TH150099A - Wafer level integrated circuit contacts and their construction methods - Google Patents

Abstract

DC60 (19/12/57), a test device for testing the wafer levels of IC circuits is exposed. The upper and lower legs (22, 62) are configured to slide relative to each other and maintain an electrically counterweight contact by the elastomer (80). Pre-recorded from its natural resting state Between the top plate (22) and the bottom (70) the pre-compression increases the restorative response of the leg. Wings (44a-b) at least one opposed to the upper 90 of the 20 plates, which guarantees the appearance The legs (12) are aligned to the bracket 14 by forming an angle. For equalizing (506) and driving the pilot into an angle by the elastomer at the opposite angle along At least one corner of the diagonal The test equipment for testing the wafer level of the IC circuit was revealed The upper and lower legs (22,62) are aligned to slide relative to each other, and electrically counterbalance contact is maintained by the elastomer (80). The elastomer is compressed. Advance from its natural suspension state Between the top plate (22) and the bottom (70) the pre-compression increases the restorative response of the leg. Wings (44a-b) at least one opposed to the upper 90 of the 20 plates, which guarantees the appearance The legs (12) are aligned to the bracket 14 by forming an angle. For equalizing (506) and driving the pilot into an angle by the elastomer at the opposite angle along At least one corner of the diagonal

Claims (1)

: DC60 (19/12/57), a test device for testing the wafer level of the IC circuit was exposed. The upper and lower legs (22, 62) are configured to slide relative to each other and maintain an electrically counterweight contact by the elastomer (80). Prerecorded of its natural resting state Between the top plate (22) and the bottom (70) the pre-compression increases the restorative response of the leg, and the top of the leg (40) is maintained to be somewhat planed by overlapping Wings (44a-b) at least one opposed to the upper 90 of the 20 plates, which guarantees the appearance The legs (12) are aligned to the bracket 14 by forming an angle. For equalizing (506) and driving the pilot into an angle by the elastomer at the opposite angle along At least one corner of the diagonal The test equipment for testing the wafer levels of the IC circuit was revealed. The upper and lower legs (22,62) are aligned to slide relative to each other, and electrically counterbalance contact is maintained by the elastomer (80). The elastomer is compressed. Advance from its natural suspension state Between the top plate (22) and the bottom (70) the pre-compression increases the restorative response of the leg, and the top of the leg (40) is maintained to be somewhat planed by overlapping Wings (44a-b) at least one opposed to the upper 90 of the 20 plates, which guarantees the appearance The legs (12) are aligned to the bracket 14 by forming an angle. For equalizing (506) and driving the pilot into an angle by the elastomer at the opposite angle along At least one diagonal angle is valid. (Section One), which will appear on the Notice page: 1. Test pin assembly used for temporary contact with the test pads on the A wafer-level integrated circuit (DUT) device that includes: a. At least one sliding top connector which still has a top overhang for contact with the section. DUT, at least one lateral, lateral composite wing and surface; Where the above legs will Movable between an off-test position and a position under test; b. Pin connector tag side: