TW200305925A - Exposure device and device manufacturing process - Google Patents

Abstract

A device and a manufacturing process conduct the temperature control of the machinery devices when necessary in order to decrease changes of base line. A first control system 61 and a second control system 62 are provided. The temperature of a first liquid is set in the first control system 61 to circulate between a projection optical PL and a substrate stage 5 in order to control the temperature of the projection optical PL. The temperature of a second liquid is set in the second control system 62 to circulate in a reticle stage 2 to control the temperature of the reticle stage. In view of the temperature ranges during setting the temperature of the liquids, the settings of the fist and the second control systems 61 and 62 are different.

Description

200305925

V. Description of the invention (1) The technical field to which the invention belongs The present invention relates to a component manufacturing process for a semiconducting element— # 斗 、， θ # — t ^ dual element or liquid-day-day display element, and a photomask ( rnasj ^ Anwugan > The pattern of the dagger κ) is projected and exposed on the substrate of the wafer (wafer) # Exposure to the office and the ice from the door-u ^,, ^ ^ ^ Nine devices and components A method for manufacturing a 7G part whose pattern is transferred to a substrate. In the prior art, when a semiconductor element or a liquid crystal g is formed, the solar cell 4 is manufactured by a photolithography process using a photomask or a reticle (hereinafter collectively referred to as a grating). A projection exposure device for projecting a pattern image on a photosensitive substrate through a projection optical system on each of the shooting (sh) areas. In recent years, this type of projection exposure device is an exposure device using a step-and-repeat method, such as a down-projection type stepper. The above-mentioned step repetition is repeated by placing the photosensitive substrate on a stage that can be moved two-dimensionally, whereby the machine moves the photosensitive substrate in steps to sequentially expose the pattern image of the grating on the crystal. The motion of each shooting area on a photosensitive substrate such as a circle. In recent years, in the exposure of wafers, an exposure device of a so-called step and scan method is used in which the grating and the wafer are moved synchronously to sequentially expose each shooting region on the wafer. . For example, a micro device such as a semiconductor device has a circuit pattern in which a plurality of layers of circuit patterns are superimposed on a photosensitive substrate such as a wafer coated with a photosensitizer, and the circuit patterns of the second and subsequent layers are projected and exposed on the crystal. When it is on a circle, each shooting area of the circuit pattern already formed on the wafer is aligned with the position of the pattern of the grating to be exposed, that is, it needs to be fine

_7pif _ Page 7 200305925 V. Description of the invention (2) The position alignment of the wafer and the grating is performed (a 1 i g n m e n t). For example, the method of aligning the wafers when a single wafer in which a photographing area where a circuit pattern is exposed is arranged in a matrix shape is used is, for example, a so-called enhanced global positioning (EGA: Enhanced Global Alignment) is the mainstream. The EGA method is to specify at least three areas (hereinafter referred to as EGA shooting) among a plurality of shooting areas formed on a wafer (object), and a positioning sensor (a 1 ignmentsensor) measures the positioning attached to each shooting area Identification (a 1 ignmentmark) (or single name identification). After that, the minimum self-multiplication statistical calculation processing is performed according to the measured value and the design value to determine the error parameters (offset, scale, rotation, orthogonality) regarding the arrangement characteristics (position information) of the imaging area of the wafer. ). Then, according to the determined parameter values, the design coordinates of all areas on the wafer are corrected, and the wafer table is moved step by step according to the corrected coordinates to determine the position of the wafer. As a result, the projected images of each raster pattern and the plurality of shooting areas on the wafer, the processing points set in the shooting area (the reference point for which the coordinate value is measured or calculated, such as the center of the shooting area) can be accurately set. Overlap exposure. Known as a positioning sensor for measuring a positioning mark on a wafer has been a method using an off-axis (0 f f-a X i s) positioning system near a projection optical system. This method uses an off-axis positioning device system to measure the position mark position, as long as the wafer machine is fed into one of the baseline (base 1 ine) quantities about the distance between the projection optical system and the off-axis positioning system. Immediately make the pattern of the grating overlap and expose correctly.

10917pif.ptd Page 8 200305925 V. Description of the Invention (3) In this way, the baseline amount is a very important operation amount of the lithographic etching process, and it is a strictly required accurate measurement value. However, the above-mentioned baseline amount may cause thermal expansion or thermal deformation of a positioning system or the like due to the heat generated by various processes, and may change in exposure (b a s e 1 i n e d r i f t, baseline shift). In this case, the position of the wafer may cause an error, which may have an adverse effect on the overlay accuracy. Therefore, baseline calibration is performed every time a predetermined number of wafers are exposed to prevent deterioration of the overlay accuracy. [Patent Document 1] Japanese Patent Laid-Open No. Sho 6b 4 4 4 2 9 However, the above-mentioned conventional exposure device and device manufacturing method have the following problems. In recent years, due to the finer patterns, the step-and-repeat method has gradually become the mainstream of exposure devices using a step-and-scan method (hereinafter, referred to as a scanning method). The scanning method refers to the relationship between the scanning of the wafer and the grating during exposure (pattern transfer). Not only the wafer table but also the grating table is also affected by the motor. Deformation arises. Although the position of the machine is measured by the interference system, when the distance between the moving mirror and the grating is changed by the deformation of the machine, the baseline changes, so that the overlap accuracy deteriorates. In addition, due to the heating of the machine, the ambient temperature around the machine rises, and the influence of the optical path of the interferometer on the shaking of the interferometer causes a problem that the accuracy of the positioning of the machine deteriorates. Therefore, the temperature of the refrigerant is never controlled by the temperature regulator

10917pif.ptd Page 9 200305925 V. Description of the invention (4) Enter (circulate) the heating part for cooling. However, a wafer machine or a grating machine that generates intense heat in units of 1/10 ° c and a projection optical system or positioning system that controls temperature in units of 1/10 ° c are cooled by a temperature regulator. In the occasion, when the temperature of the refrigerant is controlled based on the temperature of the projection optical system, the cooling capacity of the wafer machine or the grating machine with a large temperature change becomes insufficient. On the contrary, the temperature of the wafer machine or the grating machine is used as a reference. When controlling the temperature of the refrigerant, the necessary precise (fine) temperature control cannot be performed in the projection optical system or positioning system. In particular, the grating machine moves to the wafer machine according to the distance and speed of the projection magnification, and its heat generation is very large. It is difficult to manage the temperature of the same control system as the projection optical system or positioning system. As described above, when the temperature management is insufficient, as a result, the baseline variation becomes large, which causes a problem that the overlapping accuracy deteriorates. SUMMARY OF THE INVENTION The present invention has been made in consideration of the above-mentioned problems, and an object thereof is to provide an exposure apparatus and a method for manufacturing an element that can perform necessary temperature control on each constituent device and can suppress a baseline variation. In order to achieve the above object, the present invention adopts the following constitutions corresponding to the embodiment shown in Figs. 1 to 10. The exposure device of the present invention projects a pattern image of the grating (R) held on the grating machine (2) through a projection optical system (RL) onto a substrate (W) held on the substrate machine (5). The exposure device (1) is characterized in that it comprises a first control system (6 1) and a second control system (6 2). Among them, the first control system (6 1) is to set the first liquid temperature at least while setting the first liquid at the set temperature to at least the projection optical system (PL) and the substrate machine (5).

10917pif.ptd Page 10 200305925 V. Description of the invention (5) One object (PL) is circulated to control the temperature of the object (PL). The second control system (6 2) sets the second liquid temperature independently from the first control system (6 1), and circulates the temperature-set second liquid to the grating machine (2) to control the grating machine (2). ) Temperature. When setting the temperature range of the liquid temperature, the first and second control systems (6 1 and 6 2) have different setting capabilities. Therefore, the exposure device of the present invention can be independent. The first control system (6 1) circulates the first liquid to make the projection optical system (PL) or the machine (5), for example, 1/1 0. Control is performed in units of 0 ° C, and the grating machine (2) is controlled in the second control system (62) by circulating the second liquid, for example, in units of 1/10 ° C. That is, by setting the first and second control systems (6 1, 6 2) separately according to the temperature range required by the projection optical system (PL ·) or the grating table (2), the accuracy required by each machine can be By controlling the temperature, it is possible to suppress the baseline fluctuation caused by the temperature fluctuation. The exposure device of the present invention projects a pattern image of the grating (R) held on the grating machine (2) through a projection optical system (PL) onto a substrate (W) held on the substrate machine (5). ) Exposure device (1), characterized in that it includes: a first control system (6 1), a second control system (6 2), a first detection means and a second detection means (7 6 a, 7 6 b ). Among them, the first control system (61) sets a first circulation condition when the first liquid circulates an object (PL) in at least one of the projection optical system (PL) and the substrate table (5). The first liquid is circulated under the first circulation condition to control the temperature of the object (PL). The second control system (62) is set independently from the first circulation condition so that the second liquid can cycle the grating machine (2).

