TH52976B - Image conversion toolkit - Google Patents

Abstract

DC60 (01/09/16) Bracing (10) For sustaining integrated circuit unit units (65) wherein the apparatus shall consist of a support assembly (15) with a metal face (25) provided that such end face array of concave slots (27); A soft layer (30) overlaps the indentations of the metal surface (25) to protect the unit (65) from damage caused by contact with the metal surface and the vacuum mechanism (35) in contact with it. Such a concave channel (27) is supported by a vacuum mechanism. each unit within which the corresponding concave where the soft material layer (30) is formed by several separate inserts (40) with the insert overlap At least one concave hole By using an overlap mechanism (50,55) to overlap the insert (40) with at least one concave slot (27). Fig. 2b revised 01/09/2016. Bracing device (10) for bracing the integrated circuit unit unit (65). where the fittings consist of: support assembly (15) having a metal face (25), such faces having an array of concave openings (27); A soft layer (30) overlaps the indentations of the metal surface (25) to protect the unit (65) from damage caused by contact with the metal surface and the vacuum mechanism (35) in contact with it. Such a concave channel (27) is supported by a vacuum mechanism. each unit within which the corresponding concave where the soft material layer (30) is composed of several separate inserts (40) with the insert overlapped. At least one concave hole Using an overlap mechanism (50,55) to overlap the insert (40) with at least one concave cavity (27). Figure 2b -------------------- -- Supporting devices (10) for supporting integrated circuit unit assemblies (65), where they consist of: Supporting elements (15) with metal faces (25), such faces having an array of concave openings. (27); A soft layer (30) overlaps the indentations of the metal surface (25) to protect the unit (65) from damage caused by contact with the metal surface and the vacuum mechanism (35) in contact with it. Such a concave channel (27) is supported by a vacuum mechanism. each unit within which the corresponding concave where the soft material layer (30) is composed of several separate inserts (40) with the insert overlapped. At least one concave hole by using an overlap mechanism (50,55) to overlap the insert (40) with at least one concave cavity (27). Fig. 2b:

Claims (9)

Disclaimer (all) which will not appear on the advertisement page: edit 01/09/2016 1.Support for supporting the integrated circuit unit Where the device will consist of Support assembly with a metal surface Where the above surface will have an array of channels Concave layer made of soft material that overlaps the indents of the metal surface to protect the unit from receiving Damage caused by contact with metal surfaces, and vacuum mechanisms which contact Together with the aforementioned holes Where the vacuum mechanism sustains each unit within the corresponding concave cavity, where the soft material layer is made up of several separate inserts where the inserts overlap at least one of the recesses. Using the periodic mechanism About to overlap each insert into at least one of the holes. 2. Equipment supporting according to claim 1, where the overlap mechanism includes a overlap. Mechanical and one or both of the chemically bonded overlaps. 3. The support device according to claim 2, where mechanical overlapping will include compression. Between the insert and at least one recess 4. The support device as stated in claim 1, where the insert overlaps a single indentation. 5. The support device as specified in claim 1, where the insert overlaps the recess. At least two fields 6. Support equipment as described in claim 1, where the soft material is either natural rubber, polyurethane or silicone, or a combination. 7. Support Equipment as set out in claim 1 where the insert shall include materials made from A second solid that binds to a soft material to facilitate the overlap 8.Support equipment as set out in claim 1, where the vacuum mechanism will include the pump. Vacuum, which is connected with the support assembly to create negative pressure within Internal compartment of the supporting element Where each indentation and each part of The insert corresponding to each recess includes an opening in which the negative pressure acts. Pull and overlap the units corresponding to the concave slots. 9.Support device Which uses separate inserts Where such support equipment Will sustain a series of integrated circuits The device contains the following components: Support, which has a metal face Where the above surface has an array of concave slots Layer made with material Soft, which overlays the indents of the metal surface to protect the unit from damage caused by contact with the metal surface. And the vacuum mechanism, which is connected to the indentation, whereby the vacuum mechanism sustains each unit within the corresponding concave cavity, where the soft material layer is made up of multiple inserts separated by The insert will overlap at least one of the indents 1. 0.How to repair the support equipment Where such a support device will be used to sustain Such a series of integrated circuit units By the way, the steps are as follows: Remove damaged inserts. Or wear out from the recess of the point support assembly, provided that the support assembly has a metal face with an array of recesses. Use this override to overlap the concave channel again, overlap the insert and the concave channel. To allow the vacuum mechanism to communicate with each other with the said cavity To sustain the unit within the recess Corresponding Where the insert used instead of filling the soft material layer on the metal surface Where the layer consists of several discrete inserts. ----------------------------------- 1.Support for supporting the integrated circuit unit Where the device will consist of Support assembly with a metal surface Where the above surface will have an array of channels Concave layer made of soft material that overlaps the indents of the metal surface to protect the unit from receiving Damage caused by contact with metal surfaces, and vacuum mechanisms which contact Together with the aforementioned holes Where the vacuum mechanism sustains each unit within the corresponding concave cavity, where the soft material layer is made up of several separate inserts where the inserts overlap at least one of the recesses. Using the periodic mechanism About to overlap each insert into at least one of the holes. 2. Equipment supporting according to claim 1, where the overlap mechanism includes a overlap. Mechanical and one or both of the chemically bonded overlaps. 3. The support device according to claim 2, where mechanical overlapping will include compression. Between the insert and at least one recess 4.Support equipment as set out in any of the previous claims. Where the insert Will overlap with a single concave channel 5. Support equipment as specified in any of Claims 1 to 4. Where the insert will Overlap with at least two holes. 6.Support equipment as set out in any of the previous claims. Where the material type Soft is either natural rubber, polyurethane, or silicone, or a combination. 7.Support equipment as set out in any of the previous claims. Where the insert It includes a second solid material that binds with a soft material to provide periodic intervals. Convenient 8. Support Equipment As stated in any of the previous claims, where the vacuum mechanism will include a vacuum pump connected to the support assembly to create The negative pressure inside of the supporting assembly Where each concave channel Each slot and part of the insert, corresponding to each recess, includes an opening, which The negative pressure acts to pull and overlap the unit corresponding to the concave cavity. 9.Inserts for use with support equipment. Where such a support will support the integrated circuit unit, it will have the following components: a support assembly with a metal surface, with such a surface having an array of indents. Layers made of soft materials which are stacked Over the recess of the metal surface to protect the unit from damage. This is caused by contact with the metal surface and the vacuum mechanism which is in contact with the indentation, whereby the vacuum mechanism sustains each unit within the corresponding recess, where the soft material layer is made up of the insert. Multiple separators where the insert overlaps at least one of the indents 1. 0.How to repair the support equipment Where such a support device will be used to sustain Such a series of integrated circuit units By the way, the steps are as follows: Remove damaged inserts. Or wear out from the recess of the point support assembly, provided that the support assembly has a metal face with an array of recesses. Use this override to overlap the insert again, overlap the insert and the concave channel to Allow the vacuum mechanism to communicate with each other with the said cavity To sustain the unit within a corresponding recess, where the insert was used instead of filling a soft layer on the metal surface. Where the layer consists of several discrete inserts.