反射器,設在該低介電常數基板上,而位 在光放大器之前。 5 8.如申請專利範圍第5 7項所述之光電系統,其中該内腔 式反射器包含有一半導體光栅。 5 9.如申請專利範圍第5-7項所述之光電系統,進一步包含 有一相位控制器,設置於該低介電常數基板上,而位 在光偵測器及光放大器之間。 6 0.如申請專利範圍第5 9項所述之光電系統,其中該相位 控制器係由再成長的半導體層構成。200411946 6. Scope of patent application 5 7. The photovoltaic system according to item 27 of the scope of patent application, further comprising an internal cavity reflector, which is arranged on the low dielectric constant substrate and is located before the optical amplifier. 5 8. The photovoltaic system according to item 57 of the scope of patent application, wherein the cavity reflector includes a semiconductor grating. 5 9. The photovoltaic system according to items 5-7 of the scope of patent application, further comprising a phase controller disposed on the low-dielectric-constant substrate and located between the photodetector and the optical amplifier. 60. The photovoltaic system according to item 59 of the scope of the patent application, wherein the phase controller is composed of a regrown semiconductor layer. 第22頁Page 22
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI399867B (en) * 2008-01-31 2013-06-21 Osram Opto Semiconductors Gmbh Optoelectronic component and method for the production of an optoelectronic component
US8686451B2 (en) 2008-01-31 2014-04-01 Osram Opto Semiconductor Gmbh Optical-electronic component and method for production thereof

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