10917pif.ptd Page 11 200305925 V. Description of the invention (6) At the same time as the second circulation condition of the ring, the second liquid is circulated under the second circulation condition to control the temperature of the grating machine (2). The first detection means respectively detects the first liquid temperature before the object (P L) is circulated and the first liquid temperature after the object (P L) is circulated. The second detection means (76a, 76b) detects the temperature of the second liquid before the grating machine (2) circulates and the temperature of the second liquid after the grating machine (2) circulates. The first control system (6 1) sets a first cycle condition based on the detection result of the first detection means, and the second control system (6 2) is based on the detection of the second detection means (7 6 a, 7 6 b). As a result, a second cycle condition is set. Therefore, the exposure device of the present invention can be independent, and the projection optical system (PL) or the substrate machine (5) can be circulated in the unit of 1/100 ° C by circulating the first liquid under the first circulation condition. It is controlled, and the grating machine (2) is controlled, for example, in the unit of 1/10 ° C by circulating the second liquid in the second control system (62). That is, by setting the first and second control systems (61, 62) individually according to the temperature range required by the projection optical system (PL) or the grating machine (2), the temperature can be added to the accuracy required by each machine. The control can suppress the baseline variation caused by the temperature variation. At this time, the first and second circulation conditions are set according to the relationship between the temperature of the first and second liquids detected before and after each machine cycle, and can be based on the first and second liquids produced by each machine cycle. The temperature change is subject to high-precision temperature control. However, the exposure device of the present invention projects a pattern image of the grating (R) held on the grating table (2) through a projection optical system (PL) onto a substrate (W) held on the substrate table (5). The exposure device (1) on

10917pif.ptd Page 12 200305925 V. The description of the invention (7) is that the grating machine (2) and the substrate machine (5) each have a complex driving source (1 5, 1 7 X, 1 7 Y, 7 2 and 3, 3, 5), and includes a first control system (6 1) and a second control system (6 2). Among them, the first control system (6 1) generates heat or temperature in a plurality of driving sources (1 5, 17, 7 X, 1 7 Y, 7 2 and 3 3, 3 5) and the projection optical system (PL). The first control object whose variation is within the first amount is temperature-controlled. The second control system (62) is the amount of heat generation or temperature change in the complex driving source (1, 5, 7 X, 1 7 Y, 7 2 and 3 3, 3 5) and the projection optical system (PL). The second control object that is larger than the first quantity is temperature-controlled. Therefore, the exposure device of the present invention can be independently controlled so that the driving source (3, 3, 5) or the projection optical system (PL) of the substrate machine with a small amount of heat generation or temperature change is the first control object. A control system (61) controls the drive source (15) of the grating machine with a large amount of heat generation or temperature change as the second control object and is independently controlled by the second control system (62). That is, by controlling the amount of heat generation or temperature change of the projection optical system (PL) or the drive source (1 5) of the machine as the control object, the temperature can be controlled with the accuracy required by each machine, which can suppress the temperature change. Baseline changes. In addition, the device manufacturing method of the present invention is characterized by comprising: using an exposure device described in any one of the first to the twenty-eighth patent applications to transfer the pattern formed on the grating (R) Process on substrate (W). Therefore, the element manufacturing method of the present invention enables the pattern to be transferred to the substrate (W) in a state where necessary temperature control is performed, and suppresses the temperature-dependent state.

10917pif.ptd Page 13 200305925 V. Description of the invention (8) The baseline variation of the variation can be used to superimpose components with excellent accuracy. As described above, the present invention can independently perform temperature control and management on machines with different temperature control accuracy requirements, and set the relationship between the most suitable cooling conditions according to the heat generation of each machine, which can suppress the causes caused by no temperature control. The change in baseline at this time can suppress the deterioration of overlap accuracy. In addition, the present invention has an effect of contributing to miniaturization and reduction in price of the device. In order to make the above principles and other objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is given below in conjunction with the accompanying drawings to make a detailed description as follows: Embodiments are described below with reference to FIGS. 1 to FIG. 7 illustrates a first embodiment of an exposure apparatus and a device manufacturing method of the present invention. Here, an example of a case where the exposure device is a scanning exposure device (scanning s t p p r r) that transfers a circuit pattern of a semiconductor element formed by a grating to a wafer during exposure (pattern transfer) is used. The exposure device 1 shown in the first figure is roughly composed of an illumination optical system I U, a machine device 4, a projection optical system PL, a machine device 7, and a recoil frame (r e a c t i ο n f r a m e) 8. Among them, the illumination optical system I U is a rectangular (or arc-shaped) illumination area on a grating (mask) with uniform illumination by the exposure illumination light from a light source (not shown). The machine device 4 includes a grating machine (reticle machine) 2 which keeps the movement of the grating R, and a grating fixing plate 3 which supports the grating machine 2. The projection optical system PL projects the illumination light emitted from the grating R onto a wafer (substrate) W. The machine device 7 includes a wafer machine (substrate machine) 5 which holds a wafer W holding a sample and holds the wafer.

10917pif ptd Page 14 200305925 V. Description of the invention (9) Fixing plate 6 of machine 5. The recoil frame 8 supports the machine device 4 and the projection optical system PL. In addition, here, the direction of the optical axis of the projection optical system PL is the Z direction, the direction of the grating R and the wafer W's synchronous movement direction is the Y direction, and the asynchronous movement direction is the X direction. In addition, the rotation directions around each axis are ΘZ, ΘZ, ΘX. The illumination optical system I U is supported by a support column 9 fixed on the recoil frame 8. In addition, as the illumination light for exposure, for example, far-ultraviolet light (g-line, i-line) and K r F excimer laser light (wavelength 248 mm), such as far-ultraviolet light (e.g. DUV) or vacuum ultraviolet light (VUV), such as ArF excimer laser light (wavelength 193nm) & F2 laser light (wavelength 157nm). The recoil frame 8 is provided on a base plate (base p 1 a t e) 10 which is horizontally placed on the chassis, and on the upper side, i.e., the lower side, protruding sections 8a and 8b inward are formed. In the machine device 4, the corners of the grating platen 3 are supported by the section 11 of the recoil frame 8 approximately horizontally via a vibration-proof unit 11 (Also, the protection against the inner side of the paper surface) The vibrating member is not shown), and an opening 3 a is formed in a central portion thereof to allow a pattern image formed in the grating R to pass through. Moreover, the material of the grating fixing plate 3 can be metal or ceramics. The anti-vibration member 11 is composed of an air mount 12 with adjustable internal pressure and a voice coil motor 13 arranged in series on the segment 8a. With these anti-vibration components 11, the micro-vibrations transmitted through the substrate 10 and the recoil frame 8 to the grating plate 3 are insulated at a micrometer (m i c r) G level (G is a gravity acceleration).

10917pif ptd Page 15 200305925 V. Description of the Invention On the grating fixing plate 3, the grating machine 2 is supported along the grating fixing plate 3 in a two-dimensionally movable manner. A plurality of air bearings [air pads] 14 are fixed on the bottom surface of the grating machine 2, and the grating machine 2 is set on the grating platen 3 by a few micrometers (micr ο) by the air bearings 14. η) to a degree of clearance (c 1 eara η ce) for floating support. Further, an opening 2a communicating with the opening 3a of the grating fixing plate 3 is formed in the central portion of the grating table 2 so that the pattern image of the grating R can pass through. Xizi details the grating stage 2. As shown in FIG. 2, the grating stage 2 is composed of a grating stage 16 and a grating stage 18. Among them, the optical rough motor table 16 is driven by a pair of Y linear motors (1 inearm 〇t 〇r) (drive source) 15 and 15 on the grating plate 3 with a predetermined stroke in the Y-axis direction. . The grating micromotor table 1 8 is composed of a pair of voice coil motors (drive, source 1 7 χ and a pair of voice coil motors (drive source) 1 7) with minute drive in the X and $ directions (still, in the first picture, the A machine is illustrated) The line motor 15 is composed of a stator (stat 0r) 2 0 and a movable element 2 (movable element 3). Among them, the stator 20 is fixed to the grating by a non-positive floating support. A plurality of air bearings (air 塾) contacting the air bearing 1 9 are added: Let ^ = extend in the γ axis direction. The moving element 2 1 corresponds to this stator 20 by ^ moving ^ connecting member 2 2 is fixed to the grating coarse motor table 1 6. Therefore, according to the rule of ^ inch ten densities, the movement of the grating stage 16 to the + Y direction is performed. Thus, 2 is a reaction mass that moves to the -Y direction with a counter mass. The movement can offset the linear motor that moves with the coarse stage 16 of the grating. When t =, it can prevent the change of the position of the center of gravity. In addition, the mover 21 of γ and the stator 2 0 are coupled (c 〇up 1 ing). Key point

Page 16 200305925 I --------- ______ V. Description of the Invention (11)-2 It is a work that has the power to stay in the original position during relative movement. Therefore, in this embodiment, a trimming motor 72 (driving source) is provided for the stator 20 to reach a predetermined position. The trimming motor 72 (driving source; not shown in FIG. ^, Refer to FIG. 5). ). The rough grating stage of the vertical grating is guided by a pair of guides (§ uide) 5 1, 5 1 which are fixed on the upper protruding section 3 b formed on the center 4 of the grating plate 3 and extend in the γ-axis direction. direction. The coarse grating stage j 6 is a non-contact type Y guide 51, 51 supported by an air bearing (not shown). The grating micromotor table 18 is configured to adsorb and hold the grating R via a vacuum chuck (not shown). A pair of γ moving mirrors 52a, 52b, which are formed by a corner cube, are fixed to the end of the grating micromotor table 18 in the -γ direction. The end is fixed to an X-moving mirror 53 constituted by a plane mirror extending in the Y-axis direction. However, these moving mirrors 52a, 52b, and 53 can measure the distance to each moving mirror by using three interferometers (none of which are shown) that irradiate a long beam, and can measure X and γ of the grating machine 2 with high accuracy. , 0 Z (position around the Z axis) direction. Returning to FIG. 1, the projection optical system p L is used in this system. A telecentric circular projection field of view on both the object surface (grating R) side and the image surface (wafer W) side is made of quartz. Or fluorite is a refracting optical system of 1/4 (or 1/5) reducing magnification formed by the refracting optical element (lens element) of the optical glass breaking material. Therefore, when the illuminating light is irradiated to the light grid R, among the circuit patterns on the light grid R, the portion irradiated by the illuminating light is

