SU795783A1 - Method of preventing melt solder oxidation - Google Patents
Method of preventing melt solder oxidation Download PDFInfo
- Publication number
- SU795783A1 SU795783A1 SU782642680A SU2642680A SU795783A1 SU 795783 A1 SU795783 A1 SU 795783A1 SU 782642680 A SU782642680 A SU 782642680A SU 2642680 A SU2642680 A SU 2642680A SU 795783 A1 SU795783 A1 SU 795783A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- solder
- melt solder
- preventing melt
- solder oxidation
- oxidation
- Prior art date
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- Molten Solder (AREA)
Description
(54) СПОСОБ ПРЕДОХРАНЕНИЯ РАСПЛАВЛЕННОГО ПРИПОЯ(54) METHOD FOR PROTECTION OF A MOLTENED MEDIUM
ОТ ОКИСЛЕНИЯFROM OXIDATION
тонкую пленку из фосфорнокислого олова, надежно защищающую припой от окислени кислородом воздуха. Одновременно с этим в зоне верхний слой припо - воздух происходит восстановление фосфором металлов припо из окислов, образовавшихс до введени присадки. Отсутствие различных шлаков на поверхности расплавленного припо снижает количество непропаев. Защита расплавленного припо введением лигатуры олово-фосфор вл етс простым процессом в любых услови х производства и обеспечивает нормальное функционирование ванны с припоем в течение рабочей смены. Оптимальный вес таблетки присадки 5-8 г. Количество таблеток, вводимых в расплав за рабочую смену, зависит от веса припо ванны , площади зеркала расплавленного припо , процентного содержани фосфора в таблетке , температуры расплава и режима работы . Защитное действие пленки фосфорнокислого олова не прерываетс с охлаждением припо и восстанавливаетс сразу же после повторного разогрева ванны и достижени в ней рабочей температуры. Применение предлагаемой присадки (сплавов с содержанием фосфора) позвол ет в услови х производства снизить количество непропаев не менее, чем в два раза, а также значительно уменьшить количество случаев брака на операции лужени и пайки.tin phosphate thin film, reliably protecting the solder from oxidation by air oxygen. At the same time, in the zone the top layer of solder air is reduced by the phosphorus metal solder from oxides formed before the addition of the additive. The absence of various slags on the surface of the molten solder reduces the amount of non-solder. Protecting molten solder by introducing a tin-phosphorus ligature is a simple process in all production conditions and ensures the normal functioning of the solder bath during the work shift. The optimal weight of an additive tablet is 5-8 g. The number of tablets introduced into the melt per working shift depends on the weight of the solder bath, the surface area of the molten solder, the percentage of phosphorus in the tablet, the temperature of the melt and the mode of operation. The protective effect of the tin phosphate film is not interrupted by the cooling of the solder and is restored immediately after the bath is reheated and the operating temperature is reached. The use of the proposed additive (alloys with a phosphorus content) allows, in production conditions, to reduce the number of non-solders by no less than two times, and also significantly reduce the number of cases of rejects for tinning and soldering operations.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU782642680A SU795783A1 (en) | 1978-07-10 | 1978-07-10 | Method of preventing melt solder oxidation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU782642680A SU795783A1 (en) | 1978-07-10 | 1978-07-10 | Method of preventing melt solder oxidation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU795783A1 true SU795783A1 (en) | 1981-01-15 |
Family
ID=20776202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU782642680A SU795783A1 (en) | 1978-07-10 | 1978-07-10 | Method of preventing melt solder oxidation |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU795783A1 (en) |
-
1978
- 1978-07-10 SU SU782642680A patent/SU795783A1/en active
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