TH41438B - Molded wiring panel and molded wiring panel manufacturing method - Google Patents

Abstract

DC60 (19/02/57) The heated and extruded molded wiring panels are made by filling through holes that are prepared in a layer of film. Insulation of wiring panels with interlayer conductive material The insulating film is overlaid with a conductive pattern and each conductor pattern closes the through hole. The conductive material between the layers forms a solid conductive material in the through holes. After the heating and compression process Solid conductor materials consist of two types of conductive materials. The first conductor material consists of metals. and the second type of conductive material consists of an alloy which forms Metal and conductive metal figure of conductor pattern The conductive pattern is reliably electrically connected. without relying on mechanical contact alone The heated and extruded molded cabling is made by filling through holes that are made in the film stage. Insulation of wiring panels with interlayer conductive material The insulating film is overlaid with a conductive pattern and each conductor pattern closes the through hole. The interlayer conductive material forms a solid conductive material in the through holes. After the heating and compression process Solid conductor materials consist of two types of conductive materials. The first conductor material consists of metals. and the second type of conductive material consists of an alloy which forms Metal and conductive metal figure of conductor pattern The conductive pattern is reliably electrically connected. without relying on mechanical contact alone

Claims (8)

Disclaimers (all) that will not appear on the advertisement page: 1. A printed cable-wire powder that has been formed by the interconnect layer. Interconnect layers At least one layer consists of Insulating film, including thermoplastic resin and at least one through hole, has been formed in the insulating film, the conductive pattern on the insulating film. Where the insulator pattern conductors, including metals, conductors and conductive materials belonging to the crescent in the through holes. Where electrical conductive materials belong to the ice, including electrically conductive materials The first and the second type of conductive material Where the first conductive material includes the indium, tin and silver particles, where tin is approximately 20-80% by weight of the same conductive material and the same conductive material. Two include alloys that are made up of conductive materials belonging to metal and conductive metals. 2. Powder, wiring, printed according to claim 1, where the first conductive material, the alloy of Tin and silver 3. Ee hard wiring, printed according to claim 1, where the conductive metal is gold. 4. Ee cable, printed according to claim 1, where the first conductive material is a compound. The combined electrical conductivity and the second conductive material form the phase distribution layer of the wall, where the phase distribution layer of the medium is between the combined conductive compound. The same and the conductor pattern 5. Ee powder, printed wiring according to claim 1, where the inter-connecting layer has compression temperature. Hot where the interconnected layers will be interconnected The heat compression temperature is lower than the Molten tin 6. Powders, wiring, printing according to claim 5, where the heat compression temperature is lower than the point Melt of money 7. Powders, wiring and printing according to claim 1 also consist of The covered layer, which includes a thermostat Plastic resin identical to the thermoplastic resin that is included in the insulating film. Where the cover is welded Adjacent to the outermost layer of the interconnected layer 8. Printed cable powder, according to claim 1, where the indium particles used as a fixative for Improve the stability of the conductive slurry