_l7pif ptcj Page 17 200305925 V. Description of the invention (12) The junction image beam is incident on the projection optical system, and a part of the inverted image of the circuit pattern is limited to form a slit (s 1 it) junction image on the projection optical system PL. The center of the circular field of view on the image plane side. As a result, the partially inverted image of the projected circuit pattern is used to reduce the photoresist layer on the surface of one of the plurality of imaging regions transferred on the wafer W arranged on the junction image plane of the projection optical system PL. On the outer periphery of the lens barrel portion of the projection optical system PL, a flange (Π ange) 2 3 integrated with the lens barrel portion is provided. However, the projection optical system PL is engaged with the flange 23 while being inserted into the lens barrel fixing plate 25 from above with the optical axis direction being the Z direction. Among them, the lens barrel fixing plate 25 is formed in the section portion 8b of the counterbalance frame 8 by a casting or the like which is supported approximately horizontally by the vibration-proof member 24. The anti-vibration parts 2 4 are arranged at the corners of the lens barrel fixing plate 2 5 (also, the anti-vibration parts on the inner side of the paper surface are not shown). They are air mounts 26 with adjustable internal pressure and sound. The ring motor 27 is configured by being arranged in series on the segment portion 8b. With such anti-vibration members 24, the micro-vibration transmitted through the base plate 10 and the counterbalance frame 8 to the lens barrel fixed plate 25 (extended to the projection optical system) is insulated at a micrometer (m i c r) G level. The machine device 7 is mainly composed of a wafer machine 5, a wafer fixing plate 6, a sample table ST, and an X guide bar XG. Among them, the wafer fixing plate 6 enables the wafer table 5 to be supported in a two-dimensional direction along the X Y plane. The sample stage S T adsorbs and holds a wafer W integrated with the wafer table 5. The X guides XG support these wafer machine tables 5 and sample tables ST in a relatively movable manner. A plurality of non-contact bearing air bearings (air cushions) 28 are fixed to the bottom surface of the wafer table 5. The air bearings 28 make the wafers

10917pif.ptd Page 18 200305925 V. Description of the invention (13) The machine 5 is floatingly supported on the wafer fixing plate 6 with a gap of, for example, several micrometers. The wafer fixing plate 6 is supported above the base plate 10, and is supported at a substantially horizontal level via a dielectric anti-vibration member 29. The anti-vibration components 29 and 9 are arranged at the corners of the wafer fixing plate 6 (still, the anti-vibration components on the inner side of the paper surface are not shown). The air base 30 and the voice coil motor 31 with adjustable internal pressure are located on the base plate. 〇 is composed of a parallel arrangement. With this 4 anti-vibration members 29, the micro-vibration transmitted to the crystal disc fixing plate 6 via the dielectric disc 6 is insulated to a level of micrometer (m i c r) G.

As shown in the third figure, the X guide X G has a long shape in the X direction, and at both ends in the length direction, movable elements 3 6 and 36 each including an armature are provided. Corresponding to these movable elements 3 6, 3 6 are stators 37, 37 having magnet components, which are provided on the supporting portions 3 2, 3 2 protruding from the base plate 10 (refer to FIG. 1 and FIG. 1). The movable element 36 and the stator 37 are illustrated in a simplified manner. However, the moving elements 36 and the stator 37 constitute linear motors (driving sources) 33 and 33 of a moving coil type, and the moving element 3 6 is electromagnetically interacted with the stator 37 Drive it to move the X guide XG in the γ direction, and adjust the drive of the linear motors 3 3, 3 3 to move the rotation in the 0 Z direction. That is, from this linearity of 2 to 33, the wafer machine table 5 (and the sample table st, hereinafter simply referred to as the sample table) and the X guide XG are roughly driven integrally in the γ and θζ directions.

In addition, on the -X direction side of the X guide XG, there is a work for installing the χ trimming motor 34. The X trimming motor 34 adjusts the position in the X direction of the X V rod XG by generating thrust in the X direction, and the stator thereof is provided in the counterbalance frame 8. Therefore, the reaction force when the wafer machine 5 is driven in the direction of ^

200305925 V. Description of the invention (14) The counterbalance frame 8 is transmitted to the base plate 10. The sample stage ST is a magnetic guide composed of a magnet and an actuator in the Z direction via a fixed gap between the X guide XG and XG. The non-contact support maintains relative movement freely in the X direction. In addition, the wafer machine 5 is driven in the X direction by the electromagnetic interaction of the X linear motor (driving source) 35. The stator of the X linear motor is embedded in the X guide rod XG. Not shown, it is mounted on the wafer table 5. On the top of the sample table ST, the wafer W is fixed via a vacuum wafer holder (h ο 1 d e r) 4 1 by vacuum suction or the like (refer to FIG. 1, and the illustration is omitted in FIG. 3). The position in the X direction of the wafer table 5 is based on a reference mirror 42 fixed to the lower end of the lens barrel of the projection optical system PL, and the laser interferometer 44 is used to set the resolution, for example, about 0.5 to 1 nm. The resolution is measured in real time (rea 1 time) to measure the position change of the moving mirror 43 fixed to a part of the wafer table 5. In addition, the Y direction of the wafer table 5 is measured by a reference mirror, a laser interferometer, and a moving mirror (not shown) which are arranged substantially orthogonal to the reference mirror 42, the moving mirror 43, and the laser interferometer 44. s position. Moreover, at least one of these laser interferometers is a multi-axis interferometer with a long axis having more than two axes. According to the measured values of these interferometers, not only the wafer machine 5 (extended to wafer W) can be obtained. XY position, 0 rotation, can also be added to leveling (leveling). Furthermore, at the flange 23 of the projection optical system PL, the laser interferometer 45 is fixed to three different locations (however, one of these laser interferometers is represented in FIG. 1). The lens tube fixing plate facing each laser interferometer 4 5

10917pif ptd Page 20 200305925 V. Description of the invention (15) 2 5 each form an opening 2 5 a, and a laser beam (length measuring beam) in the Z direction from each laser interferometer 45 passes through these openings. 2 5 a irradiates the wafer fixing plate 6. The opposing positions of the length-measuring beams on the wafer fixing plate 6 each form a reflecting surface. Therefore, each of the three laser interferometers 45 and 35 with the flange 23 as a reference is used to measure the z positions of the three different points of the wafer fixing plate 6. Next, the temperature control system in the exposure apparatus 1 will be described with reference to Figs. 4 to 6. Fig. 4 shows a temperature control system for the entire exposure apparatus, Fig. 5 shows a temperature control system for the grating table 2, and Fig. 6 shows a temperature control system for the wafer table 5. In addition, although the medium (refrigerant) used for temperature adjustment can use HFE (Hydr0 (hydrogen). FluOr〇 (fluorine) ·

EthTri ether)) or Fluorint (trade name). In this embodiment, H F E is used in order to make the global warming coefficient low and the odor coefficient to be zero from the viewpoint of the protection of earthworms. 9, the degree control system is the first control system 61 and the second pestle fll 糸, first 6 2. Among them, the first control system 6 uses the first liquid cooling second f: the projection optical system PL and the positioning system AL are "L = degree control. Management. The second control system 62 uses ί ί: ί: grating The machine 2 and the wafer machine 5 are the second control pair ~ the first control system 61 is independently temperature-controlled and managed. A And 'this second-degree control system is based on the amount of heat (temperature changes two ^ ^ ^ (one brother; / II: The projection optical system PL and positioning system AL inside are:-Degree control object 'Grating with larger calorific value than the above amount =

200305925 V. Description of the invention (16) The second set and the wafer set set 5 are the second temperature control objects. The refrigerant system in the first control system 61 and the temperature-adjusted tank 63 is divided into a circulation system C1 and a cooling system C2 after passing through the pump 64. Among them, the cyclic system C 1 is a sequential cyclic positioning system AL and a projection optical system PL. The cooling system C 2 is cooled by an evaporator 65. The temperature of the refrigerant immediately after being discharged from the pump 64 is detected by the sensor 66 and output to the controller 67. Regarding the circulation system C 1, the projection optical system PL is arranged in a spiral shape around the lens barrel 68, and the temperature adjustment range of the refrigerant is set to be wide. In this embodiment, in FIG. 4, the refrigerant is a structure in which a spirally arranged pipe is circulated around the lens barrel 68 from the top to the bottom, and it is not limited to this. The refrigerant may be circulated in a spiral from bottom to top. structure. The circulation system C 1 is provided with a sensor 69 for detecting the refrigerant temperature before the projection optical system PL is circulated, and the detection result is output to the controller 67. Furthermore, in this embodiment, although it is roughly extended to the entire circumference of the lens barrel 68 as described above, a spiral-shaped pipe is arranged to perform the temperature adjustment of the projection optical system PL, the present invention is not limited to this, and it can also be used to maintain The so-called flange temperature adjustment method in which the components (the flanges 2 3) of the projection optical system PL are provided with pipes for temperature adjustment. The off-axis positioning system AL can use the Laser Step Alignment (LSA) method, field image positioning, FIA (Field Image Alignment) method, and Laser Interferometric A 1 ignment (LIA) method. . Among them, the laser step positioning method is to make the laser light of He-Ne and so on to illuminate the dot-shaped positioning mark (a 1 i g n m e n t m a r k) on the wafer W and use the winding around the mark.

10917pif ptd Page 22 200305925 V. Description of the invention (17) Detected or scattered light to detect the position of the mark. The on-site image positioning method is to illuminate the light with a wide wavelength band of a light source such as a halogen lamp. The image data of the positioning mark photographed by a CD camera or the like is processed by the image to measure the position of the mark. The laser interference method is a diffraction grid-shaped positioning mark on the wafer W, which irradiates two related beams (cohernetbeam) inclined in a contrast direction in the pitch direction, and irradiates the two diffracted light beams. Interference, the position of the bit mark is measured from its phase. In this system, the LSA method is used. The circulation system C1 is located in the positioning system AL, and the refrigerant circulates the positioning light source for temperature adjustment. For the circulation method, for example, similar to the projection optical system, the light source can also be piped in a spiral shape. In addition, in the positioning system A L, not only a positioning light source but also a housing housing an optical system for positioning may be configured to circulate a refrigerant to perform temperature adjustment. In addition, the off-axis system and the identification on the wafer W through the projection optical system PL are used to pass the grating TTR (Through The Reticle) method or the lens TTL (Through The Lens) method. The casing can also circulate the refrigerant for temperature adjustment. After the circulation system C1, the circulation positioning system AL and the projection optical system PL, the refrigerant system circulates in the upper chamber of the slot 63 in the upper and lower two communicating compartments. On the one hand, the refrigerant of the cooling system C 2 is divided into a path C 3 circulating in the chamber above the tank 63 and a path C 4 to the heat exchanger 70 after the evaporator 63 is cooled. Furthermore, the evaporator 65 is cooled by a refrigerator 7 3 which circulates a gas refrigerant. After cooling, the refrigerant is heat-exchanged in the heat exchanger 70 by the passage C 4

10917pif.ptd Page 23 200305925 V. Description of the invention (18) After use, the chamber circulating in the upper part of the tank 6 3 is cooled again. Below the tank 63, a heater 7 1 controlled by the controller 67 is arranged in the room. The controller 67 is configured to control the driving of the heater 7 1 according to the detection results of the sensors 6 6 and 69. The temperature of the positioning system AL and the projection optical system PL is controlled (managed) at, for example, 23 ° C ± 0 · 01 ° C via a refrigerant. In addition, the first control system 61 circulates the refrigerant whose temperature is adjusted by the heater 71 to each temperature control target at the same flow rate. For the second control system 62, the refrigerant of the cooled second liquid in the heat exchanger 70 is divided into a circulation system C5 and a circulation system C6 after being pumped 74. Among them, the circulation system C 5 is a circular grating machine 2 and the circulation system C 6 is a circular crystal machine 5. In addition, the refrigerant system in the second control system 62 does not circulate in the tank 63 and is configured to circulate in a closed system. For the circulation system C 5, a heater 7 5 is installed downstream of the pump 7 4, and temperature sensors (second detection means) 7 6 a and 7 6 b are also provided. Among them, the temperature sensor 7 6 a is Detects the refrigerant temperature before the grating machine 2 cycle, temperature sensing ^ § 7 6 b is the detection of the refrigerant temperature after the thumb machine 2 cycle is broken ^ The detection results of the temperature sensors 7 6 a, 7 6 b are output于 Controller7 7． The controller 7 7 is a simple average of the detection results of the input temperature sensors 7 6 a, 7 6 b, and controls the driving of the heater 7 5 according to the obtained refrigerant temperature, so that the temperature of the grating machine 2 Controlled (managed) at, for example, 2 3 ° C to 0.1 ° C. Furthermore, in this embodiment, although the structure is configured such that the refrigerant cooled in the heat exchanger 70 is sent to the pump 74 and circulated, when the pressure loss of the heat exchanger 70 is large, it may be configured so that Pump 7 4 is located in heat exchanger 7 0

10917pif ptd Page 24 200305925 V. Description of the invention (19), but the confluence point of the return refrigerant of the circulation system C 5 and C 6 (refrigerant after each cycle 2 and 5) is more upstream than the pump 7 4 The structure of the location. Regarding the arrangement positions of the above temperature sensors 7 6 a and 7 6 b, for any sensor, it is to be as close as possible to the temperature control object (grating machine 2). For a more accurate description, it is the motor for driving the grating machine 2 described later. ) Configuration is appropriate. However, if the configuration is restricted, or the temperature control object cannot be approached due to the magnetic force of the motor, as long as it is not affected by the heat from the outside (place), it can be set to leave the temperature control object to a certain extent. Its location. Regarding the arrangement interval between each sensor and the temperature control object, the arrangement interval between the two sensors is approximately the same (the interval between the sensor 7 6 a and the grating machine 2, and the sensor 7 6 b and the grating machine The interval between the stations 2 should be approximately the same), as long as the configuration of each sensor is not limited within the above range (within the range not affected by external heat). Hereinafter, the temperature control system for the grating machine 2 will be described in more detail. As shown in Fig. 5, the circulatory system C 5 is a cyclic system C7, C7, a cyclic system C8, C8, a cyclic system C9, and a cyclic system C 1 0, which are branched into a plurality of branched flow paths. Among them, the circulation systems C 7 and C 7 are temperature-controllable by the movable elements 2 1 and 21 of each linear Y linear motor 15. Circulation system C 8, C 8 series Each cycle trims the motor 7 2, 7 2 for temperature control. The circulation system C 9 is a loop Y voice coil motor 1 7 Y for temperature control. The circulation system C 1 0 is a circulation X voice coil motor 17 X with temperature control. In each of the circulation systems C 7 to C 1 0, a valve (v a 1 u e) (adjusting means) 80 for adjusting the refrigerant flow rate is provided at an upstream position of each motor. Again, in the circulatory system

10917pi f.ptd Page 25 200305925 V. Description of the invention (20) C7-square, a temperature sensor (the first-temperature detection means) 7 6 a and a temperature sensor (second Temperature detection means) 76b ° Among them, the temperature sensor (first temperature detection means) 1 76 a is used to detect the refrigerant temperature before the movable element 2 1 is circulated. The temperature sensor (second temperature detection means) 7 6 b detects the refrigerant temperature after the movable element 2 1 is circulated. 0 In the circulation system C 6, a heater 7 8 is installed at the downstream position of the pump 7 4 and 1 is installed in parallel. Temperature sensor (first detection means) 7 9 a ', 79b, among which the temperature sensor 7 9 a is used to detect the refrigerant temperature and temperature sensor 7 9 b before it is circulated on the wafer machine 5 The detection results of the refrigerant temperature and temperature sensors 7 9 a and 7 9 b after the cycle are output to the controller ΊΊ Controller 77 is to average the detection results of the input temperature sensors' 79a and 79b based on the obtained refrigerant The temperature is controlled by the heater, the drive of 78, so that the temperature of the wafer machine 5 is controlled (managed) at, for example, 2 3 ° C soil 0.1 ° C 〇 in the circulation system C5, C6 cycle machine 2, 5 The subsequent refrigerants are combined after the heat exchanger is cooled. The positions of the temperature sensors 7 9 a and 7 9 b are the same as those of the temperature sensors 7 6 a and 7 9 b. For any sensor, they should be as close as possible to the temperature control object (wafer machine table 5). For a more accurate explanation, it is appropriate to configure the motor that drives the wafer machine 5). However, if the configuration is restricted by 5 or the magnetic force of the motor cannot reach the temperature control object, it is only required to be protected from external heat. Within the range 丨 (place), it can be set at a position away from the temperature control object. The relationship between the sensors 79a and 79b is 100 million, which is equivalent to that described for the configuration of the sensors 76a and 76b. The content here describes it from

10917pif ptd Page 26 200305925 V. Description of Invention (21) Omitted. Next, the temperature control system for the wafer table 5 will be described in detail. As shown in FIG. 6, the circulatory system C 6 is divided into a cyclic system C 1 1, C 1 1 and a circulatory system 12. Among them, the circulation systems C 1 1 and C 1 1 are the moving elements 3 6 and 3 6 of each of the circulating linear motors 3 3 for temperature control. The circulation system C 1 2 is a circulation X linear motor 3 5 and is temperature-controlled. In each of the circulation systems C 1 1 to C 1 2, at the upstream position of each motor, a valve 8 4 for regulating the refrigerant flow rate is provided. One of the circulation systems C 1 1 is provided with the above-mentioned sensors 7 9 a and 7 9 b. Among them, the sensor 7 9 a detects the refrigerant temperature before the movable element 36 cycles, and the sensor 7 9 b detects the refrigerant temperature after the movable element 36 cycles. Furthermore, the three voice coil motors 8 1 to 8 3 that perform the level adjustment (and focus adjustment) of the wafer machine table 5 (sample table ST) are also provided with circulation systems C 1 3 to C 1 5. Circulation system, each valve upstream of the motor is set to adjust the refrigerant flow valve 8 5, the voice coil motors 8 1 ~ 8 3 drive frequency is less than the linear motor 3 3, 3 5, and the heat generated when driving is also relatively low In a small relationship, these circulation systems C 1 3 to C 1 5 are temperature-controlled by the refrigerant divided by the circulation system C 1 of the first control system 61. It is not limited to the voice coil motors 8 1 to 83, and a circulation system for temperature management of a motor with a small amount of heat during driving (such as the trimming motor 7 2 or X voice coil motor 1 7 X, etc.) can also be used. The refrigerant in the circulation system C 1 of the first control system 61 performs temperature control. Moreover, for the above temperature sensors 66, 69, 76a, 76b, 79a, and 7 9 b, although this embodiment uses an accuracy that can detect ± 0. 0 1 X :, in the second control system 6 2, grating Necessary temperature for machine 2 and wafer machine 5

10917pif.ptd Page 27 200305925 V. Description of the invention (22) The relationship between the control accuracy is ± 0.1 ° C, and the temperature sensors 7 6 a, 7 6 b, 7 9 a, 7 9 b can be used with a basis Temperature sensor with detection capability of this accuracy. The sampling interval (samp 1 ing) measured by the temperature sensor of the temperature sensor, for example, when the control accuracy is strict or when the temperature variation is large, the sampling interval is made shorter, etc., in accordance with the requirements. It is advisable to change the temperature control accuracy of the control target's projection optical system PL, the temperature change amount (heat generation amount) of the machines 2 and 5. In addition, although the arrangement of each temperature sensor is arranged inside the flow path (piping) in this embodiment to directly measure the temperature of the refrigerant, it is also possible to configure the detection section of the temperature sensor to be disposed away from the tube wall surface. The structure (the state where the detection unit is suspended near the center of the cross section of the tube). In this case, the detection portion of the sensor is in a non-contact relationship with the tube wall, and is less likely to be adversely affected by the external environment through the wall surface of the tube. Further, the temperature sensor system may be configured to be replaceable. In this case, an insertion port may be provided in the pipe to form a structure that can be attached and detached through the insertion port or a structure in which the temperature sensor is fixed to the pipe by welding, so that a part of the pipe including the temperature sensor can be replaced. The structure. Furthermore, a structure may be adopted in which a temperature sensor is provided on the outer surface of the tube, and the temperature of the refrigerant is measured through a pipe. In the exposure device 1 configured as described above, a predetermined short-shaped illumination area on the grating R is illuminated by the exposure illumination light from the illumination optical system I U with uniform illumination at the time of exposure. When the raster R scans the illumination area in the Y direction, the crystal circle W scans the exposure area paired with the projection optical system P L to synchronize scanning. Thereby, the illumination light passing through the pattern area of the grating R

