TR201722994A2 - Bi̇r sicak eri̇yi̇k epoksi̇ reçi̇ne si̇stemi̇ ve yapimi i̇çi̇n proses - Google Patents

Bi̇r sicak eri̇yi̇k epoksi̇ reçi̇ne si̇stemi̇ ve yapimi i̇çi̇n proses Download PDF

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Publication number
TR201722994A2
TR201722994A2 TR2017/22994A TR201722994A TR201722994A2 TR 201722994 A2 TR201722994 A2 TR 201722994A2 TR 2017/22994 A TR2017/22994 A TR 2017/22994A TR 201722994 A TR201722994 A TR 201722994A TR 201722994 A2 TR201722994 A2 TR 201722994A2
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TR
Turkey
Prior art keywords
epoxy resin
agent
less
curing agent
resin system
Prior art date
Application number
TR2017/22994A
Other languages
English (en)
Inventor
Korkmaz Deni̇z
Öztürk Cem
Original Assignee
Kordsa Teknik Tekstil As
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Publication date
Application filed by Kordsa Teknik Tekstil As filed Critical Kordsa Teknik Tekstil As
Priority to TR2017/22994A priority Critical patent/TR201722994A2/tr
Priority to EP18915041.0A priority patent/EP3732244A4/en
Priority to EP21213245.0A priority patent/EP3998310A1/en
Priority to PCT/TR2018/050808 priority patent/WO2019203754A2/en
Priority to US16/958,754 priority patent/US20200339738A1/en
Publication of TR201722994A2 publication Critical patent/TR201722994A2/tr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C08K5/3435—Piperidines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/022—Polycondensates containing more than one epoxy group per molecule characterised by the preparation process or apparatus used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5026—Amines cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/07—Aldehydes; Ketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/21—Urea; Derivatives thereof, e.g. biuret
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/24—Derivatives of hydrazine
    • C08K5/25—Carboxylic acid hydrazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
    • C08K5/3155—Dicyandiamide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

Hızla kürlenebilen, izotermal presle kürlenebilen, 150°C'de üç dakikadan kısa sürede sıcak olarak kalıptan çıkarılabilen ve Sınıf A yüzey veren ve otomotiv iç kompozit parçaların üretiminde kullanılmaya uygun olan, bir epoksi reçine bileşimi ve bir kür maddesi/katalizör pasta bileşimi içeren bir sıcak eriyik epoksi reçine sistemi olup, özelliği, bahsedilen reçine sisteminin, bir birinci reçine ve bir ikinci reçine içeren bir epoksi reçine karışımı; en az bir termoplastik toklaştırıcı; en az bir UV perdeli amin ışık stabilizörü; en az bir UV soğurucu ve/veya bloklayıcı; antioksidan olarak 1,3,5-tris(4-tert.-bütil-3-hidroksi-2,6-dimetilbenzil)-1,3,5- triazin-2,4,6-(1H,3H,5H)-trion; hava salma/reoloji ajanı olarak hidrofobik islenmiş silika ve içten kalıp ayırma ajanı olarak diamino heksametildisiloksan içermesi; ve bahsedilen kür maddesi/katalizör pasta bileşiminin ise 10 &#956#&m altında partikül boyutuna sahip disiyandiamid (DICY) ve 10 &#956#&m altında parçacık boyutuna sahip sebasik dihidrazid içeren bir pasta karışımı; diüronlar veya imidazoller içeren gruptan seçilen bir hızlandırıcı; sıvı kür maddesi olarak sikloalifatik poliamin; hava salma/reoloji ajanı olarak islenmiş silika ve lif-matris yapışma destekleyici olarak silikon diamin içermesidir.
TR2017/22994A 2017-12-29 2017-12-29 Bi̇r sicak eri̇yi̇k epoksi̇ reçi̇ne si̇stemi̇ ve yapimi i̇çi̇n proses TR201722994A2 (tr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TR2017/22994A TR201722994A2 (tr) 2017-12-29 2017-12-29 Bi̇r sicak eri̇yi̇k epoksi̇ reçi̇ne si̇stemi̇ ve yapimi i̇çi̇n proses
EP18915041.0A EP3732244A4 (en) 2017-12-29 2018-12-14 HOT MELT OXIDE RESIN SYSTEM AND METHOD FOR MANUFACTURING IT
EP21213245.0A EP3998310A1 (en) 2017-12-29 2018-12-14 A hot melt epoxy resin system and process for making the same
PCT/TR2018/050808 WO2019203754A2 (en) 2017-12-29 2018-12-14 A hot melt epoxy resin system and process for making the same
US16/958,754 US20200339738A1 (en) 2017-12-29 2018-12-14 Hot melt epoxy resin system and process for making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TR2017/22994A TR201722994A2 (tr) 2017-12-29 2017-12-29 Bi̇r sicak eri̇yi̇k epoksi̇ reçi̇ne si̇stemi̇ ve yapimi i̇çi̇n proses

Publications (1)

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TR201722994A2 true TR201722994A2 (tr) 2019-07-22

Family

ID=67901366

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TR2017/22994A TR201722994A2 (tr) 2017-12-29 2017-12-29 Bi̇r sicak eri̇yi̇k epoksi̇ reçi̇ne si̇stemi̇ ve yapimi i̇çi̇n proses

Country Status (4)

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US (1) US20200339738A1 (tr)
EP (2) EP3732244A4 (tr)
TR (1) TR201722994A2 (tr)
WO (1) WO2019203754A2 (tr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023184202A1 (en) * 2022-03-30 2023-10-05 Evonik Operations Gmbh Latent amine compositions for flame resistant epoxy system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8044505B2 (en) * 2005-12-01 2011-10-25 Sumitomo Bakelite Company Limited Prepreg, method for manufacturing prepreg, substrate, and semiconductor device
US9629240B2 (en) * 2011-12-28 2017-04-18 Zeon Corporation Prepreg and laminate including prepreg
JP6658747B2 (ja) * 2014-12-02 2020-03-04 東レ株式会社 エポキシ樹脂組成物、プリプレグ、繊維強化プラスチック材料および繊維強化プラスチック材料の製造方法
GB201515715D0 (en) * 2015-09-04 2015-10-21 Gurit Uk Ltd Prepregs and production of composite material using prepregs
CN105349080B (zh) * 2015-12-14 2017-11-07 烟台德邦科技有限公司 一种汽车车身结构胶及其制备方法
KR101790112B1 (ko) * 2016-03-29 2017-10-26 주식회사 한국카본 프레스 공법을 통한 차체부품 고속경화 프리프레그용 수지 조성물 및 이를 포함하는 프리프레그 제품

Also Published As

Publication number Publication date
EP3998310A1 (en) 2022-05-18
WO2019203754A3 (en) 2020-01-09
WO2019203754A2 (en) 2019-10-24
US20200339738A1 (en) 2020-10-29
EP3732244A2 (en) 2020-11-04
EP3732244A4 (en) 2021-11-03

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