TH45546A - Methods for manufacturing supports that are equipped with shielding against interference radiation and shielding materials. - Google Patents

Abstract

DC60 (13/11/43) A method for fabricating a prepared support with shielding against interference radiation, such as electromagnetic radiation, as described in the invention, involves a metal-assembled plastic substrate. The metal is assembled with tin, which is placed in an injection mold, and the plastic is injected into the mold to form the support. The tin-coated substrate is highly deformable; therefore, the tin-coated substrate can be deformed without the loss of its shielding properties. A method for fabricating a prepared support with shielding against interference radiation, such as electromagnetic radiation, as described in the invention, involves a metal-assembled plastic substrate. The metal is assembled with tin, which is placed in an injection mold, and the plastic is injected into the mold to form the support. The tin-coated substrate is highly deformable; therefore, the tin-coated substrate can be deformed without the loss of its shielding properties. The cover has been lost.

Claims (20)

1. Method for manufacturing prepared supports with interference radiation shielding. This method involves placing a metal-bonded plastic substrate into an injection mold, and the plastic is then injected into the mold to form the support. The metal bonding material of the metal-bonded plastic substrate is, in particular, tin. 2. The method under Claim 1 is characterized by a plastic substrate, which is assembled with metal, and incorporates a copper layer in between. 3. The method under either claim 1 or 2 is characterized by the selection of a metal-bonded substrate plastic from a group consisting of polycarbonate (PC), acrylonitrile-butadiene-styrene (ABS) and mixtures thereof. 4. The method under one of the preceding claims has a characteristic feature in which the substrate plastic contains fillers. 5. The method described in one of the preceding claims is characterized by a tin layer of the metal-embedded plastic substrate having a corrosion-resistant metallic layer coated on top of that layer. 6. The method under claim 5 is characterized by the fact that the metal of the corrosion-resistant protective layer is composed of nickel. 7. The method under one of the preceding claims is characterized by the arrangement of a plastic substrate assembled with metal, combined with a three-dimensional deformation process. 8. The method under claim 7 is characterized by the plastic substrate, which is assembled with metal, being subjected to deep drawing. 9. The method under claim 8 is characterized by the fact that such deep drawing is accomplished at a temperature of approximately 100°C. 10. Any of the methods under claims 1 through 6 preceding this are characterized by the fact that the metal-bonded plastic substrate is pre-shaped before being placed in the injection mold. 11. One of the methods under claim 10 is characterized in which the metal of the metal-assembled plastic substrate is introduced into contact with a heated pre-deformation mold, and the plastic layer of the metal-assembled plastic substrate is also heated. 12. The method under any of the preceding claims is characterized by a tin layer thickness of 1 to 20 micrometers, ideally 3 to 5 micrometers. 13. The method under one of the preceding claims is characterized by the thickness of the plastic substrate layer embedded with metal being in the range of 10 to 250 micrometers, ideally around 75 micrometers. 14. The method described in one of the preceding claims is characterized by a copper layer thickness ranging from 0.025 to 1 micrometer, ideally around 0.050 micrometers. 15. The method under any of the preceding claims has a specific characteristic in which the support structure includes a plastic chamber. 16. The method under claim 13 is characterized by the use of a chamber for a plastic substrate layer assembled with metal. 17. The method under one of the preceding claims is characterized by the plastic substrate incorporated with metal being allowed to extend beyond the outer perimeter of the injection-molded support, and that this excess is shaped into a large contact area with a large surface area. 18. The screening material, which consists of a plastic substrate bonded to a metal, specifically for use in the manner described in one of the preceding claims, is characterized by the plastic substrate bonded to the metal being incorporating a layer of tin. 19. The material for screening under claim 18 is of a specific nature in which a copper film is provided between a plastic layer and a tin layer. 20. The material for the forming according to either claim 13 or 14 is of a specific nature, in which a corrosion-resistant metal layer is provided on top of the tin layer.