10917pif ptd Page 28 200305925 V. Description of the invention (23) The projection optical system P L is reduced to 1/4 times and irradiated onto the wafer W coated with photoresist. Then, in the exposed area on the wafer W, the pattern of the grating R is sequentially transferred, and the entire pattern area on the grating R is transferred to the photographed area on the wafer W in one scan. In the case where the coarse grating stage 16 is moved in the + Y direction, for example, by moving the stator 20 in the -Y direction, the momentum can be saved, and the reaction force accompanying the movement of the coarse grating stage 16 can be cancelled, and it can be prevented. Changes in the position of the center of gravity. At this time, by trimming the action of the motor 27, the coupling between the mover 21 and the stator 20 is resisted, so that the stator 20 can reach a predetermined position. Regarding one of these consecutive exposure processes, heat is generated by the illumination light in the projection optical system PL (absorption by the heat of the illumination light on the projection optical system PL), and heat is generated by the positioning light in the positioning system AL (in While locating the heat absorption of the optical system), the drives of the random tables 2 and 5 generate heat from each motor. For the first control system 6 1, the controller 6 7 sets the conditions for circulating the refrigerant (the first cycle condition) according to the detection results of the temperature sensors 6 6 and 6 9, and controls the heater 7 1 Driven so that the projection optical system PL and the positioning system AL are temperature controlled in the range of ± 0. 1 ° C. The second control system 62 and the controller 7 7 are set based on the detection results of the temperature sensors 7 6 a, 7 6 b, 7 9 a, and 7 9 b. Cycle conditions), by controlling the driving of the heaters 7, 5, 7 so that the grating machine 2 and the wafer machine 5 are temperature-controlled in the range of ± 0.1 ° C. To describe this in detail, first of all, the grating machine 2 and the controller 7 7 simply average the refrigerant temperatures detected by the temperature sensors 7 6 a and 7 6 b.

10917pif.ptd Page 29 200305925 V. Description of the invention (24) Adjust and manage the driving of the heater 75 of the first temperature management unit according to the obtained refrigerant temperature. Here, the temperature sensors 7 6 a and 7 6 b are circulated in the circulatory system C 7 which is circulated in the Y linear motor 15 which has the most driving power and the greatest heat generation, and the other circulatory systems C 8 ~ C. The 10 is temperature controlled based on the circulatory system C7. Therefore, in this embodiment, the correlation between the manufacturing process and the optimum refrigerant flow rate is memorized in advance through experiments or simulations, and the valves 80 of each circulation system C7 to C 1 0 are adjusted for each process based on the stored information.

Here, the heating factors that must be considered by the manufacturing process can be listed in various driving states of the motors 15, 17 X, 17 Y, and 72, that is, the driving amount or speed of each motor, the number of revolutions, and more Other motors are combined to drive the state. Therefore, by using the voice coil motors 1 7X and 1 7 Y with a small amount of heat (or drive), the Y linear motor 15 or the trimming motor 7 2 with a large amount of heat (or drive) is used with a small refrigerant flow. When adjusting the valve 80 with a large amount of refrigerant flow, the temperature can be appropriately controlled according to the output (heat generation) of each motor. Moreover, the method for adjusting the valve 80 can be a method in which each process is adjusted by the operator based on the memorized information or a drive mechanism for the valve 80 is set up by the controller based on the memorized information. 7 7 Adjust the method of this drive mechanism, etc. In addition, the adjustment target of each process is not limited to the flow rate, and the temperature of the refrigerant (temperature set by the heater) can be changed by each process to a set value. Similarly, for the wafer machine 5, the controller 7 7 is a temperature sensor 7 9 a,

10917pi f.ptd Page 30 200305925 V. Description of the invention (25) 7 9 b The temperature of the refrigerant detected is simply averaged, and the drive of the heater 78 of the second temperature management unit is adjusted and managed based on the obtained refrigerant temperature. Here, the temperature sensors 7 9 a and 7 9 b are circulated in the circulatory system C 1 1 which is circulated in the linear motor 3 3 which has the most driving power and the greatest heat generation. Circulation system C 1 1 is used as a reference for temperature control. Therefore, in this embodiment, the relationship between the process and the most suitable refrigerant flow is obtained in advance by experiments or simulations, and the information is memorized based on the stored information. Valve 8 5 of the circulation system C 1 1 and C 1 2. The method of adjusting the valve 8 5 is the same as that of the grating machine 2, and it can be performed manually or automatically. In addition, the relationship between the temperature of the voice coil motors 8 1 to 8 3 provided on the wafer machine 5 is small and the amount of heat generation is controlled by the circulation system C 1 3 to C 1 5 of the first control system 61. In the occasion, the relationship between the process and the most suitable refrigerant flow rate is memorized in advance through experiments or simulations. Based on the stored information, the valves 8 5 of each cycle system C 1 3 ~ C 1 5 of each process are used by the operator. Manual adjustment or flow adjustment by the automatic adjustment of the controller 67. As such, in this embodiment, the temperature range when the refrigerant temperature is set by the first control system 61 and the second control system 62 has a relationship of different setting capabilities, and the projection optical system PL having a different temperature control accuracy required by them It is also possible to control and manage the temperature independently of the machines 2 and 5, and the most suitable cooling conditions can be set according to the heat output of each machine. Therefore, it is possible to suppress the baseline variation that occurs when the temperature is not sufficiently controlled, and to suppress the deterioration of the overlapping accuracy.

10917pif.ptd Page 31 200305925 V. Description of the Invention (26) In this embodiment, the grating machine 2 and the wafer machine 5 are not all the motors, but the motor with the largest amount of heat is measured to measure the refrigerant temperature. Based on the refrigerant temperature as a reference, the temperature of the circulation system of other motors is controlled. It is not necessary to install a temperature sensor in each motor, and the device can be miniaturized and reduced in price. However, the refrigerant flowing through the motors provided in the grating table 2 and the wafer table 5 is temperature controlled by the same second control system 62. The relationship between management, the temperature of the inlet side of the refrigerant of each motor (refrigerant temperature before circulating each motor) is the same temperature without being affected by the motor, but the temperature of the outlet side of the refrigerant of each motor (after passing through each motor) Refrigerant temperature) is different for each motor according to the degree of heating of each motor. Therefore, when the average temperature of the refrigerant circulating in each motor (the average temperature of the refrigerant at the inlet side and the outlet side of the motor) is set to a certain desired value for any motor, the refrigerant temperature at the outlet side of each motor is Both need to be controlled to a certain value. Therefore, for more accurate temperature control, a temperature sensor (3 temperature sensor on the outlet side) that measures the temperature of the refrigerant at least on the outlet side of each motor (a temperature sensor that measures the temperature on the inlet side is provided as a representative pair) There is only one motor with the largest amount of heat). In order to keep the outlet temperature of the refrigerant in each motor to a fixed value, the refrigerant flow rate circulating in each motor can be adjusted by the valve corresponding to each motor. When setting this flow rate, it is in a state where the machine is driven (ru η ning) in advance as strictly as possible under strict exposure conditions (such as the conditions of a large number of exposure shots and a large number of machine actions), or, according to the used The typical exposure conditions (machine driving state) are under the state when the machine is driven so that the upper

10917pif ptd Page 32 200305925 V. Description of the invention (27) The way in which the outlet temperature becomes a certain value, it is appropriate to set the refrigerant flow rate circulating in each motor. In addition, as long as space or price allowable, a temperature sensor for measuring the temperature of the refrigerant at the inlet side of the motor may be provided for each motor. Moreover, as shown in FIG. 7, the micro-elements such as the semiconductor element pass through the stage 2 01 of designing the function and performance of the two micro-pieces. Based on this design stage, the stage R 2 2 of the grating R is manufactured from silicon material. In the stage 2 of wafer W, the projection exposure device 1 of the above embodiment is used to project and expose the pattern of the grating R onto the wafer W, and the exposure processing stage of developing the wafer W is stage 204. The component assembly stage (including cutting (Manufacturing process, combination process, assembly process) 205, inspection stage 206 and so on. In addition, although the foregoing embodiment is configured to memorize the relationship between the manufacturing process and the most suitable refrigerant flow rate in advance, and then adjust the structure of the valves of each circulatory system in each process based on the stored information, this method is other than this method For example, it is also possible to set a temperature sensor for each of the motors, and set a calculation method for calculating the heat generation ratio between the plurality of motors, and adjust the refrigerant flow rate circulated in the motor according to the heat generation ratio calculated based on the detected refrigerant temperature. . Fig. 8 shows a second embodiment of the exposure apparatus of the present invention. Here, the same components as those in the first embodiment shown in Figs. 1 to 7 are assigned the same reference numerals, and the description and illustration thereof are simplified. As shown in FIG. 8, in this embodiment, the circulation system C 1 of the first control system 61 uses the projection optical system and the positioning system (that is, the level adjustment system of the wafer machine 5 described above) as the temperature control. Object by the second control system

10917pif.ptd Page 33 200305925 V. Description of the invention (28) The circulation system C 5 of 2 uses the grating machine 2 as the temperature control object, and it is set independently from the first and second control systems 6 1 and 6 2 The circulation system C 6 of the third control system 8 6 uses the wafer machine 5 as a temperature control object. Furthermore, in Fig. 8, those having the same functions as the evaporator 65 and the heater 71 shown in Fig. 4 are simplified by a temperature regulator 87. Similarly, those having the same functions as the heat exchanger 70, the heaters 7, 5 and 7 8 shown in Fig. 4 are schematically illustrated by the temperature regulators 8 8 and 8 9. In addition, in Fig. 4, the machines 2 and 5 are respectively provided with two temperature sensors 76a, 76b, and 79a, 79b. In Fig. 8, the temperature sensors 76, 79 are represented as a representative. Regarding the temperature sensors 7 6 and 7 9, as in the first embodiment described above, the control system can also select the maximum heating value of each control system among the plurality of motors controlled by the second control system 6 2 and the third control system 86. For each of the selected motors, a temperature sensor is provided for each of the selected motors (two locations on the inlet side and the outlet side of each motor), and the same refrigerant temperature control as described in the first embodiment is performed based on these temperature sensors. . In addition, as described in the modification of the first embodiment, a plurality of motors whose temperature is controlled in the second control system 62 and a plurality of motors whose temperature is controlled in the third control system 86 may be respectively provided at the outlet. A temperature sensor is installed on the side (one for each control system is set on the representative motor) so that the temperature on the outlet side is controlled to a certain value (the second control system 6 2 is set on the grating The temperature at the outlet side of the refrigerant circulated by the motors of the machine 2 is a fixed value, and the third control system 86 is to set the temperature at the outlet side of the refrigerant circulated by the motors provided in the wafer table 5 to a fixed value). Each valve adjusts the flow of refrigerant flowing through each motor.

