TH22015B - Abrasive tool for rain, electronic components - Google Patents

Abstract

DC60 (16/06/43) Abrasive tool containing a high concentration of hollow fill material in the substrate. The resin bond is suitable for polishing and rear grinding of hard materials such as ceramic wafers. And components that require a controlled amount of Defect on the surface These highly porous abrasive tools contain granules. For polishing fine grit, such as diamond abrasives Along with the material For filling hollow and resin binders Abrasive tools containing a high concentration of hollow fill material in the anchor material. The resin bond is suitable for polishing and rear grinding of hard materials such as ceramic wafers. And components that require a controlled amount of Defect on the surface These highly porous abrasive tools contain granules. For polishing fine grit, such as diamond abrasives Along with the material For filling hollow and resin binders

Claims (9)

1. A rain wheel consisting of a backing material with a center hole for mounting a rain wheel on a rain machine and an abrasive rim containing up to 2 to 15 percent of the abrasive grain. The grit has a maximum grit of 60 microns where the abrasive edge is Contains resin binders 5 to 20% by volume and hollow fill material. At least 40 percent of the volume 2. Polishing wheel of claim 1, where the hollow filling material is selected from the group. Contains a round object made of silica. Round objects made of mulite Fizzy Alumina Round objects made of glass and a combination of them. 3. Polishing wheel of claim 2, where the hollow filling material is a round body made of silica. 4. The abrasive wheel of claim 3 where spheres are made of silica with a range from approx. 4 to 130 microns along the diameter. 5. Polishing wheel of claim 1, where the abrasive grain is abrasive material. The height is selected from the group that contains the diamonds. And cubic boron nitride A combination of these 6. Polishing wheels for rain. Clause 5 where granular material with high abrasive power is granular material. Diamond with a grit size range of 0/1 to 20/40 microns. 7. Abrasive wheel of claim 1, where the porosity of the abrasive rim amounts to 12 to 30 percent of the volume. 8. Claim 1's abrasive wheel, where the sanding edge will consist of 5 to 10 percent of the volume resin binder. 9. Polishing wheel of claim 1 where resin binders are selected from the group containing phenolic resin, alkyd resin, epoxy resin, polyimide resin. Cyanate ester resin and a combination of them 1 0. Precipitation wheel of claim 9, where the resin binder is composed of phenolic resin 1 1. Polishing wheel. Of claim 1 where the abrasive edge will consist of a hollow fill material 50 to 75 percent of the volume 1 2. The abrasive wheel of claim 1 where the hollow filling material is a particle with a passage The average center is about 44 microns. 1 3. The rain wheel of the 1st claim, where the rain wheel is selected from the group of rain wheels. Polishing wheel containing type 2A2 wheel, type 1A1 wheel inner diameter. Outer diameter finishing wheel, intake finishing wheel and polishing wheel.