SU924084A1 - Composition for pickling polyamide before metallization - Google Patents

Description

The invention relates to compositions of solutions used for pickling plastics before their metallization and can be used in the radio engineering, electronics industry, in mechanical engineering, in the production of consumer goods and other sectors ^{of the} national economy.

A known composition for the etching of plastics, in particular polyamide, before metallization, containing potassium dichromate in an amount of 100 g / l and sulfuric acid .1200 g / l [1). ¹⁰

Closest to the proposed is a composition for etching plastics including polyamide, before metallization, containing organic compounds, namely 0.1—

1% polyalkyleneimines, polyalkylene polyamines with a molecular weight of 500,000-8,000,000 and 0.056% of quaternary amine chlorides [2].

A disadvantage of the known compositions is the low surface quality of the polyamide after etching · (roughness corresponds to Grade 3), which with subsequent metallization leads to a decrease in the adhesion of the metal layer to the surface of the polyamide.

In addition, the quality of the surface treatment of polyamide worsens the rapid etching of its known compounds, and in the latter method, the etching process temperature is also high (225-275 ° C).

The purpose of the invention is to increase the adhesion of the metal layer to the surface of the polyamide by reducing the surface roughness.

This goal is achieved by using a composition containing organic compounds for etching the polyamide before its metallization, namely Ν-methylpyrrolidone, acetone, butyl esf and additionally calcium chloride in the following ratio of components in g / l:

Ν-methylpyrrolundone 250-300

Acetone 104-112

Calcium Chloride 200-230

Butyl alcohol Up to 1 liter.

At room temperature, the composition is prepared by mixing in the indicated sequence the components taken in the ratio: Ν-methylpyrrolidone 250-300 g / l, acetone 104-112 g / l, calcium chloride 200-230 g / l and butyl alcohol up to 1 l.

The resulting solution is used to treat the surface of the polyamide at 40 ° C for 5 minutes. After etching, the samples are washed with water, sensitized and activated. Next, the samples are washed with water, dried and subjected to chemical nickel plating. A layer of shiny copper, shiny nickel, is deposited on chemically precipitated nickel by the electrochemical method.

The etched surface corresponds to a <e — 7 roughness class (Na = '1.20— ^!

1.30 μm). When checking a metal coating for peeling strength does not occur.

With an increase in the solution of acetone above 112 g / l, Ν-methylpyrrolidone above 300 g / l and calcium chloride above 230 g / l

275 g / l, acetone 108 g / l, calcium chloride 215 g / l, butyl alcohol - the rest at 40 ° C for. 5 minutes.

Further processing is carried out according to example 5, measure 1.

Example 3. Polyamide samples are treated with a solution of the composition Ν-methylpyrrolidone, 300 g / l, acetone 112 g / l, calcium chloride 230 g / l, butyl alcohol - the rest with

40 ° C for 5 minutes

Further processing is carried out according to example 1.

Analysis and calculation of the obtained profilograms taken according to the results of surface treatment, 5 polyamide in the conditions of examples 1-3, shows that as a result of surface treatment of the samples with a solution of the proposed composition is achieved 6-7 roughness class (1.2-1.3 microns). When testing the strength, the adhesion leads to quick etching of the surface of the coating with the base, metonosti, which reduces the roughness class to ".4-5 and makes it impossible to apply a metal coating. With a decrease in the concentration of acetone in the solution below 104 g / l, Ν-methylpyrrolidone below 250 g / l and calcium chloride, below 200 g / l also leads to a decrease in the quality of the treated surface, as the roughness class decreases, and therefore decreases adhesion of the metal layer to the surface of the polyamide.

Butyl alcohol serves as an inert solvent to soften the action of this solution.

Example 1. The surface of the polyamide samples is treated with a solution of the composition: Ν-methylpyrrolidone 250 g / l, acetone 104 g / l, calcium chloride 200 g / l, butyl alcohol - the rest at 40 ° C for 5 minutes After etching, the samples are washed with water and sensitized in a solution of ЗпС1 ₂ 40 g / l, НС1 40 g / l at room temperature for 10-15 mil, then thoroughly washed with water. Activation is carried out in a solution of PHC1 ₂ 0.5 g / l, NS! 7 ml / l at 35 ° C for 5 minutes The samples are washed with distilled water, dried and subjected to chemical nickel plating from a solution of the composition: ΝΐΟΙ ₂ '6 Η ₂ Ο 10 g / l; C ₂ H ₄ (CO ₂ H) ₂ 8 g / l; 1 g / l; No.ON4g / l; No. Н ₂ РО ₄ 10 g / l at 40 ° С for 20 min.

A layer of shiny copper 50: and shiny nickel is applied to the chemically precipitated nickel by the electrochemical method.

. PRI me R 2. Samples of polyamide processed. They melt down with a solution of the composition: Ν-methylpyrrolidone house applying a grid of scratches every 1 mm, peeling was not detected. When reproducing the known method of high-quality surface treatment of polyamide could not be achieved.

Thus, the proposed method makes it possible to prepare the surface of the polyamide with such a degree of roughness, which in the future provides high adhesion of the metal layer to the base.

Claims (1)

Claim The composition for etching the polyamide before metallization, containing organic compounds, characterized in that, in order to increase the adhesion of the metal layer to the surface of the polyamide by reducing surface roughness, it contains Ν-methylpyrrolidone, acetone, butyl alcohol and additionally contains chloride calcium in the next; ratio of components, g / l: Ν-methylpyrrolidone 250-300 Acetone 104-112 Calcium Chloride 200-230 Butyl alcohol Up to 1 liter.