10917pif ptd Page 34 200305925 V. Description of the invention (29) For this embodiment, the first control system 61 is detected by the temperature sensor 69 of the third detection means, and the temperature of the refrigerant in the projection optical system PL cycle is detected and controlled. The device 6 7 sets the cycle condition of the refrigerant (the third cycle condition) based on the detection result. By controlling the drive of the temperature regulator 8 7, the temperature of the projection optical system PL is managed at ± 0. 0 1 ° The range of C. In the second control system 62, the temperature of the refrigerant circulating in the grating machine 2 is detected by the temperature sensor 76, and the controller 7 7 controls the drive of the temperature regulator 88 according to the detection result. The temperature of the grating machine 2 was controlled at ± 0.1 ° C. Similarly, in the third control system 86, the temperature of the refrigerant circulating in the wafer machine 5 is detected by the temperature sensor 79, and the controller 90 controls the temperature regulator 8 based on the detection result. The drive of 9 enables the temperature of the wafer machine 5 to be controlled within the range of ± 0.1 ° C. In this way, in this embodiment, the same functions and effects as those in the first embodiment can be obtained. In addition, the control systems 6 1, 6, 2, and 8 6 independently make the projection optical system PL, the grating table 2, and the crystal The circular machine table 5 is temperature-controlled, and can implement high-precision temperature management according to the amount of heat generated by each control target. Fig. 9 shows a third embodiment of the exposure apparatus according to the present invention. In this embodiment, the first control system 61 uses the projection optical system PL and the wafer machine 5 as temperature control objects, and the second control system 62 uses the grating machine 2 as temperature control objects. The first control system 61 is configured to control the temperature of the circulation system C1 in the projection optical system PL and the system AL cycle and the circulation system C6 in the wafer machine 5 by a set of temperature regulators 87. this

10917pif ptd Page 35 200305925 V. Description of the invention (30) The temperature control system uses a temperature sensor 6 9 to detect the temperature of the refrigerant in the PL cycle of the projection optical system, and the controller 6 7 controls the temperature regulator 8 7 according to the detection result. To drive implementation. In this case, similar to the projection optical system P L, the wafer machine 5 is temperature-controlled in the range of ± 0 · 0 1 ° C. Furthermore, in the second control system 62, the grating machine 2 is independently controlled from the first control system with a temperature of ± 0.1 ° C. In this embodiment, it is also possible to independently control the temperature of the grating machine 2 with the largest heat generation, the projection optical system PL and the wafer machine 5 with a small heat generation, and set the most suitable according to the heat generation of each machine. Cooling conditions. Moreover, when compared with the second embodiment, the relationship between the refrigerant temperatures of the two circulation systems C1 and C6 can be controlled by the first control system 61, and the device structure can be simplified. FIG. 10 shows a fourth embodiment of the exposure apparatus of the present invention. Moreover, only the temperature control system of the grating machine 2 is illustrated here. As shown in FIG. 10, the second control system 62 is an embodiment including the temperature sensor 7 6, the controller 7 7, and the temperature regulator 8 8 shown in FIG. 8 and FIG. The sensors 9 1, 9 2 and the Peltier element 9 3 of the second regulator. The Peltier element 9 3 is located closer to the grating table 2 than the temperature regulator 8 8 and is driven by a controller 7 7. The temperature sensors 91 are on the upstream side of the Peltier element 93, and the temperature sensors 9 2 are on the downstream side of the Peltier element 93, each of which is arranged, and the temperature sensors 9 1 and 9 2 detect The refrigerant temperature is output to the controller 7 7. The controller 7 7 is based on the temperature detection result of the temperature sensor 76, and controls the driving of the temperature regulator 8 8 at the same time as the temperature sensor 9 1,

10917pif.ptd Page 36 200305925 V. Description of the invention (31) 9 The temperature detection result to control the structure of the ear element is the same as the second and third embodiments described above, and the controller 7 7 series The refrigerant temperature of the circulation system C 5 is supercooled to the temperature by 4. However, the controller 7 7 raises the Peltier element 93 to a predetermined temperature based on the temperature-sensing refrigerant temperature. In this embodiment, when the grating machine 2 is driven, the rapid temperature change of the machine by circulating the supercooled refrigerant at a constant temperature can also be tolerated. The refrigerant is heated by the temperature regulator 88 and the heating member 93. The structure can also be used in the case of heating the refrigerant with the temperature of the 'Peltier element 9 3', but the heating element 9 3 can also be used. Next, the exposure device of the present invention will be described. The third embodiment of the system 6 shown in FIG. 9 is driven by the controller 6 7 according to the temperature sensor 68 of the temperature sensor 6 9 and controlled in the second control system based on the detection result of the temperature sensor 76. Structure, in this embodiment, this isotherm is not set. According to the data on exposure processing (exposure processing), the heat generated by the driving of the wafer machine 5 is calculated. Drive. Others. S-type temperature regulator 8 8, the lower than the predetermined temperature of the reactors 9 1, 9 2 are detected to energize, even if the refrigerant produces an extreme temperature, the temperature can be controlled easily. Still, and cool down, The Peltier element regulator 88 has an over-added structure. In addition, a subcooler is used instead of the Peltier element 5 in a fifth embodiment. The control result 62 is constituted by the controller 77 depending on the temperature. The drive sensor 6 9, 7 6, Γ method of the regulator 8 8) is driven by the controller 6 7 ^ according to the calculated node 8 7. with

200305925 V. Description of the invention (32) Similarly, in the second control system 62, the controller 7 7 calculates the heat generated by the driving of the grating machine 2 based on the exposure data, and sets the refrigerant temperature based on the calculated heat. The drive of the temperature regulator 88 is controlled. The specific control method is, for example, an operator (user) selects a process program on the OA panel, and calculates the required power and heat generation on the calculation circuit from the selected program information and the information registered in the exposure data. , To control the drive of the temperature regulator 8 7, 8 8. In this embodiment, there is no need to provide a temperature detecting means such as a temperature sensor, which contributes to the miniaturization and cost reduction of the device. In addition, the ratio of the driving voltage to the motor and the amount of heat generation (temperature change) to each motor can be individually calculated, and the flow rate can be adjusted according to the ratio of the driving voltage. In addition, in each of the above-mentioned embodiments, the structure for controlling the temperature of the control object by adjusting the refrigerant flow rate is not limited to this, as long as it includes at least one of the temperature, flow rate, and flow rate of the refrigerant. Also, in the above-mentioned embodiment, although a part of the structure is configured to share a temperature regulator or a refrigerant-driven pump, each control object (circulation system) may be individually separated and shared by all the circulation systems. Various constituent structures. For example, if both the cooler and the heater are provided, the heater may be shared, and each control target may be provided with a cooler. In this case, the final temperature adjustment is performed by a cooler. In each of the above-mentioned embodiments, a structure in which the refrigerant temperature before the cycle of the machines 2 and 5 and the refrigerant temperature after the cycle are simply averaged may be used, but a weighted average may be used. The method of weighted averaging is as follows.

10917pif.ptd Page 38 200305925 V. Description of the invention (33) (1) The distance from the heat source such as the motor to the installation position of the temperature sensor on the inlet side is different from the distance from the heat source to the installation position of the temperature sensor on the outlet side In this case, the closer the temperature sensor is, the greater the weight of the detection result is, etc., and the weight is based on the distance. (2) Where the materials near the heat source inlet of the motor and the materials near the exit are different, the material is weighted by the thermal conductivity, etc. (the greater the heat absorption ratio (the larger the thermal conductivity), the larger the material weight). (3) Where other heat sources exist near the entrance or near the exit, weighting shall be based on the presence or heat generation of other heat sources. For example, when there are other heat sources in the flow path, the weight of the temperature sensor output closer to the other heat sources becomes larger. Also, where there are other heat sources outside the flow path, the heat of other heat sources will be transmitted to the relationship of the temperature sensor through the air, making the weight of the temperature sensor output closer to other heat sources larger. (4) During baseline measurement, the detection temperature of the inlet-side temperature sensor, the detection temperature of the outlet-side temperature sensor, the control temperature of the refrigerant (the control temperature calculated by a simple average), and the measured baseline amount ( Or the amount of change in the baseline amount) is memorized in groups. This memory action is repeated every time the baseline is measured. Then, based on the accumulated plural data sets, the degree of weighting at either the inlet-side temperature or the outlet-side temperature is estimated to reduce the baseline variation. However, a weighted average is performed based on the extrapolated weights. In the above-mentioned embodiment, although the structure using the same type of refrigerant (H F E) is used, different refrigerants can be used in each circulation system according to the temperature control accuracy or installation environment required by each circulation system.

