TR23240A - Mini-chip tasiyici yarikli dizi - Google Patents

Mini-chip tasiyici yarikli dizi

Info

Publication number
TR23240A
TR23240A TR194/86A TR19486A TR23240A TR 23240 A TR23240 A TR 23240A TR 194/86 A TR194/86 A TR 194/86A TR 19486 A TR19486 A TR 19486A TR 23240 A TR23240 A TR 23240A
Authority
TR
Turkey
Prior art keywords
knee
mini
chip carrier
carrier instant
instant
Prior art date
Application number
TR194/86A
Other languages
English (en)
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of TR23240A publication Critical patent/TR23240A/tr

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4846Leads on or in insulating or insulated substrates, e.g. metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
TR194/86A 1985-04-12 1986-04-11 Mini-chip tasiyici yarikli dizi TR23240A (tr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US72264485A 1985-04-12 1985-04-12

Publications (1)

Publication Number Publication Date
TR23240A true TR23240A (tr) 1989-07-21

Family

ID=24902742

Family Applications (1)

Application Number Title Priority Date Filing Date
TR194/86A TR23240A (tr) 1985-04-12 1986-04-11 Mini-chip tasiyici yarikli dizi

Country Status (8)

Country Link
EP (1) EP0225333B1 (tr)
JP (1) JPS62502157A (tr)
DE (1) DE3671575D1 (tr)
ES (2) ES8801477A1 (tr)
GR (2) GR860795B (tr)
IL (1) IL78192A (tr)
TR (1) TR23240A (tr)
WO (1) WO1986006212A1 (tr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2223354B (en) * 1988-09-30 1992-10-14 Marconi Electronic Devices Semiconductor devices

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3926746A (en) * 1973-10-04 1975-12-16 Minnesota Mining & Mfg Electrical interconnection for metallized ceramic arrays
DE3103454A1 (de) * 1981-02-02 1982-08-26 Vdo Adolf Schindling Ag, 6000 Frankfurt Systemtraegerband mit mehreren systemtraegern fuer integrierte schaltkreise
FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice
FR2538618B1 (fr) * 1982-12-28 1986-03-07 Inf Milit Spatiale Aeronaut Boitier pour composant electronique comportant un element fixant l'humidite
US4572757A (en) * 1984-01-23 1986-02-25 The Jade Corporation Method of making a microcircuit substrate

Also Published As

Publication number Publication date
DE3671575D1 (de) 1990-06-28
EP0225333A1 (en) 1987-06-16
WO1986006212A1 (en) 1986-10-23
EP0225333B1 (en) 1990-05-23
GR860794B (en) 1986-04-03
JPS62502157A (ja) 1987-08-20
GR860795B (en) 1986-07-29
ES553891A0 (es) 1987-12-16
ES557667A0 (es) 1987-12-01
IL78192A0 (en) 1986-07-31
JPH0455534B2 (tr) 1992-09-03
ES8801063A1 (es) 1987-12-01
ES8801477A1 (es) 1987-12-16
IL78192A (en) 1992-03-29

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