TH96066B - Solution and surface treatment processes of copper alloys to improve adhesion between metal surfaces. And the polymer material that forms the bond - Google Patents
Solution and surface treatment processes of copper alloys to improve adhesion between metal surfaces. And the polymer material that forms the bondInfo
- Publication number
- TH96066B TH96066B TH701000702A TH0701000702A TH96066B TH 96066 B TH96066 B TH 96066B TH 701000702 A TH701000702 A TH 701000702A TH 0701000702 A TH0701000702 A TH 0701000702A TH 96066 B TH96066 B TH 96066B
- Authority
- TH
- Thailand
- Prior art keywords
- solution
- polymer material
- bond
- surface treatment
- copper alloys
- Prior art date
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract 3
- 238000004381 surface treatment Methods 0.000 title claims 2
- 239000002861 polymer material Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 239000002184 metal Substances 0.000 title 1
- 229910052751 metal Inorganic materials 0.000 title 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims abstract 2
- 150000001875 compounds Chemical class 0.000 claims abstract 2
- 239000007800 oxidant agent Substances 0.000 claims abstract 2
- 239000000126 substance Substances 0.000 claims abstract 2
- 239000000758 substrate Substances 0.000 claims abstract 2
- 239000002253 acid Substances 0.000 claims 1
- -1 fluoride ions Chemical class 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 abstract 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 abstract 1
- 150000007513 acids Chemical class 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 230000003750 conditioning effect Effects 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000002019 doping agent Substances 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229910052698 phosphorus Inorganic materials 0.000 abstract 1
- 239000011574 phosphorus Substances 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000011135 tin Substances 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
- 239000011701 zinc Substances 0.000 abstract 1
- 229910052726 zirconium Inorganic materials 0.000 abstract 1
Abstract
การประดิษฐ์นี้เกี่ยวข้องกับกระบวนการต่างๆ และสารละลายต่างๆ สำหรับการปรับสภาพ ของพื้นผิวโลหะเจือทองแดง เพื่อต่อมาจะเกิดพันธะอย่างเต็มที่กับวัสดุพอลิเมอร์ สารละลายที่ใช้ โดยเฉพาะอย่างยิ่งสำหรับการทำให้เกิดพันธะอย่างเต็มที่ของเลดเฟรมเพื่อห่อหุ้มสารประกอบที่ขึ้น รูปได้ (วัสดุพอลิเมอร์) สารละลายประกอบด้วยหนึ่งสารออกซิไดซ์ อย่างน้อยหนึ่งกรด อย่างน้อย หนึ่งสารประกอบที่เพิ่มการยึดติด ซึ่งมีลักษณะตรงที่สารละลายมีสารเหล่านี้เพิ่มเติม คือ ฟลูออไรด์ ไอออนในปริมาณหนึ่งๆ ของอย่างน้อย 100 มก. ต่อลิตร และคลอไรด์ไอออนในปริมาณหนึ่งๆ ของ 5 ถึง 40 มก. ต่อลิตร สารละลายมีประโยชน์โดยเฉพาะอย่างยิ่งสำหรับการปรับสภาพของพื้นผิวโลหะเจือ ทองแดงที่มีสารใช้เจือซึ่งถูกเลือกจากกลุ่มของซิลิกอน นิกเกิล เหล็ก เซอร์โคเนียม ฟอสฟอรัส ดีบุก และสังกะสี This invention involves several processes. And various solutions For conditioning Of copper alloy substrate To later form a full bond with the polymer material. Solution used Especially for the full bonding of the leadframe to encapsulate the formable compound (polymer material), the solution contains one oxidizing agent. At least one acidic compound that increases adhesion. It is characterized by the fact that the solution contains these additional substances: a fluoride ion in a certain amount of at least 100 mg per liter and a chloride ion in a certain amount of 5 to 40 mg per liter solution. Especially useful for pretreatment of alloy surfaces. Copper with dopants selected from the groups of silicon, nickel, iron, zirconium, phosphorus, tin and zinc.
Claims (1)
Publications (3)
| Publication Number | Publication Date |
|---|---|
| TH96066B true TH96066B (en) | 2009-06-18 |
| TH96066A TH96066A (en) | 2009-06-18 |
| TH74066B TH74066B (en) | 2020-01-29 |
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