10917pif ptd Page 39 200305925 V. Description of the Invention (34) In the above-mentioned embodiment, although the structure is configured to control the temperature of a refrigerant that is circulated in one direction by a temperature control object (motor, etc.), the invention is not limited In this case, a structure in which temperature is adjusted by using a refrigerant circulating in a plurality of directions may be adopted. For example, as shown in FIG. 1A, the control object 2 1 (in this example, a moving element 2 1 using a Y linear motor 15 is described), a circulation system C 7 a with two different circulation directions And C 7 b are piping, and the circulation systems C 7 a and C 7 b circulate the refrigerant from the reciprocal direction (between the two circulation systems, the inlet side and the outlet side of the refrigerant are reversed). When configured in this way, the temperature gradient that may occur in the control target 21 (which occurs between the inlet side and the outlet side of a circulation system) in the case where only one circulation system is provided can be eliminated, and the temperature gradient can be made higher. Accuracy and correct temperature adjustment. In addition, as shown in FIG. 1B or FIG. 1C, the temperature adjustment unit (flow path, piping) is subdivided, and the temperature can be controlled by the control object, so that the control object can be made inactive. State of temperature gradient. In Figure 1 1B, as shown in the figure, three different circulation systems (flow channels, piping) C 7 c, C 7 d, and C 7 e are arranged for the control object 2 1 to circulate the refrigerant in each circulation system. The direction of the arrow in the figure. In Fig. 1 1C, as shown in the figure, four different circulation systems (flow paths, piping) C 7 f, C 7 g, C 7 h, and C 7 i are provided for the control object 2 1 system. In each circulation system, the refrigerant is circulated in the direction of the arrow in the figure. When the temperature adjustment structure is subdivided in this way, the temperature gradient on the control object can also be eliminated. Moreover, the circulatory systems C7c and C7e shown in Fig. 11B, or Fig. 11C

10917pif.ptd Page 40 200305925 V. Description of the invention (35) Circulation systems C7f and C7h, or C7g and C7i, in the circulation system of the object configuration, from the perspective of eliminating the temperature gradient, the direction of the refrigerant circulation is shown in the figure. The opposite direction is appropriate. In addition, the examples in Figs. 1 A to 1 1 C are structures in which temperature sensors 7 6 a and 7 6 b are provided on the inlet and outlet sides of each of the circulation systems C 7 a to C 7 I. The temperature sensor may be provided for only one circulation system, or the temperature sensor may be provided only at the outlet side of each circulation system. These temperature sensors are used in the same manner as the above embodiments. The configurations shown in Figures 1 1 A to 1 1 C are particularly effective when the control target is large (longer) or when the control target's heat generation (driving amount) is large. An example of such a control object is a movable element 2 1 of a Y linear motor 15 (a motor driven in a scanning direction) of a grating rough stage 16 or a fixed character 20 extending in the Y direction, or a wafer The moving element 36 or the stator 37 of the linear motor 33 of the machine is specialized. In addition, the components in the diagrams iiA to iic are specially designed for the control target in the state where no temperature gradient is required. # 力 文 ^. An example of such a control object is a driving source (for example, a voice coil motor 8 1 to 8 3 or a grating micro-motion drag 17 7) arranged on a wafer or a grating. Applicable parts of the structures in Figures 1 A to 1C and the accent coils are described as long as the structure shown in the nmc chart is desired if no temperature gradient is desired. Brother's use of the substrate of this embodiment is not only a semi-conductor _ conductor wafer W, but also can be used for the address of the liquid crystal display element 1 ~ ^ thousand ~ Po 螭 substrate, or the old film magnetic head Ceramic wafers, or negatives (synthetic stone cores, silicon wafers), etc., obtained in a mask or reticle in an exposure device.

200305925 V. Description of the invention (36) The exposure device 1 is a scanning type exposure device (scanning · stepper; USP 5,473,410) of a step-and-scan method in which the grating R and the wafer W are moved in synchronization to scan and expose the pattern of the grating R. In addition, it can also be applied to a projection exposure device (stepper) in a step-and-repeat mode in which the grating R and the wafer W are exposed at a static state, and the wafer W is moved step by step. The type is not limited to an exposure device for manufacturing a semiconductor element that exposes a semiconductor element pattern to a wafer W. It can also be widely applied to an exposure device for manufacturing a liquid crystal display element or to manufacture a thin-film magnetic head, an imaging device (CCD), or a grating. Exposure equipment, etc. In addition, for the light source of exposure illumination light, not only the g-line (4 3 6 nm), h-line (4 0, 4 7 nm), i-line (3 6 5 nm), krF excimer laser (248mm), ArF excimer laser (193nm), F2 laser (157nm), X-rays or electron beams can also be used. For example, in the case of using an electron beam, a lanthanum hexaboride (LaB6) and a button (t a n t a 1 m, T a) of thermionic emission type can be used. In addition, when an electronic wire is used, a configuration using a grating R may be used, or a configuration in which a pattern is directly formed on a wafer without using the grating R may be used. Also, high frequencies such as YANG lasers and semiconductor lasers can be used. The magnification of the projection optical system PL is not limited to a magnification such as a reduction system and an expansion system. When the projection optical system uses far-ultraviolet light such as excimer laser, the glass material is made of quartz or fluorite, which allows far-ultraviolet light to pass through. When the F 2 laser or X-ray is used, the optical system is reflective.

10917pif.ptd Page 42 200305925 V. Description of the invention (37) Refraction system or refractive system (where the grating R also uses reflective plastic and electronic wires) The optical system can be an electronic optical system composed of an electronic lens and a deflector. Moreover, the optical path through which the electronic wire passes does not need to be a vacuum. Furthermore, a projection optical system can also be used, and a proximity exposure device for exposing the pattern of the grating R to the wafer R by closely contacting the grating R can be used. Where a linear motor (see US5, 623, 853 or US5, 528, 118) is used for the wafer table 5 or the grating table 2, any of the air-floating type and the magnetic-floating type can be used. Among them, the air-floating type is used Air bearing, magnetic levitation type uses Lorentz force or yeactance force. Moreover, each machine 2 and 5 series can be moved along the guide, or it can be provided without guide. There is no guide type. The driving mechanism of each machine 2 and 5 can use the magnet part magnet) and the armature part. The other parts of the magnet part and electrode part that drive each machine 25 by electromagnetic force are as above. Move Face side (base (b a s e)). ',, 0, and in the application specifically described in this application', the exposure device 1 of the embodiment of the case is made up of assembly components, components, components, etc. which can be maintained by Mingqianwei with assembly accuracy, electrical accuracy, Optical accuracy 4; Adding an optical system, these various accuracy, before and after assembly, become the precision of mechanical accuracy; = system into electric precision € ί, the magnet components are arranged in two dimensions magnets, armature With _gu, machine: 2 types, magnet parts and electric drag parts on machine 2,

10917pif.ptd Page 43 200305925 V. Explanation of the invention (38) Degree adjustment. The process of assembling exposure devices from various subsystems includes the interconnection of each subsystem, mechanical connection, wiring connection of circuits, piping connection of pneumatic lines, and so on. Before the process of assembling an exposure device from various subsystems, there are individual assembling processes for each subsystem. After the assembly process of the exposure devices of various subsystems is completed, comprehensive adjustments are performed to ensure the accuracy of the entire exposure device. In addition, it is preferable to manufacture the exposure device in a clean room that manages temperature and cleanliness. Although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and retouching without departing from the spirit and scope of the present invention. The scope of protection of the invention shall be determined by the scope of the attached patent application.

10917pif.ptd Page 44 200305925 Brief description of the drawings Brief description of the drawings Fig. 1 is a schematic structural diagram of an exposure apparatus of the present invention. Fig. 2 is a perspective view showing the appearance of a grating table constituting the exposure apparatus of the present invention. Fig. 3 is an external perspective view of a wafer machine constituting the exposure apparatus of the present invention. Fig. 4 is a diagram showing a temperature control system for the entire exposure apparatus according to the first embodiment. Fig. 5 is a diagram showing the temperature control system of the grating machine. FIG. 6 is a diagram showing a temperature control system for a wafer machine. FIG. 7 is a flowchart showing an example of a manufacturing process of a semiconductor element. Fig. 8 is a schematic diagram showing a temperature control system for the entire exposure apparatus according to the second embodiment. Fig. 9 is a schematic diagram showing a temperature control system for the entire exposure apparatus according to the third embodiment. Fig. 10 is a schematic diagram showing a temperature control system of a grating machine according to the fourth embodiment. Figures 1 1 A to 1 C are diagrams showing modifications of the present invention. Description of the drawing labels: C 7 ~ C 1 0 Circulation system R Grating (photomask) W Wafer (substrate) PL Projection optical system 1 Exposure device

10917pif.ptd Page 45 200305925 Brief description of drawings 2 Grating machine (mask machine) 5 Wafer machine (substrate machine) 1 5 Y linear motor (drive source) 1 7 XX voice coil motor (drive source) 1 7 YY voice coil motor (driving source) 3 3 linear motor (driving source) 3 5 X linear motor (driving source) 6 1 first control system 6 2 second control system 6 9 temperature sensor (third detection means) 7 2 Trimming motor (drive source) 76a Temperature sensor (second detection means, first temperature detection means, first sensor) 76b Temperature sensor (second detection means, second temperature detection means, second sensor) 77 controller (first temperature management unit, second temperature management unit) 7 9 a, 7 9 b temperature sensor (first detection means) 80 valve (adjustment means) 86 third control system 88 temperature regulator (first Regulator) 93 Peltier element

10917pif.ptd Page 46

Claims (1)

