SU714666A1 - Contact device - Google Patents

Description

(54) CONTACT DEVICE

I

The invention relates to radio engineering and can be used to control multilayer printed circuit boards (WFP) with pads for multi-pin elements (chips).

Contact devices are known that contain a base in the form of a magnetic plate with a deposited grid on the side of contact elements, which are made movable relative to each other and electrically mutually insulated, fixed by dielectric holders and holding plates made of a magnet material 1 to the plate.

The universality of the device is achieved by the fact that the necessary number of contact elements are installed on the base coordinate grid in accordance with the location of the control points on the printed circuit board.

The disadvantage of the device is the performance of the setting of the contact field.

A contact device is known that has a higher performance setting of the contact field and allows.

0

reduce the number of contact elemeyta, which is made in the form of Separate modules ("sections), spaced in guides with the possibility of a horizontal 1; displacement of each module, and the contact elements are placed in the modules with the possibility of their axial movement 2.

However, in this contact device, it is not possible to relocate contact modules in two directions of the coordinate grid and replace individual modules on the contact field with modules with contact elements under multi-output elements of various types. The method of fixing the exposed modules with strips using screws, as well as the method of combining the contact elements of the modules with the control points of the board under test are not convenient and inefficient.

Claims (2)

The purpose of the invention is to increase the productivity of the control. For this purpose, a contact device, mainly for controlling printed circuit boards, comprising a base with fixed guides, movable contact modules with spring-loaded contacts connected by a measuring unit, and fixing elements are provided fixed to the fixed guides by means of spring-loaded fixing elements movable guides, on which placed contact modules. FIG. 1 schematically shows a contact device; in fig. 2 - contact module, section A - A; in fig. 3 - the same, section B - B; in fig. 4 - view A of the module on the guide with coordinate risks; n and fig. 5 - the fixing mechanism of the movable guide. The contact device consists of a base 1 with rigidly fixed fixed guides 2, on which movable guides 3 are located, with movable contact modules 4, intended for group contacting with pads for multi-output elements of a printed circuit board. Each contact module 4 is a replaceable self-contained contact assembly containing a dielectric base 5 with holes in which the contact elements 6 are placed. The base 5 placed in a metal case 7 is fastened with a screw 8 to a stop 9 that prevents the contact module from falling out from the guides 3. The contact elements 6 of the module are connected via a harness 10 to the measuring unit through the connector 11. The contact module is fixed using two spring-loaded captive balls 12, The depressions 13 located on the guides 3, discretely located with the grid coordinate spacing, are combined. The contact elements of the module are aligned with the control points of the board in the corresponding direction of the coordinate grid according to the risks 14, applied with the grid spacing on one of the guides 3. with target mark 5 on the module case. The combination of the contact elements of the module group with the control points of the board in the other direction of the grid is performed by risks 16, applied with the same pitch iia by one of the guides 2. Fixing the movable guide with the contact modules is carried out using spring-loaded SKID 17, by zapadena in the holes made on the guides 2 with the grid step. The stops 18 provide installation of a controlled board in the contact field. Before starting the control of a multilayer printed circuit board (WFP), the device is configured, i.e. the guides 3 install the necessary contact modules 4 which, moving, are arranged according to the topology of the board pattern by aligning the sighting marks 15 on the modules with the risks 14 corresponding coordinates in this direction. The modules installed at the required positions are fixed by spring-loaded balls 12. Then, guides 3 are installed according to risks 16 in the other direction of the grid and fixed by spring-loaded rods. After that, the tested MPP is installed on the contact field against the stops 18 and is inspected. The use of a contact device built on a modular principle allows the company to rebuild the contact field for various types of MPP, which is very important for small-scale production. Claims of the invention A contact device, preferably for controlling printed circuit boards, comprising a base with fixed guides, movable contact modules with spring-loaded contacts connected to the measuring unit, and fixing elements, characterized in that, in order to increase the performance of the control, it is fitted with fixed on guides by means of spring-loaded fixing elements with movable guides on which contact modules are placed. Information sources; taken into account during the examination 1. USSR author's certificate No. 456384, cl. H 05 K 1/04, 1972. 2. USSR author's certificate number 457193, cl. H 05 K 1/04, 1973 (prototype). A - A swung 1 . FIG. 2 -2 sixteen /. FIG. one 6-B / 2 Fig.d 15. H i T 1 55 7 8 9 iO 11 i2 15 /four "0v