TH127151A - One-step heating method of assembling microelectronics materials with a flip chip. - Google Patents
One-step heating method of assembling microelectronics materials with a flip chip.Info
- Publication number
- TH127151A TH127151A TH1201001607A TH1201001607A TH127151A TH 127151 A TH127151 A TH 127151A TH 1201001607 A TH1201001607 A TH 1201001607A TH 1201001607 A TH1201001607 A TH 1201001607A TH 127151 A TH127151 A TH 127151A
- Authority
- TH
- Thailand
- Prior art keywords
- metal oxide
- substrate
- circuit board
- assembling
- bugle
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims abstract 6
- 238000000034 method Methods 0.000 title claims abstract 6
- 238000010438 heat treatment Methods 0.000 title claims abstract 4
- 238000004377 microelectronic Methods 0.000 title claims abstract 4
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract 7
- 150000004706 metal oxides Chemical class 0.000 claims abstract 7
- 239000000758 substrate Substances 0.000 claims abstract 6
- 241001503991 Consolida Species 0.000 claims abstract 4
- 238000007598 dipping method Methods 0.000 claims abstract 2
- 239000008188 pellet Substances 0.000 claims abstract 2
- 150000008064 anhydrides Chemical class 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 239000011324 bead Substances 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 abstract 1
Abstract
DC60 (05/04/55) การประดิษฐ์นี้เกี่ยวข้องกับวิธีการประกอบวัสดุไมโครอิเลคทรอนิกส์แบบฟลิปชิป โดยให้ความร้อนขั้นตอนเดียว ซึ่งมีขั้นตอนประกอบด้วย (1) จุ่มเม็ดโลหะบักรีในสารชะโลหะ ออกไซด์ หรือจ่ายสารชะโลหะออกไซด์บนพื้นรอง (2) วางแผงวงจรที่มีเม็ดโลหะบักรีลงบนพื้นรอง (3) จ่ายวัสดุรีโฟลว์เอนแคปซูเลนท์ด้านข้างของแผงวงจร และ (4) ให้ความร้อน การประดิษฐ์นี้เกี่ยวข้องกับวิธีการประกอบวัสดุไมโครอิเลคทรอนิกส์แบบฟลิปชิป โดยให้ความร้อนขั้นตอนเดียว ซึ่งมีขั้นตอนประกอบด้วย (1) จุ่มเม็ดโลหะบักรีในสารชะโลหะ ออกไซด์ หรือจ่ายสารชะโลหะออกไซด์บนพื้นรอง (2) วางแผงวงจรที่มีเม็ดโลหะบักรีลงพื้นรอง (3) จ่ายวัสดุรีโฟลว์เอนแคปซูเลนท์ด้านข้างของแผงวงจร และ (4) ให้ความร้อน DC60 (05/04/55) This invention involves a method for assembling a flip-chip microelectronic material. By heating one step The procedure consists of (1) immersing the metal oxide beads in the metal oxide leachate or dosing the metal oxide leachate on the substrate (2) placing the circuit board with the bugle on the substrate. The side encapsulation of the circuit board and (4) is heated. The invention involves a method of assembling a flip-chip microelectronic material. By heating one step The procedure consists of (1) dipping the bugle pellets in the metal oxide leachate or dosing the metal oxide leach on the substrate (2) placing the circuit board with the bugle on the substrate (3) dispensing the reflow material. Encapsulate the side of the circuit board and (4) heat it.
Claims (1)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/390,982 US9064820B2 (en) | 2012-04-05 | 2013-04-05 | Method and encapsulant for flip-chip assembly |
| PCT/TH2013/000016 WO2013165323A2 (en) | 2012-04-05 | 2013-04-05 | Method and encapsulant for flip-chip assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TH127151A true TH127151A (en) | 2013-09-19 |
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