200305925 VI. Application Patent Scope 1. An exposure device is an exposure device that projects a pattern image of a grating held on a grating abutment onto a substrate held on a substrate machine via a projection optical system. It is characterized in that it includes: a first control system that sets a temperature of a first liquid and simultaneously sets the first liquid that sets the temperature to an object on at least one of the projection optical system and the substrate machine Cycle to control a temperature of the object; and a second control system that is independent of the first control system to set a temperature of a second liquid, the second liquid that sets the temperature is applied to the grating machine Cycle to control a temperature of the grating machine; wherein the first and the second control systems have mutually different setting capabilities for a temperature range of the temperature at which the liquid is set. 2 · The exposure device as described in item 1 of the scope of the patent application, the substrate system of the object system, characterized in that: the first control system calculates a quantity of heat generated by the driving of the substrate machine, and The calculated heat amount is used to set the temperature of the first liquid; and the second control system calculates a heat amount generated by the driving of the grating machine, and sets the first heat amount based on the calculated heat amount. This temperature of two liquids. 3. The exposure device according to item 1 or item 2 of the patent application scope, comprising: a first detection means, wherein the temperature of the first liquid on each inspection side before the object circulates and the temperature of the first liquid The temperature of the first liquid after the object circulates 10917pi f.ptd page 47 200305925 VI. Patent application scope; and a second detection means, the temperature of the second liquid on each inspection side before the grating machine is circulated and the temperature of the second liquid after the grating machine is circulated The temperature; wherein the first control system sets the temperature of the first liquid according to a detection result of one of the first detection means; the second control system sets the brother according to a detection result of one of the second detection means This temperature of two liquids. 4 · The exposure device described in item 1 or 2 of the scope of patent application, the grating machine has a plurality of driving sources, characterized in that: the second control system is based on the plurality of driving on the grating machine In the source, the temperature of the second liquid is set with respect to the calorific information of a predetermined driving source at one of the largest calorific values. 5. The exposure apparatus according to item 4 of the scope of patent application, wherein the second control system includes: a plurality of branched flow paths for setting the second liquid at the temperature to each of the plurality of driving sources. Circulation; and plural adjusting means, which adjust the flow rate of the second liquid supplied to each of the driving sources while the second liquid provided on the plural branched flow paths is supplied to each of the plural driving sources. . 6. The exposure device according to item 5 of the scope of patent application, characterized in that: the second control system is further provided with a calculation means for calculating a calorific value ratio between the plurality of driving sources; and the plurality of adjustment means It is adjusted according to the calculated calorific value ratio. 10917pif.ptd Page 48 200305925 6. Scope of patent application The flow rate of the second liquid that each of the plural driving sources circulates. 7. The exposure device according to item 4 of the scope of patent application, characterized in that it comprises: a first temperature detecting means, which is arranged near the predetermined driving source, and detects the first driving source before the predetermined driving source is cycled. The temperature of the two liquids; and a second temperature detecting means arranged near the predetermined driving source to detect the temperature of the second liquid after the predetermined driving source circulates; wherein the second control system is based on the The detection result of one of the first and the second detection means is used to set the temperature of the second liquid. 8. The exposure device according to item 1 or item 2 of the scope of patent application, the first control system uses at least the projection optical system as a control object, and further includes: a third control system, With the first and the second control systems, a temperature of a third liquid is set independently, and the third liquid set at the temperature is circulated to the substrate machine to control a temperature of the substrate machine. 9. The exposure device according to item 1 or item 2 of the scope of patent application, wherein the first control system takes two of the projection optical system and the substrate machine as control objects. 1 0. An exposure device is an exposure device that projects a pattern image of a grating held on a grating base to a substrate held on a substrate via a projection optical system, characterized in that ,include: l〇917pif.ptd Page 49 200305925 6. The scope of patent application-a first control system is a first when setting an object of at least one of the projection optical system and the substrate base to circulate a first liquid At the same time as the circulation conditions, the first liquid is circulated under the first circulation conditions to control a temperature of the object; a second control system is set independently of the first circulation conditions to the grating machine When a second liquid is circulated under a second circulation condition, the second liquid is circulated under the second circulation condition to control a temperature of the grating machine; a first detection means is each Detecting a temperature of the first liquid before the object circulates and a temperature of the first liquid after the object circulates; and a second detection means each detecting the first liquid before the grating machine circulates. A temperature of the two liquids and a temperature of the second liquid after the grating machine circulates; wherein the first control system is based on a detection result of one of the first detection means. The first cycle condition is set. The second control system sets the second cycle condition according to a detection result of one of the second detection means. 1 1. The exposure device according to item 10 of the scope of patent application, characterized in that: the first circulation condition is a temperature, a flow rate, a temperature of the first liquid that is set before the object is circulated, A flow rate includes at least one; and the second circulation condition is such that the second liquid is circulated before the grating machine is circulated. 10917pif.ptd Page 50 200305925 6. Scope of patent application The temperature, speed, and flow rate of the second liquid shall be at least one. 1 2. According to the exposure device described in item 10 or item 11 of the patent application scope, the grating machine has a plurality of driving sources, wherein the second detection means includes: a first sensor, a Among the plurality of plural driving sources provided on the grating machine, the vicinity of a predetermined driving source having the greatest heat generation, and detecting the temperature of the second liquid before the predetermined driving source is circulated; and a second sensor Is located near the predetermined driving source, and detects the temperature of the second liquid after circulating the predetermined driving source. 1 3. The exposure device according to item 12 of the scope of patent application, wherein the second control system includes: a plurality of branched flow paths, the second liquid for setting the temperature to each of the plurality of driving sources Circulate; and a plurality of adjusting means for adjusting a position of the second liquid supplied to each of the plurality of driving sources while the second liquid provided on the plurality of branching flow paths is supplied to each of the plurality of driving sources. flow. 14. The exposure device according to item 13 of the scope of patent application, wherein: the second control system further has a calculation means for calculating a calorific value ratio between the plurality of driving sources; and The plural adjusting means is the flow rate of the second liquid which is circulated to each of the plural driving sources according to the calculated calorific value ratio. 15. The exposure device as described in item 10 or item 11 of the scope of patent application 10917pif ptd Page 51 200305925 6. The scope of the patent application, the first control system is at least the substrate machine as a control object, characterized in that it further includes: a third control system, related to the first and the The second control system independently sets a third circulation condition when the projection optical system circulates a third liquid, and the third liquid is circulated under the third circulation condition to control the projection optics. A temperature of the system; and a third detection means for detecting a temperature of the third liquid before the projection optical system circulates; wherein the third control system is based on a detection result of one of the third detection means, This third cycle condition is set. 16. An exposure device is an exposure device that projects a pattern image of a grating held on a grating base to a substrate held on a substrate machine via a projection optical system. The grating machine Each of the stage and the substrate machine has a plurality of driving sources, which is characterized in that it includes: a first control system connected between the plurality of driving sources and the projection optical system, so that a heating value or a temperature change amount is between A first quantity or less is used as a first control object for temperature control; and a second control system is included in the plurality of driving sources and the projection optical system, so that the amount of heat generation or the temperature change is larger than The larger of the first quantity is a second control object and the first control system for independent temperature control. 1 7. The exposure device according to item 16 of the scope of patent application, characterized in that: the first control system is set to make a first liquid control the first control 10917pif.ptd Page 52 200305925 VI. At the same time as a first circulation condition when the subject of patent application is circulated, the first liquid is circulated under the first circulation condition to control a temperature of the first control object ; And the second control system, while setting a second circulation condition when a second liquid circulates the second control object, the second liquid is circulated under the second circulation condition to Control a temperature of the second control object. 18. The exposure device according to item 17 of the scope of patent application, wherein: the first circulation condition is a temperature, a temperature of the first liquid set by the first liquid before the object is circulated, a At least one of speed and a flow rate; and the second circulation condition includes at least one of a temperature, a speed, and a flow rate of the second liquid set before the second liquid is circulated by the grating machine. One. 19. The exposure device according to item 17 or item 18 in the scope of patent application, further comprising: a first detection means, which is provided on a plurality of control objects included in the first control object In the vicinity of one of the control objects with the greatest amount of heat or temperature change, a temperature of the first liquid is measured; and a second detection means is provided in the plurality of control objects included in the second control object. The temperature of the second liquid is measured near or near the control object that has the greatest amount of heat or temperature change; wherein the first and second control systems are based on the first and the first 10917pif.ptd Page 53 200305925 VI. Scope of patent application 6. The detection result of one of the two detection means is used to set the first and second cycle conditions. 20. The exposure device according to any one of the claims 16 to 18, wherein the first control object includes the projection optical system and is disposed on the substrate. A part of the drive source of the machine; and the second control object includes a plurality of drive sources provided on the grating machine. 2 1 · The exposure device as described in any one of claims 16 to 18, the second control object includes a plurality of driving sources provided on the grating machine and The plurality of driving sources of the substrate machine are characterized in that the second control system includes: a first temperature management unit for managing a temperature of the plurality of driving sources provided on the grating machine; and a second temperature The management unit is independent of the first temperature management unit to manage a temperature of the plurality of driving sources provided on the substrate machine. 2 2. The exposure device according to item 4 of the scope of patent application, wherein the first control system is based on the temperature of the first liquid before the control object is circulated, and is applied to the control object. The average temperature of the temperature of the first liquid after circulation is set; and the second control system is based on the temperature of the second liquid before the grating machine is circulated and after the grating machine is circulated The setting is performed by an average temperature of the temperature of the second liquid. 10917pif.ptd Page 54 200305925 6. Application for Patent Scope 2 3. The exposure device described in item 10 of the patent application scope is characterized by: The first control system is based on the before the control object is cycled. The setting of the temperature of the first liquid and an average temperature of the temperature of the first liquid after the control object is circulated; and the second control system is based on the first temperature before the grating machine is circulated. The setting is performed by the average temperature of the two liquids and the average temperature of the second liquid after the grating machine circulates. 24. The exposure device according to item 19 of the scope of patent application, wherein the first control system is based on the temperature of the first liquid before the control object is circulated, and is applied to the control object. The average temperature of the temperature of the first liquid after circulation is set; and the second control system is based on the temperature of the second liquid before the grating machine is circulated and after the grating machine is circulated The setting is performed by an average temperature of the temperature of the second liquid. 2 5 · The exposure device according to any one of claims 1, 2, 10, 11 and 16 to 18, characterized in that the Two control systems include: a first regulator that supercools or overheats the temperature of the second liquid than a predetermined temperature; and a second regulator that is disposed more than the first regulator Near the grating machine, the temperature of the second liquid whose temperature is set by the first regulator is adjusted to the predetermined temperature. 〇917pif ptd Page 55 200305925 VI. Scope of patent application 26. If the scope of patent application is 1 of item 2, item 10, item 11, item 16 to item 18 The exposure apparatus described above is characterized in that it uses liquids of the same kind in different systems for temperature control. 2 7 · The exposure device according to any one of items 1, 2, 10, 11 and 16 to 18 in the scope of patent application, characterized in that the At least one of a control system and the second control system has a plurality of circulation paths when the liquid circulates a control object. 28. The exposure device according to item 27 in the scope of the patent application, characterized in that the directions of the refrigerant to each of the plurality of paths in the direction of the control object are different from each other. 2 9. A device manufacturing method, characterized in that the device manufacturing method includes the use of an exposure device described in any one of the patent applications ranging from item 1 to item 28, which will be formed on one of the gratings The process of pattern transfer on the substrate. 10917pif.ptd Page 56