TH29389B - A stick for wafers and a process for preparing semiconductor devices using it. - Google Patents

Abstract

As disclosed, it is a wafer bonding plate consisting of Substrates and adhesion layers cured by emission created on them. Such bonding plates are used in a method for preparing semiconductor devices consisting of a wafer back surface bonding procedure to the front surface. create a cycle The wafers are zipped, washed, dried, and irradiated to cure the adhesion layer. Expansion of the adhesion plate If necessary, separate the zip. then zip storage Installing the pre-collected zip on the weld guide frame and the structural formwork is provided such that some or all of the zip's back surface is in contact with the sheathed resin formwork where floor Clings that can also be cured by emission of radiation. Adhesion acrylic containing at least acrylic copolymers. Polymeric esters and monomers with 100 parts by weight OH group. and compounds that are polymerized by radiation with two or more unsaturated bonds of 50-200 parts by weight. and the radiation cured adhesive layer has a coefficient of elasticity of not less than 1 x 10 dyne/cm after irradiated curing.

Claims (7)

1. The adhesion plate (1) for wafers consisting of a base film (2) and a light-cured adhesion layer (3) made on top of the bonding plate. Where the light-cured adherence layer (3) consists of 100 parts by weight of acrylic consisting of acrylic ester copolymer and Monomers that can be processed through polymerization. And the polymer made compound, 50-20 parts of light were emitted by weight with two or more unsaturated bonds. The binder is characterized by the polymerization monomer, it is a polymerized monomer containing the OH group, with the source unit. Polymerized monomers containing OH groups in acrylic adhesives are available in amounts of 8 to 30%. The photometric cured island (3) had a modulus of elasticity not less than 1x 10 8 pa (1x10 9dyn / cm2) after irradiated curing. 2. Adhesion (1) for wafers according to claim 1, where 20 to 80% by weight of the compound that has been polymerized with two or more unsaturated bonds is the bonded compound. Not four or more bonds. 3. Adhesives (1) for wafers in accordance with claim 1 or 2, where the polymerized monomer contained OH in acrylic adhesives is present in an amount of 20. Up to 30% by mole 4. The process for preparing a semiconductor device using a bonding plate (1) in accordance with claim 1, the process consists of the following steps: bonding the back surface area of the wafer (A) onto the bonding layer that Light-cured (3) where the front surface of the wafer is formed as a circuit board. Cutting the wafer (A) into chips (A1, A2, A3 ...) irradiation cured adhesion layer (B) to curing the adherent layer (3) then pick up the chip. (A1, A2, A3 ...) up, stick the chip on the lead frame. It is fixed and molded to obtain a structure where the back surface of the chipboard is in contact with the resin to build up all or part of the container. 5. The process for preparing the semiconductor device, according to claim 4, also consists of a bonding process (1) after the exposure process to separate the chip. 6.Process for the preparation of semiconductor devices according to claim 4 or 5, where 20 to 80% of the polymerized compound by weight with two or more unsaturated bonds is a compound with Four or more unsaturated bonds 7. Process for the preparation of semiconductor devices according to claim 4 to 6, where the units that come from in the polymerization-processed gummies contained OH in the acrylic adhesive have In the amount of 20 to 30% by mole