TR23240A - Mini-chip tasiyici yarikli dizi - Google Patents
Mini-chip tasiyici yarikli diziInfo
- Publication number
- TR23240A TR23240A TR194/86A TR19486A TR23240A TR 23240 A TR23240 A TR 23240A TR 194/86 A TR194/86 A TR 194/86A TR 19486 A TR19486 A TR 19486A TR 23240 A TR23240 A TR 23240A
- Authority
- TR
- Turkey
- Prior art keywords
- knee
- mini
- chip carrier
- carrier instant
- instant
- Prior art date
Links
- 210000003127 knee Anatomy 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US72264485A | 1985-04-12 | 1985-04-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
TR23240A true TR23240A (tr) | 1989-07-21 |
Family
ID=24902742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TR194/86A TR23240A (tr) | 1985-04-12 | 1986-04-11 | Mini-chip tasiyici yarikli dizi |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0225333B1 (tr) |
JP (1) | JPS62502157A (tr) |
DE (1) | DE3671575D1 (tr) |
ES (2) | ES8801477A1 (tr) |
GR (2) | GR860795B (tr) |
IL (1) | IL78192A (tr) |
TR (1) | TR23240A (tr) |
WO (1) | WO1986006212A1 (tr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2223354B (en) * | 1988-09-30 | 1992-10-14 | Marconi Electronic Devices | Semiconductor devices |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3926746A (en) * | 1973-10-04 | 1975-12-16 | Minnesota Mining & Mfg | Electrical interconnection for metallized ceramic arrays |
DE3103454A1 (de) * | 1981-02-02 | 1982-08-26 | Vdo Adolf Schindling Ag, 6000 Frankfurt | Systemtraegerband mit mehreren systemtraegern fuer integrierte schaltkreise |
FR2521350B1 (fr) * | 1982-02-05 | 1986-01-24 | Hitachi Ltd | Boitier porteur de puce semi-conductrice |
FR2538618B1 (fr) * | 1982-12-28 | 1986-03-07 | Inf Milit Spatiale Aeronaut | Boitier pour composant electronique comportant un element fixant l'humidite |
US4572757A (en) * | 1984-01-23 | 1986-02-25 | The Jade Corporation | Method of making a microcircuit substrate |
-
1986
- 1986-03-19 IL IL78192A patent/IL78192A/xx not_active IP Right Cessation
- 1986-03-26 GR GR860795A patent/GR860795B/el unknown
- 1986-03-26 GR GR860794A patent/GR860794B/el unknown
- 1986-03-31 JP JP61501902A patent/JPS62502157A/ja active Granted
- 1986-03-31 WO PCT/US1986/000650 patent/WO1986006212A1/en active IP Right Grant
- 1986-03-31 DE DE8686902254T patent/DE3671575D1/de not_active Expired - Fee Related
- 1986-03-31 EP EP86902254A patent/EP0225333B1/en not_active Expired
- 1986-04-11 ES ES553891A patent/ES8801477A1/es not_active Expired
- 1986-04-11 TR TR194/86A patent/TR23240A/tr unknown
-
1987
- 1987-08-14 ES ES557667A patent/ES8801063A1/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE3671575D1 (de) | 1990-06-28 |
EP0225333A1 (en) | 1987-06-16 |
WO1986006212A1 (en) | 1986-10-23 |
EP0225333B1 (en) | 1990-05-23 |
GR860794B (en) | 1986-04-03 |
JPS62502157A (ja) | 1987-08-20 |
GR860795B (en) | 1986-07-29 |
ES553891A0 (es) | 1987-12-16 |
ES557667A0 (es) | 1987-12-01 |
IL78192A0 (en) | 1986-07-31 |
JPH0455534B2 (tr) | 1992-09-03 |
ES8801063A1 (es) | 1987-12-01 |
ES8801477A1 (es) | 1987-12-16 |
IL78192A (en) | 1992-03-29 |
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