TH11577B - IC mounting / removal system and mounting / removal head for that purpose. - Google Patents

Abstract

DC60 (21/08/44) IC mounting / disconnection system 27c centered, as well as 27c socket pusher and 27b shoulder centering built into the tool body A modular coupler with 57 headers, there is also a centralized storage unit. To hold a number of centering machines This construction does not require or can be replaced with a mounting / removal head. To change the type of IC each time is equal to Increase the efficiency of work Centered IC mounting / removal system 27, including pusher, pin 27c and shoulder centering 27b built into the tool body. A modular coupler with 57 headers, there is also a centralized storage unit. To hold a number of centering machines This build does not require or requires the replacement of the mounting / detaching head. To change the type of IC each time is equal to Increase the efficiency of work

Claims (11)

1. An IC mounting/removal system which shall consist of at least: a tray delivery section to deliver trays containing a number of IC sets; a panel delivery section to move panels containing a number of IC pins into and out of the area where the IC sets can be mounted and removed by compressing and repositioning the movable parts of each pin; a robot for moving the IC sets between the trays delivered by the tray delivery section and the panel delivery section; an mounting/removal head which includes a robotic gripping head to suction and hold the ICs and a detachable centering device held by the head and including a centering shoulder to center the ICs; a pin pusher integrated with the centering shoulder to press the movable part of one of the many pins of the panel; a centering device holder on top of which several centering devices of various sizes can be mounted; and a control section to control the robot. 2. An IC mounting/removal system as specified in Claim 1, where information about the type of IC is entered into the control panel so that a centralizer compatible with that IC is automatically selected, and the currently used centralizer is replaced with the selected centralizer. 3. IC mounting/removal system as specified in Claim 1, where the provided mounting plate is a base with mounting plate supports that hold two mounting plates and rotate 180 degrees in the horizontal plane. 4. An IC mounting/removal system as specified in claim 3, which includes a panel rail with several panel trays, each tray having protruding edges to prevent interference with the panel supports and the panels themselves during rotation of the panel supports. The panel rail on the panel trays holds a number of panels to be supplied when the panels are dispensed. 5. The IC mounting/removal system's head, which must include at least one robotically mounted head for suction and holding the IC, and a detachable centering device. This head, along with a pin pusher to compress the movable part of the IC pins during mounting and removing the IC, and a centering shoulder integrated with the pin pusher to center the IC. 6. The mounting/removing head of the IC mounting/removing system as specified in Claim 5, which includes a rotatable beam attached to the said head and a pull hook for securing the said centering device, and a pneumatic cylinder for rotating the beam to open and close the pull hook. 7. The mounting/removing head of the IC mounting/removing system as specified in Claim 5, where the surface of the wall of the centering shoulder is polished. 8. An IC mounting/removal system, which shall at least consist of: a tray delivery unit to dispense a tray holding a number of IC sets; a panel delivery unit to dispense a panel containing a number of IC pins; a robot to move the IC sets between the tray delivered in the tray delivery unit and the panel delivered in the panel delivery unit; a mounting/removal head supported by the robot, including a suction mechanism to grasp and hold the ICs; a defect detection sensor to detect defects on the IC pins of the panel and move them to their position using the suction mechanism, allowing it to adjust to the size of the IC pins; and a control unit to control the robot. 9. An IC mounting/removal system as specified in claim 8, where such mounting/removal head shall have a moving part supporting the fault identification sensor, a spring for pulling the moving part, and a locking mechanism to secure the movement of the moving part and the sensor positioning element within the robot's operating range. The sensor positioning element shall have a positioning surface to control the movement of the moving part, as the spring releases the moving part when the locking mechanism releases it. 10. An IC mounting/removal system as specified in claim 8, where such mounting/removal head shall have a pair of pin pushers, the separation between which of these pushers is adjustable to accommodate the size of the IC socket. The mounting/removal head shall be robotically movable to press the pushers against the movable part of the IC socket, and to mount and remove the IC into and out of the IC socket. A fault detection sensor shall be attached to one of the pushers. 11. IC mounting/removal system as specified in claim 8, where the moving part shall move in a straight line on the mounting/removal head.