TH49216B - Tools and methods for inertial phase change thermal management systems. - Google Patents

Abstract

The DC60 heat sink incorporates a body containing fins and cavities to accommodate phase-transition material and particles, enhancing the mixing of the phase-transition material during heat sink operation. During operation, the heat sink body transfers thermal energy to the phase-transition material. This energy is absorbed during the phase transition of the material. After energy absorption and transition to a liquid state, the phase-transition material continuously dissipates energy via convection. The convection currents within the cavities are directed by the cavity surface shape and are enhanced by the particles mixed with the phase-transition material. The heat sink body, including fins and cavities, accommodates the phase-transition material and particles to further enhance its mixing during heat sink operation. In its operation, the heat sink body transfers thermal energy to the phase-transition material; this energy is absorbed during the phase transition. In phase transition materials, after energy absorption and transition to a liquid state, the material continuously dissipates energy through convection. This convection current within the pores is regulated by the pore surface shape and enhanced by the particles mixed with the phase transition material.

Claims (28)

1. An instrument comprising a phase transition material, a number of particles mixed with this phase transition material, and an electrically conductive structure enclosing this phase transition material. 2. The instrument under claim 1, where this phase-changing material is included, consists of TH58. 3. An instrument according to claim 1, where at least one of these particles is approximately spherical in shape. 4. The instrument under claim 3, whereby this electrically conductive structure includes a void surface containing a number of structures in contact with this phase-change material. 5. Equipment pursuant to claim paragraph 4, where at least one of these structures is a ramp. 6. The instrument under claim 1, whereby this electrically conductive structure is fabricated from copper. 7. The instrument under claim 1, whereby this electrically conductive structure will include a number of fins. 8. The instrument under claim 1, which includes a usable device for generating heat, whereby this device is thermally connected to this electrically conductive structure. 9. The instrument under claim number 8, whereby this instrument is an integrated circuit. 10. A method comprising the formation of a porous, electrically conductive structure; injection of phase-change material into the cavity; injection of a number of spheres into the cavity; and sealing of the cavity. 11. The method under claim 10, whereby the formation of this porous conductive structure comprises a porous conductive structure that includes a pore surface on which a number of ramps are formed. 12. The procedure under claim 10, where the injection of a phase-change material into this cavity is performed, includes the injection of TH58 into this cavity. 13. The procedure under claim 10, where the injection of a certain number of spheres into this cavity, shall consist of the injection of a certain number of solid spheres into this cavity. 14. The method pursuant to claim 10, whereby the sealing of this cavity shall include the closure of the injection port in this cooler. 15. The instrument consists of a circuit packaging, a conductive structure including a cavity, this conductive structure is thermally coupled to the circuit packaging, a phase transition material is partially filled into this cavity, and a number of particles are mixed with this phase transition material. 16. The instrument under claim 15, whereby this phase-change material undergoes a phase change at a temperature above approximately 58 degrees Celsius. 17. The instrument under claim 15, whereby this cavity has a surface of the cavity which includes a number of structures. 18. An instrument pursuant to claim 15 where at least one of these particles shall consist of SiO2. 19. The instrument under claim 15, whereby this phase-transition material is deposited on a number of particles in the cooled region of this phase-transition material. 20. Methods of cooling the circuit packaging that involve the absorption of phase-change energy by the phase-change material thermally connected to the circuit packaging. 21. The method under claim 20, which is further comprised of the transfer of energy by the bonding of this phase-change material to the surface of the spheres. 22. The method under claim 20, which is further comprised of the transfer of energy by directing the flow of these spheres with a structure located on the surface of this cavity. 23. The instrument consists of a die, a heat sink thermally connected to this die, and a heat sink containing a phase-change material mixed with a number of spheres. 24. The instrument under claim 23, whereby this die will include circuits for wireless communication equipment. 25. The instrument pursuant to claim clause 23, whereby this die shall include the processor. 26. A wireless communication system consisting of a phase transition material, a conductive structure enclosing this phase transition material, and a die connected to this conductive structure. 27. A wireless communication system pursuant to claim 26, which further incorporates a number of particles mixed with this phase-transition material. 28. A wireless communication system pursuant to claim 27, where at least one of these particles is sand.