SU979480A1 - Adhesive melt - Google Patents

Description

The laboratory reactor, heated to 120c, equipped with a jacket and an agitator, is sequentially charged to the components in the following order of a previously prepared mixture of paraffin with an olichomer, or as separate components; glycerin ester of rosin, heat stabilizer.

After the loaded components have completely melted, a copolymer of ethylene and vinyl acetate is introduced into the reactor and stirred until a homogeneous mass is obtained.

Table 1 shows examples of the melt-melt formulations.

Table 1

Ethylene copolymer with vinyl acetate (with a content of BA-27% and MRE / Hume PTR)

Glycerol ester .canfo

Hermos ta beat ator (tioalkofen IBE)

Paraffin OligoisopREN

Oligobutadiene isoprene with terminal hydroxy groups

Oligobuadienesoprene with terminal epoxy groups (% epoxy groups 2,3)

Propylene oxide based oligon ester with an epoxy content of 7.5 wt.%

Tetrahydrofuran-based oligon ester with a content of epoxy groups of b, 5 may.%

Physico-mechanical characteristics of hot melt adhesives, as well as glue

2.8

1.0

1.5

the melt of the prototype are given in table 2.

table 2

68

0.58 64 0.65

4 5

Continued table. 2

66 65

0.63 0.70

Claims (1)

Claim, Frost resistance is evaluated by maintaining the elasticity of the adhesive film with a thickness of 0.6 mm at. bending by 180 ° at 1 = -10 ° C, adhesive ability - by the force of tearing of one sheet from the model book block of a seam-free adhesive bond. The softening temperature is determined by the device Ring and ball. 25 As follows from Table 2, the introduction of a modified softener in the formulation of hot melt glue, which is a mixture of paraffin with a small amount (1-5%) of oligodienes 30 or simple oligoesters, in all the cases studied, gives the glue frost resistance. Along with the appearance of glue resistance to frost, the adhesive ability 35 increases and the softening temperature of the hot melt adhesive decreases. Reducing the softening temperature of hot melt glue by 6–7 ° C for 40 g. The ring and ball reduces the temperature of glue processing by 8–10 ° C. Using the invention allows to preserve the strength of books during storage and opening at a negative temperature, to reduce the temperature of the glue processing by lowering the softening temperature, which saves energy and facilitates the operating conditions of the machine for seamless bonding. The proposal is implemented by affordable means without increasing the complexity of the manufacture and use of hot melt adhesive. „ Hot melt adhesive containing a copolymer of ethylene with vinyl acetate, rosin glycerin ether, paraffin and a heat stabilizer, characterized in that, in order to impart frost resistance, reduce the softening temperature and increase the adhesive ability of the hot melt adhesive, it further comprises a compound selected from the group consisting of simple oligoester with terminal epoxide groups, oligoisoprene and oligobutadiene isoprene with terminal hydroxyl or Epoxy groups' in the following ratio of components, May.%: Ethylene vinyl acetate copolymer Rosin glycerin ester Thermostabilizer Paraffin A compound selected from the group consisting of oligoester with 35-60 20-40 0.1-0.5 12-30 terminal epoxy groups, oligoisoprene and oligobutadienieoprene with terminal hydroxyl or epoxy groups 1-5