TH41530A3 - A method of connecting lasers and devices for connecting different workpieces made of plastic or for connecting plastics to other materials. - Google Patents

Abstract

DC60 (06/03/43) Methods and devices for connecting various plastics. With a laser or for connecting plastics to other materials. Which is brought into contact with pressure where the workpiece is very close to the laser beam Most of them will be mostly transparent for the laser beam and the second workpiece will have an suction effect. Swallow as much as possible By producing a laser beam that is shaped in the form of a top line. The contact surfaces between the workpieces and by relative displacement of the laser beam With those works Such workpieces are precisely welded together in different areas for the required connection. This will allow for a highly accurate bond. So that even parts The engineering field of micro systems can also be manufactured. The cycle of short time Methods and devices for connecting various plastics With a laser or for connecting plastics to other materials. Which is brought into contact with pressure where the workpiece is very close to the laser beam Most of them will be mostly transparent for the laser beam and the second workpiece will have an suction effect. It is swallowed as much as possible by producing a laser beam that is shaped in the shape of a top line. The contact surfaces between the workpieces and by relative displacement of the laser beam With those works Such workpieces are precisely welded together in different areas for the required connection. This will allow for a highly accurate bond. So that even parts The engineering field of micro systems can also be manufactured. The cycle of short time

Claims (5)

1. A method of laser bonding to different connecting workpieces (4, 5) made of plastic or to connect plastic to other materials. Where the top specimen (4) facing the laser source (1) is made of a material which is transparent for the laser beam (2) and the second (5) is made. The laser beam is absorbed from the material (2) so that the adjacent surfaces (7) of the two workpieces (4, 5) begin to melt and be welded together. do It is subsequently cooled under pressure, which is characterized by obscurity (3), a material that the laser cannot pass through, is arranged between the laser light sources (1). And the workpieces (4,5) to be welded to join them in the connection area (6), some of the contact surface (7), where the structure (9) of the obscure Said to be larger than The wavelength of the laser beam (2) is being used, the laser source (1) is directed to The contact surface (7) in such a way that the line (8) is produced on it. 2. A method corresponding to claim 1, which is characterized in that the laser beam (2) is aligned at a right angle over the connecting area. (6) of the contact surface. (7) 3. Methods consistent with clause 1 or 2, which are defined for the strength characteristics. An additional connection press is made while connecting the workpieces (4, 5) that will be welded. 4. Method corresponding to clause 3, which has been defined in the On one workpiece (4, 5), there is another protrusion in the direction of the workpiece (4, 5) adjacent to the connection area (3) so that the cavity (18). It is created between the contact surfaces (7) that will be bonded. And the protruding part (16) when the two workpieces (4, 5) are pressed together 5. Method corresponding to one of the previous claims, which were obtained The It is characterized in that the relative speed between the laser light source (1) and those of the workpieces (4,5) is selected as high as possible as a function of the high laser power. 6. Methods consistent with one of the previous claims that have been previously referred to as the applicable melting temperature. Defines the peculiarity in that the width of the line is chosen to have a value that is basically equal to the width. 7. Methods consistent with any one of the previous claims that have been addressed. Determine the characteristics in which a laser beam (2) is induced by at least one semiconductor laser. 8. The method consistent with claim 7, which is characterized by the long The distance of the laser line (8) is adjusted by the distance of the laser source (1) away from the contact surface (7) and the corresponding tuning of the laser power for the required melt temperature. 9. The method is consistent with claim 7, which has been characterized in that the breadth Of the laser beam (2) is maintained to a constant fundamental characteristic with a change in the distance of Laser light source (1) from the surface of contact (7) 1 0. Method corresponding to one of the previous claims, which was Define the characteristics in that relative motion between the laser beam (2) and the contact surface (7) is generated by a mirror (21) which can be rotated around an axis or rotated around that axis (20). Parallel to the contact surface (7) 1 1. A wide variety of (4, 5) connecting devices made of plastic or connections. Plastic and other materials By the way of the laser beams, the top specimens (4) facing the laser source (1) are made from a material which is transparent for the laser beam (2) and the workpiece. The second (5) is made from a material with laser beam absorption (2) so that the adjacent surfaces (7) of the two workpieces (4, 5) can be melted and Connect Together in subsequent cooling under pressure which is characterized by that The laser light source (1) and obscure (3) made of materials that the laser cannot pass through are placed between the workpieces (4, 5) to be connected and the laser source by On the structure (9) of the obscure larger than the wavelength of the laser beam (2) being used, the laser source (1) is directed towards the contact surface (7) so that the line ( 8) will be made Occurs on such and equipment (21,22) for the continuous movement of the laser beam (2) and those of the workpieces (4, 5) in relation to each other 1. 2. The device complies with claim 11, which is characterized in that the laser beam (2) is aligned at an angle over the connecting area (6) of the contact surface (7) 1. 3. Equipment corresponding to claim 11 or 12, which is characterized in that A gripping device (11, 12) is provided to clamp the workpiece (4, 5) to be welded. Attach it together with the cover (3) before operating in Connection 1. 4. Equipment corresponding to any of the previous claims 11 through 13 that were It is characterized in that the laser beam (2) is generated by a semiconductor laser. At least one set 1 5. Equipment corresponding to claim 14, which is characterized in that the source The laser light source (1) transmits a laser beam (2) with a lengthened cross section in such a way that Corresponding to the required width, the beam is deflected by a mirror (21) that can be rotated around an axis or rotated around an axis (20) parallel to the contact surface (7) and is aligned. It is placed above the obscure (3) and can be operated by the driver unit (22).