SU763431A1 - Glue - Google Patents

Description

The invention relates to the field of dicarboxylic acid curable epoxy adhesives used for bonding metals and plastics. BK-32-ZM adhesive is known, including epoxy resin, maleic anti-resin and curing accelerator (1. It is also known to use various polyesters with terminal acid groups 2 in epoxy compositions. The disadvantage of these compositions is low bonding strength, elevated curing temperature and low viability. The closest to the technical essence and the resulting positive effect is D-2 glue, including epoxy resin, maleic anhydride, dimethylaniline and filler. D-2 glue It is used to glue metals and other materials.It satisfactorily inhibits the effects of variable temperatures from –60 to -HOOC, is resistant to various electrolytes, is easily applied to the surfaces to be glued and cures at moderate temperatures 3. However, D-2 glue has limited viability (to 4-6 days.), Cures for 10 hours or more (120 ° C) and ensures insufficient bonding strength of steel: 220-230 kgf / cm (according to GOST 14759-69 with an overlap length of 15 mm). The aim of the invention is to increase the viability, the bonding strength and reduce the cure time. The goal is achieved by the fact that glue, including epoxy resin, acid hardener and target additives, contains polyxycilane maleate as acid hardener in the following ratio, wt.%: Epoxy resin 33.0-45.0 Polyxylnthane maleate 33.0-54.0 Targeted additives , 1.0-34.0. As epoxy resins, for example, well-known epoxy resins are used: products of the interaction of diphenylolpropane with epichlorohydrin — resins of the types ED-20 and

J7 () 34314

ED-16, resorcinol and epichlorohydrim SmiliP (); 1x11lig; im; loyin; g (flKM) get conglome packaged as UH-635, vn-637, as well as a mixture of well-developed sys- xylitol resins, for example, with known diluents - (1 mol) with milioic anhydride (1.5 mol) unsaturated resins (diallyl phthalate). It has the following chemical structure:

About i

BUT-S-YN-CH-S-o

(in 2-o-cJ - (jH-dH- (i

Claims (3)

where isP 2-3. Characteristics of poly (xylene maleate) acid number 300-303 mg / KOH / g; The saponification number is 655-657 mg KOH / g; the content of hydroxyl groups 13-14%. Molecular weight 320-350 (by cryoscopic method). The temperature of the drop drop according to Ubbellode is 84-85 ° C. The following additives can be used as target additives: for example, cement, silica flour, aerosil, and solvents or diluents ethyl alcohol, acetone, dioxane, diallyl phthalate, and also resins, for example polyvinyl butyral. Below are the techniques of glue production and gluing. Example 1. Liquid glue is prepared by mixing epoxy resin, diallyl phthalate, polyvinyl butyral, and polyxylethanine maleate (PCM) with heating to 40-50 ° C and stirring for 5-15 minutes until a homogeneous, viscous mass of light brown color is obtained. Then the glue is cooled to mnatny temperature. Adhesive is applied to the surfaces to be bonded with a spatula. Curing mode: temperature, time 4-6 hours, pressure 0.3-0.5 kg / cm. Example 2. Liquid low viscosity (40-50 seconds according to VZ-4) glue is obtained by dissolving PCM and epoxy resin in dioxane with a new solution (10%) of polyvinyl butyral. Glue can be laid out with a brush, payback, spray. The air drying time is 8–24 hours before scattering, depending on the level of KJH.H. Quartz flour can be added to improve the adhesive and give it the necessary viscosity. Curing mode: temperature 125 ± 5 ° С, time 4-6 h, pressure 1.0-1.5 kg / cm. Example 3. An adhesive is obtained in the form of a film and cured according to the method of Example 2, wherein the adhesive is dried under conventional conditions for 24 hours on release paper. Then the film adhesive is separated from the paper and used for gluing. The amount of polyvinyl butyral in the adhesive film is 25.0-34.0 wt.%. The thickness of the adhesive film is 0.002 cm. The table shows the data of comparative tests of the proposed and known adhesives. As follows from the table, the proposed adhesive ensures the viability and adhesion strength at reduced 1 {oh duration of the curing process. The adhesive can be used to attach the metal electronic control units to the frame of the cutting machine during the manufacturing process of machine tools with programmed control. The pre-glue can also be used to glue various grades of plastics, glass, and ceramics. 976343 Claim of the invention Glue comprising an epoxy resin, an acid hardener and targeted additives, characterized in that, in order to increase viability, durability with glue-j vanilla and reduce the duration of curing, contains as an acid hardener polyxytitanium maleate in the following ratio of components, wt.% : Epoxy resin33-45 Polyxylitane maleinate33-54 Target additives1-34 110 Sources of information taken into account during the examination, 1Gog., .., „nA fI- D. Kardashov, Synthetic adhesives, j Chemistry 1976 with 135- 138 - Patent C A N 3242142 cl. 260-784 published 1966. 3. Kardashov D. A. Epoxy Adhesives, M., Himi, 1973, p. 103-105 (prototype).